The global market for GaN Bare-die was valued at US$ 31 million in the year 2024 and is projected to reach a revised size of US$ 88.5 million by 2031, growing at a CAGR of 16.4% during the forecast period.
Gallium nitride (GaN) transistors offer fundamental advantages over silicon. In particular, the higher critical electrical field makes it very attractive for power semiconductor devices with outstanding specific dynamic on-state resistance and smaller capacitances compared to silicon MOSFETs, which makes GaN HEMTs great for high speed switching applications. Gallium nitride transistors can then be operated with reduced dead-times which results in higher efficiency and enables passive cooling. Operation at high switching frequencies allows the volume of passive components to shrink which improves GaN HEMTs reliability and overall power density.
From the overall development of gallium nitride (GaN), currently GaN RF devices are currently in a dominant position, accounting for about 85% of the market share, while GaN power devices currently account for the remaining 15%. GaN power devices have grown rapidly in recent years, and a large number of companies have gradually entered the industry. It is expected that GaN power devices market share will further increase in the next few years. At present, GaN RF devices are mainly dominated by several companies such as Sumitomo Electric Device Innovations (SEDI), Wolfspeed, Qorvo and NXP; while GaN power devices are dominated by Power Integrations, Inc., Navitas Semiconductor, GaN Systems, Efficient Power Conversion Corporation (EPC), Innoscience, Transphorm Inc. and Infineon, among which Innoscience is the world's largest GaN power device manufacturer.
Report Scope
This report aims to provide a comprehensive presentation of the global market for GaN Bare-die, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding GaN Bare-die.
The GaN Bare-die market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global GaN Bare-die market comprehensively. Regional market sizes, concerning products by Technology, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the GaN Bare-die manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Technology, by Application, and by regions.
麻豆原创 Segmentation
By Company
Wolfspeed
Wavepia
Macom
EPC
Infineon (GaN Systems)
UMS RF
STMicroelectronics
Microchip
NewSemi Technology
WAVICE
GanPower
AMCOM
GeneSiC (Navitas Semiconductor)
Nexperia
Guerrilla RF
GeJing Semiconductor
by Technology
GaN-on-SiC
GaN-on-Si
by Application
RF GaN Devices
Power GaN Devices
Production by Region
North America
Europe
China
Japan
South Korea
China Taiwan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Technology, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of GaN Bare-die manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of GaN Bare-die by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of GaN Bare-die in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Technology, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 GaN Bare-die 麻豆原创 Overview
1.1 Product Definition
1.2 GaN Bare-die by Technology
1.2.1 Global GaN Bare-die 麻豆原创 Value Growth Rate Analysis by Technology: 2024 VS 2031
1.2.2 GaN-on-SiC
1.2.3 GaN-on-Si
1.3 GaN Bare-die by Application
1.3.1 Global GaN Bare-die 麻豆原创 Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 RF GaN Devices
1.3.3 Power GaN Devices
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global GaN Bare-die Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global GaN Bare-die Production Estimates and Forecasts (2020-2031)
1.4.4 Global GaN Bare-die 麻豆原创 Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global GaN Bare-die Production 麻豆原创 Share by Manufacturers (2020-2025)
2.2 Global GaN Bare-die Production Value 麻豆原创 Share by Manufacturers (2020-2025)
2.3 Global Key Players of GaN Bare-die, Industry Ranking, 2023 VS 2024
2.4 Global GaN Bare-die 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global GaN Bare-die Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of GaN Bare-die, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of GaN Bare-die, Product Offered and Application
2.8 Global Key Manufacturers of GaN Bare-die, Date of Enter into This Industry
2.9 GaN Bare-die 麻豆原创 Competitive Situation and Trends
2.9.1 GaN Bare-die 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest GaN Bare-die Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 GaN Bare-die Production by Region
3.1 Global GaN Bare-die Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global GaN Bare-die Production Value by Region (2020-2031)
3.2.1 Global GaN Bare-die Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of GaN Bare-die by Region (2026-2031)
3.3 Global GaN Bare-die Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global GaN Bare-die Production Volume by Region (2020-2031)
3.4.1 Global GaN Bare-die Production by Region (2020-2025)
3.4.2 Global Forecasted Production of GaN Bare-die by Region (2026-2031)
3.5 Global GaN Bare-die 麻豆原创 Price Analysis by Region (2020-2025)
3.6 Global GaN Bare-die Production and Value, Year-over-Year Growth
3.6.1 North America GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
3.6.3 China GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
3.6.6 China Taiwan GaN Bare-die Production Value Estimates and Forecasts (2020-2031)
4 GaN Bare-die Consumption by Region
4.1 Global GaN Bare-die Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global GaN Bare-die Consumption by Region (2020-2031)
4.2.1 Global GaN Bare-die Consumption by Region (2020-2025)
4.2.2 Global GaN Bare-die Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America GaN Bare-die Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America GaN Bare-die Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe GaN Bare-die Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe GaN Bare-die Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific GaN Bare-die Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific GaN Bare-die Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa GaN Bare-die Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa GaN Bare-die Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Technology
5.1 Global GaN Bare-die Production by Technology (2020-2031)
5.1.1 Global GaN Bare-die Production by Technology (2020-2025)
5.1.2 Global GaN Bare-die Production by Technology (2026-2031)
5.1.3 Global GaN Bare-die Production 麻豆原创 Share by Technology (2020-2031)
5.2 Global GaN Bare-die Production Value by Technology (2020-2031)
5.2.1 Global GaN Bare-die Production Value by Technology (2020-2025)
5.2.2 Global GaN Bare-die Production Value by Technology (2026-2031)
5.2.3 Global GaN Bare-die Production Value 麻豆原创 Share by Technology (2020-2031)
5.3 Global GaN Bare-die Price by Technology (2020-2031)
6 Segment by Application
6.1 Global GaN Bare-die Production by Application (2020-2031)
6.1.1 Global GaN Bare-die Production by Application (2020-2025)
6.1.2 Global GaN Bare-die Production by Application (2026-2031)
6.1.3 Global GaN Bare-die Production 麻豆原创 Share by Application (2020-2031)
6.2 Global GaN Bare-die Production Value by Application (2020-2031)
6.2.1 Global GaN Bare-die Production Value by Application (2020-2025)
6.2.2 Global GaN Bare-die Production Value by Application (2026-2031)
6.2.3 Global GaN Bare-die Production Value 麻豆原创 Share by Application (2020-2031)
6.3 Global GaN Bare-die Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Wolfspeed
7.1.1 Wolfspeed GaN Bare-die Company Information
7.1.2 Wolfspeed GaN Bare-die Product Portfolio
7.1.3 Wolfspeed GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Wolfspeed Main Business and 麻豆原创s Served
7.1.5 Wolfspeed Recent Developments/Updates
7.2 Wavepia
7.2.1 Wavepia GaN Bare-die Company Information
7.2.2 Wavepia GaN Bare-die Product Portfolio
7.2.3 Wavepia GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Wavepia Main Business and 麻豆原创s Served
7.2.5 Wavepia Recent Developments/Updates
7.3 Macom
7.3.1 Macom GaN Bare-die Company Information
7.3.2 Macom GaN Bare-die Product Portfolio
7.3.3 Macom GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Macom Main Business and 麻豆原创s Served
7.3.5 Macom Recent Developments/Updates
7.4 EPC
7.4.1 EPC GaN Bare-die Company Information
7.4.2 EPC GaN Bare-die Product Portfolio
7.4.3 EPC GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.4.4 EPC Main Business and 麻豆原创s Served
7.4.5 EPC Recent Developments/Updates
7.5 Infineon (GaN Systems)
7.5.1 Infineon (GaN Systems) GaN Bare-die Company Information
7.5.2 Infineon (GaN Systems) GaN Bare-die Product Portfolio
7.5.3 Infineon (GaN Systems) GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Infineon (GaN Systems) Main Business and 麻豆原创s Served
7.5.5 Infineon (GaN Systems) Recent Developments/Updates
7.6 UMS RF
7.6.1 UMS RF GaN Bare-die Company Information
7.6.2 UMS RF GaN Bare-die Product Portfolio
7.6.3 UMS RF GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.6.4 UMS RF Main Business and 麻豆原创s Served
7.6.5 UMS RF Recent Developments/Updates
7.7 STMicroelectronics
7.7.1 STMicroelectronics GaN Bare-die Company Information
7.7.2 STMicroelectronics GaN Bare-die Product Portfolio
7.7.3 STMicroelectronics GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.7.4 STMicroelectronics Main Business and 麻豆原创s Served
7.7.5 STMicroelectronics Recent Developments/Updates
7.8 Microchip
7.8.1 Microchip GaN Bare-die Company Information
7.8.2 Microchip GaN Bare-die Product Portfolio
7.8.3 Microchip GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Microchip Main Business and 麻豆原创s Served
7.8.5 Microchip Recent Developments/Updates
7.9 NewSemi Technology
7.9.1 NewSemi Technology GaN Bare-die Company Information
7.9.2 NewSemi Technology GaN Bare-die Product Portfolio
7.9.3 NewSemi Technology GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.9.4 NewSemi Technology Main Business and 麻豆原创s Served
7.9.5 NewSemi Technology Recent Developments/Updates
7.10 WAVICE
7.10.1 WAVICE GaN Bare-die Company Information
7.10.2 WAVICE GaN Bare-die Product Portfolio
7.10.3 WAVICE GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.10.4 WAVICE Main Business and 麻豆原创s Served
7.10.5 WAVICE Recent Developments/Updates
7.11 GanPower
7.11.1 GanPower GaN Bare-die Company Information
7.11.2 GanPower GaN Bare-die Product Portfolio
7.11.3 GanPower GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.11.4 GanPower Main Business and 麻豆原创s Served
7.11.5 GanPower Recent Developments/Updates
7.12 AMCOM
7.12.1 AMCOM GaN Bare-die Company Information
7.12.2 AMCOM GaN Bare-die Product Portfolio
7.12.3 AMCOM GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.12.4 AMCOM Main Business and 麻豆原创s Served
7.12.5 AMCOM Recent Developments/Updates
7.13 GeneSiC (Navitas Semiconductor)
7.13.1 GeneSiC (Navitas Semiconductor) GaN Bare-die Company Information
7.13.2 GeneSiC (Navitas Semiconductor) GaN Bare-die Product Portfolio
7.13.3 GeneSiC (Navitas Semiconductor) GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.13.4 GeneSiC (Navitas Semiconductor) Main Business and 麻豆原创s Served
7.13.5 GeneSiC (Navitas Semiconductor) Recent Developments/Updates
7.14 Nexperia
7.14.1 Nexperia GaN Bare-die Company Information
7.14.2 Nexperia GaN Bare-die Product Portfolio
7.14.3 Nexperia GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.14.4 Nexperia Main Business and 麻豆原创s Served
7.14.5 Nexperia Recent Developments/Updates
7.15 Guerrilla RF
7.15.1 Guerrilla RF GaN Bare-die Company Information
7.15.2 Guerrilla RF GaN Bare-die Product Portfolio
7.15.3 Guerrilla RF GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Guerrilla RF Main Business and 麻豆原创s Served
7.15.5 Guerrilla RF Recent Developments/Updates
7.16 GeJing Semiconductor
7.16.1 GeJing Semiconductor GaN Bare-die Company Information
7.16.2 GeJing Semiconductor GaN Bare-die Product Portfolio
7.16.3 GeJing Semiconductor GaN Bare-die Production, Value, Price and Gross Margin (2020-2025)
7.16.4 GeJing Semiconductor Main Business and 麻豆原创s Served
7.16.5 GeJing Semiconductor Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 GaN Bare-die Industry Chain Analysis
8.2 GaN Bare-die Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 GaN Bare-die Production Mode & Process Analysis
8.4 GaN Bare-die Sales and 麻豆原创ing
8.4.1 GaN Bare-die Sales Channels
8.4.2 GaN Bare-die Distributors
8.5 GaN Bare-die Customer Analysis
9 GaN Bare-die 麻豆原创 Dynamics
9.1 GaN Bare-die Industry Trends
9.2 GaN Bare-die 麻豆原创 Drivers
9.3 GaN Bare-die 麻豆原创 Challenges
9.4 GaN Bare-die 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Wolfspeed
Wavepia
Macom
EPC
Infineon (GaN Systems)
UMS RF
STMicroelectronics
Microchip
NewSemi Technology
WAVICE
GanPower
AMCOM
GeneSiC (Navitas Semiconductor)
Nexperia
Guerrilla RF
GeJing Semiconductor
听
听
*If Applicable.
