Global Flip Chip Bonder Sales 麻豆原创 Report 2023

Publication ID:

PB501232061

Publication Date:

January 2, 2023

Pages:

121

Publisher:

MRRPB5

Countries:

Global [1]

USD 4,000.00

Manufacturers [2]

Machinery [3]

Industry & Manufacturing [4]

Description:

Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
麻豆原创 Analysis and Insights: Global Flip Chip Bonder 麻豆原创
Due to the COVID-19 pandemic, the global Flip Chip Bonder market size is estimated to be worth US$ 290 million in 2022 and is forecast to a readjusted size of US$ 315.6 million by 2029 with a CAGR of 1.2% during the forecast period 2023-2029. Fully considering the economic change by this health crisis, Fully Automatic accounting for % of the Flip Chip Bonder global market in 2022, is projected to value US$ million by 2029, growing at a revised % CAGR from 2023 to 2029. While IDMs segment is altered to an % CAGR throughout this forecast period.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Global Flip Chip Bonder Scope and 麻豆原创 Size
The global Flip Chip Bonder market is segmented by company, region (country), type and application. Players, stakeholders, and other participants in the global Flip Chip Bonder market will be able to gain the upper hand as they use the report as a powerful resource. The segmental analysis focuses on sales, revenue and forecast by region (country), type and application for the period 2018-2029.
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
IDMs
OSAT
By Region
United States
Europe
China
Japan
Southeast Asia
India
Other Regions
By Company
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Flip Chip Bonder 麻豆原创 Overview
1.1 Flip Chip Bonder Product Scope
1.2 Flip Chip Bonder Segment by Type
1.2.1 Global Flip Chip Bonder Sales by Type (2018 & 2022 & 2029)
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Flip Chip Bonder Segment by Application
1.3.1 Global Flip Chip Bonder Sales Comparison by Application (2018 & 2022 & 2029)
1.3.2 IDMs
1.3.3 OSAT
1.4 Flip Chip Bonder 麻豆原创 Estimates and Forecasts (2018-2029)
1.4.1 Global Flip Chip Bonder 麻豆原创 Size in Value Growth Rate (2018-2029)
1.4.2 Global Flip Chip Bonder 麻豆原创 Size in Volume Growth Rate (2018-2029)
1.4.3 Global Flip Chip Bonder Price Trends (2018-2029)
2 Flip Chip Bonder Estimates and Forecasts by Region
2.1 Global Flip Chip Bonder 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2 Global Flip Chip Bonder Retrospective 麻豆原创 Scenario by Region (2018-2023)
2.2.1 Global Flip Chip Bonder Sales 麻豆原创 Share by Region (2018-2023)
2.2.2 Global Flip Chip Bonder Revenue 麻豆原创 Share by Region (2018-2023)
2.3 Global Flip Chip Bonder 麻豆原创 Estimates and Forecasts by Region (2024-2029)
2.3.1 Global Flip Chip Bonder Sales Estimates and Forecasts by Region (2024-2029)
2.3.2 Global Flip Chip Bonder Revenue Forecast by Region (2024-2029)
2.4 Geographic 麻豆原创 Analysis: 麻豆原创 Facts & Figures
2.4.1 United States Flip Chip Bonder Estimates and Projections (2018-2029)
2.4.2 Europe Flip Chip Bonder Estimates and Projections (2018-2029)
2.4.3 China Flip Chip Bonder Estimates and Projections (2018-2029)
2.4.4 Japan Flip Chip Bonder Estimates and Projections (2018-2029)
2.4.5 Southeast Asia Flip Chip Bonder Estimates and Projections (2018-2029)
2.4.6 India Flip Chip Bonder Estimates and Projections (2018-2029)
3 Global Flip Chip Bonder Competition Landscape by Players
3.1 Global Top Flip Chip Bonder Players by Sales (2018-2023)
3.2 Global Top Flip Chip Bonder Players by Revenue (2018-2023)
3.3 Global Flip Chip Bonder 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip Chip Bonder as of 2022)
3.4 Global Flip Chip Bonder Average Price by Company (2018-2023)
3.5 Manufacturers Flip Chip Bonder Manufacturing Sites, Area Served, Product Type
3.6 Manufacturers Mergers & Acquisitions, Expansion Plans
4 Global Flip Chip Bonder 麻豆原创 Size by Type
4.1 Global Flip Chip Bonder Historic 麻豆原创 Review by Type (2018-2023)
4.1.1 Global Flip Chip Bonder Sales by Type (2018-2023)
4.1.2 Global Flip Chip Bonder Revenue by Type (2018-2023)
4.1.3 Global Flip Chip Bonder Price by Type (2018-2023)
4.2 Global Flip Chip Bonder 麻豆原创 Estimates and Forecasts by Type (2024-2029)
4.2.1 Global Flip Chip Bonder Sales Forecast by Type (2024-2029)
4.2.2 Global Flip Chip Bonder Revenue Forecast by Type (2024-2029)
4.2.3 Global Flip Chip Bonder Price Forecast by Type (2024-2029)
5 Global Flip Chip Bonder 麻豆原创 Size by Application
5.1 Global Flip Chip Bonder Historic 麻豆原创 Review by Application (2018-2023)
5.1.1 Global Flip Chip Bonder Sales by Application (2018-2023)
5.1.2 Global Flip Chip Bonder Revenue by Application (2018-2023)
5.1.3 Global Flip Chip Bonder Price by Application (2018-2023)
5.2 Global Flip Chip Bonder 麻豆原创 Estimates and Forecasts by Application (2024-2029)
5.2.1 Global Flip Chip Bonder Sales Forecast by Application (2024-2029)
5.2.2 Global Flip Chip Bonder Revenue Forecast by Application (2024-2029)
5.2.3 Global Flip Chip Bonder Price Forecast by Application (2024-2029)
6 United States Flip Chip Bonder 麻豆原创 Facts & Figures
6.1 United States Flip Chip Bonder Sales by Company
6.1.1 United States Flip Chip Bonder Sales by Company (2018-2023)
6.1.2 United States Flip Chip Bonder Revenue by Company (2018-2023)
6.2 United States Flip Chip Bonder Sales Breakdown by Type
6.2.1 United States Flip Chip Bonder Sales Breakdown by Type (2018-2023)
6.2.2 United States Flip Chip Bonder Sales Breakdown by Type (2024-2029)
6.3 United States Flip Chip Bonder Sales Breakdown by Application
6.3.1 United States Flip Chip Bonder Sales Breakdown by Application (2018-2023)
6.3.2 United States Flip Chip Bonder Sales Breakdown by Application (2024-2029)
7 Europe Flip Chip Bonder 麻豆原创 Facts & Figures
7.1 Europe Flip Chip Bonder Sales by Company
7.1.1 Europe Flip Chip Bonder Sales by Company (2018-2023)
7.1.2 Europe Flip Chip Bonder Revenue by Company (2018-2023)
7.2 Europe Flip Chip Bonder Sales Breakdown by Type
7.2.1 Europe Flip Chip Bonder Sales Breakdown by Type (2018-2023)
7.2.2 Europe Flip Chip Bonder Sales Breakdown by Type (2024-2029)
7.3 Europe Flip Chip Bonder Sales Breakdown by Application
7.3.1 Europe Flip Chip Bonder Sales Breakdown by Application (2018-2023)
7.3.2 Europe Flip Chip Bonder Sales Breakdown by Application (2024-2029)
8 China Flip Chip Bonder 麻豆原创 Facts & Figures
8.1 China Flip Chip Bonder Sales by Company
8.1.1 China Flip Chip Bonder Sales by Company (2018-2023)
8.1.2 China Flip Chip Bonder Revenue by Company (2018-2023)
8.2 China Flip Chip Bonder Sales Breakdown by Type
8.2.1 China Flip Chip Bonder Sales Breakdown by Type (2018-2023)
8.2.2 China Flip Chip Bonder Sales Breakdown by Type (2024-2029)
8.3 China Flip Chip Bonder Sales Breakdown by Application
8.3.1 China Flip Chip Bonder Sales Breakdown by Application (2018-2023)
8.3.2 China Flip Chip Bonder Sales Breakdown by Application (2024-2029)
9 Japan Flip Chip Bonder 麻豆原创 Facts & Figures
9.1 Japan Flip Chip Bonder Sales by Company
9.1.1 Japan Flip Chip Bonder Sales by Company (2018-2023)
9.1.2 Japan Flip Chip Bonder Revenue by Company (2018-2023)
9.2 Japan Flip Chip Bonder Sales Breakdown by Type
9.2.1 Japan Flip Chip Bonder Sales Breakdown by Type (2018-2023)
9.2.2 Japan Flip Chip Bonder Sales Breakdown by Type (2024-2029)
9.3 Japan Flip Chip Bonder Sales Breakdown by Application
9.3.1 Japan Flip Chip Bonder Sales Breakdown by Application (2018-2023)
9.3.2 Japan Flip Chip Bonder Sales Breakdown by Application (2024-2029)
10 Southeast Asia Flip Chip Bonder 麻豆原创 Facts & Figures
10.1 Southeast Asia Flip Chip Bonder Sales by Company
10.1.1 Southeast Asia Flip Chip Bonder Sales by Company (2018-2023)
10.1.2 Southeast Asia Flip Chip Bonder Revenue by Company (2018-2023)
10.2 Southeast Asia Flip Chip Bonder Sales Breakdown by Type
10.2.1 Southeast Asia Flip Chip Bonder Sales Breakdown by Type (2018-2023)
10.2.2 Southeast Asia Flip Chip Bonder Sales Breakdown by Type (2024-2029)
10.3 Southeast Asia Flip Chip Bonder Sales Breakdown by Application
10.3.1 Southeast Asia Flip Chip Bonder Sales Breakdown by Application (2018-2023)
10.3.2 Southeast Asia Flip Chip Bonder Sales Breakdown by Application (2024-2029)
11 India Flip Chip Bonder 麻豆原创 Facts & Figures
11.1 India Flip Chip Bonder Sales by Company
11.1.1 India Flip Chip Bonder Sales by Company (2018-2023)
11.1.2 India Flip Chip Bonder Revenue by Company (2018-2023)
11.2 India Flip Chip Bonder Sales Breakdown by Type
11.2.1 India Flip Chip Bonder Sales Breakdown by Type (2018-2023)
11.2.2 India Flip Chip Bonder Sales Breakdown by Type (2024-2029)
11.3 India Flip Chip Bonder Sales Breakdown by Application
11.3.1 India Flip Chip Bonder Sales Breakdown by Application (2018-2023)
11.3.2 India Flip Chip Bonder Sales Breakdown by Application (2024-2029)
12 Company Profiles and Key Figures in Flip Chip Bonder Business
12.1 BESI
12.1.1 BESI Corporation Information
12.1.2 BESI Business Overview
12.1.3 BESI Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.1.4 BESI Flip Chip Bonder Products Offered
12.1.5 BESI Recent Development
12.2 ASMPT
12.2.1 ASMPT Corporation Information
12.2.2 ASMPT Business Overview
12.2.3 ASMPT Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.2.4 ASMPT Flip Chip Bonder Products Offered
12.2.5 ASMPT Recent Development
12.3 Shibaura
12.3.1 Shibaura Corporation Information
12.3.2 Shibaura Business Overview
12.3.3 Shibaura Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.3.4 Shibaura Flip Chip Bonder Products Offered
12.3.5 Shibaura Recent Development
12.4 Muehlbauer
12.4.1 Muehlbauer Corporation Information
12.4.2 Muehlbauer Business Overview
12.4.3 Muehlbauer Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.4.4 Muehlbauer Flip Chip Bonder Products Offered
12.4.5 Muehlbauer Recent Development
12.5 K&S
12.5.1 K&S Corporation Information
12.5.2 K&S Business Overview
12.5.3 K&S Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.5.4 K&S Flip Chip Bonder Products Offered
12.5.5 K&S Recent Development
12.6 Hamni
12.6.1 Hamni Corporation Information
12.6.2 Hamni Business Overview
12.6.3 Hamni Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.6.4 Hamni Flip Chip Bonder Products Offered
12.6.5 Hamni Recent Development
12.7 AMICRA Microtechnologies
12.7.1 AMICRA Microtechnologies Corporation Information
12.7.2 AMICRA Microtechnologies Business Overview
12.7.3 AMICRA Microtechnologies Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.7.4 AMICRA Microtechnologies Flip Chip Bonder Products Offered
12.7.5 AMICRA Microtechnologies Recent Development
12.8 SET
12.8.1 SET Corporation Information
12.8.2 SET Business Overview
12.8.3 SET Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.8.4 SET Flip Chip Bonder Products Offered
12.8.5 SET Recent Development
12.9 Athlete FA
12.9.1 Athlete FA Corporation Information
12.9.2 Athlete FA Business Overview
12.9.3 Athlete FA Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
12.9.4 Athlete FA Flip Chip Bonder Products Offered
12.9.5 Athlete FA Recent Development
13 Flip Chip Bonder Manufacturing Cost Analysis
13.1 Flip Chip Bonder Key Raw Materials Analysis
13.1.1 Key Raw Materials
13.1.2 Key Raw Materials Price Trend
13.1.3 Key Suppliers of Raw Materials
13.2 Proportion of Manufacturing Cost Structure
13.3 Manufacturing Process Analysis of Flip Chip Bonder
13.4 Flip Chip Bonder Industrial Chain Analysis
14 麻豆原创ing Channel, Distributors and Customers
14.1 麻豆原创ing Channel
14.2 Flip Chip Bonder Distributors List
14.3 Flip Chip Bonder Customers
15 麻豆原创 Dynamics
15.1 Flip Chip Bonder Industry Trends
15.2 Flip Chip Bonder 麻豆原创 Drivers
15.3 Flip Chip Bonder 麻豆原创 Challenges
15.4 Flip Chip Bonder 麻豆原创 Restraints
16 Research Findings and Conclusion
17 Appendix
17.1 Research Methodology
17.1.1 Methodology/Research Approach
17.1.2 Data Source
17.2 Author List
17.3 Disclaimer

Companies Mentioned:

BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA

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