Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
The global Flip Chip Bonder market is projected to grow from US$ 293.8 million in 2024 to US$ 315.6 million by 2030, at a Compound Annual Growth Rate (CAGR) of 1.2% during the forecast period.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
In terms of production side, this report researches the Flip Chip Bonder production, growth rate, market share by manufacturers and by region (region level and country level), from 2019 to 2024, and forecast to 2030.
In terms of consumption side, this report focuses on the sales of Flip Chip Bonder by region (region level and country level), by company, by Type and by Application. from 2019 to 2024 and forecast to 2030.
Report Covers:
This report presents an overview of global market for Flip Chip Bonder, capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2019 - 2024, estimates for 2024, and projections of CAGR through 2030.
This report researches the key producers of Flip Chip Bonder, also provides the consumption of main regions and countries. Highlights of the upcoming market potential for Flip Chip Bonder, and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the Flip Chip Bonder sales, revenue, market share and industry ranking of main manufacturers, data from 2019 to 2024. Identification of the major stakeholders in the global Flip Chip Bonder market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2019 to 2030. Evaluation and forecast the market size for Flip Chip Bonder sales, projected growth trends, production technology, application and end-user industry.
麻豆原创 Segmentation
By Company
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
IDMs
OSAT
Production by Region
North America
Europe
China
Japan
South Korea
Singapore
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Latin America, Middle East & Africa
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Flip Chip Bonder production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production, and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of Flip Chip Bonder in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space of each country in the world.
Chapter 4: Detailed analysis of Flip Chip Bonder manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by Type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by Type, by Application and by country, sales, and revenue for each segment.
Chapter 8: Europe by Type, by Application and by country, sales, and revenue for each segment.
Chapter 9: China by Type, and by Application, sales, and revenue for each segment.
Chapter 10: Asia (excluding China) by Type, by Application and by region, sales, and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by Type, by Application and by country, sales, and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, Flip Chip Bonder sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 Flip Chip Bonder Product Introduction
1.2 麻豆原创 by Type
1.2.1 Global Flip Chip Bonder 麻豆原创 Size by Type, 2019 VS 2023 VS 2030
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 麻豆原创 by Application
1.3.1 Global Flip Chip Bonder 麻豆原创 Size by Application, 2019 VS 2023 VS 2030
1.3.2 IDMs
1.3.3 OSAT
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Flip Chip Bonder Production
2.1 Global Flip Chip Bonder Production Capacity (2019-2030)
2.2 Global Flip Chip Bonder Production by Region: 2019 VS 2023 VS 2030
2.3 Global Flip Chip Bonder Production by Region
2.3.1 Global Flip Chip Bonder Historic Production by Region (2019-2024)
2.3.2 Global Flip Chip Bonder Forecasted Production by Region (2025-2030)
2.3.3 Global Flip Chip Bonder Production 麻豆原创 Share by Region (2019-2030)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
2.9 Singapore
3 Executive Summary
3.1 Global Flip Chip Bonder Revenue Estimates and Forecasts 2019-2030
3.2 Global Flip Chip Bonder Revenue by Region
3.2.1 Global Flip Chip Bonder Revenue by Region: 2019 VS 2023 VS 2030
3.2.2 Global Flip Chip Bonder Revenue by Region (2019-2024)
3.2.3 Global Flip Chip Bonder Revenue by Region (2025-2030)
3.2.4 Global Flip Chip Bonder Revenue 麻豆原创 Share by Region (2019-2030)
3.3 Global Flip Chip Bonder Sales Estimates and Forecasts 2019-2030
3.4 Global Flip Chip Bonder Sales by Region
3.4.1 Global Flip Chip Bonder Sales by Region: 2019 VS 2023 VS 2030
3.4.2 Global Flip Chip Bonder Sales by Region (2019-2024)
3.4.3 Global Flip Chip Bonder Sales by Region (2025-2030)
3.4.4 Global Flip Chip Bonder Sales 麻豆原创 Share by Region (2019-2030)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global Flip Chip Bonder Sales by Manufacturers
4.1.1 Global Flip Chip Bonder Sales by Manufacturers (2019-2024)
4.1.2 Global Flip Chip Bonder Sales 麻豆原创 Share by Manufacturers (2019-2024)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of Flip Chip Bonder in 2023
4.2 Global Flip Chip Bonder Revenue by Manufacturers
4.2.1 Global Flip Chip Bonder Revenue by Manufacturers (2019-2024)
4.2.2 Global Flip Chip Bonder Revenue 麻豆原创 Share by Manufacturers (2019-2024)
4.2.3 Global Top 10 and Top 5 Companies by Flip Chip Bonder Revenue in 2023
4.3 Global Flip Chip Bonder Sales Price by Manufacturers
4.4 Global Key Players of Flip Chip Bonder, Industry Ranking, 2022 VS 2023 VS 2024
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers 麻豆原创 Concentration Ratio (CR5 and HHI)
4.5.2 Global Flip Chip Bonder 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of Flip Chip Bonder, Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of Flip Chip Bonder, Product Offered and Application
4.8 Global Key Manufacturers of Flip Chip Bonder, Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 麻豆原创 Size by Type
5.1 Global Flip Chip Bonder Sales by Type
5.1.1 Global Flip Chip Bonder Historical Sales by Type (2019-2024)
5.1.2 Global Flip Chip Bonder Forecasted Sales by Type (2025-2030)
5.1.3 Global Flip Chip Bonder Sales 麻豆原创 Share by Type (2019-2030)
5.2 Global Flip Chip Bonder Revenue by Type
5.2.1 Global Flip Chip Bonder Historical Revenue by Type (2019-2024)
5.2.2 Global Flip Chip Bonder Forecasted Revenue by Type (2025-2030)
5.2.3 Global Flip Chip Bonder Revenue 麻豆原创 Share by Type (2019-2030)
5.3 Global Flip Chip Bonder Price by Type
5.3.1 Global Flip Chip Bonder Price by Type (2019-2024)
5.3.2 Global Flip Chip Bonder Price Forecast by Type (2025-2030)
6 麻豆原创 Size by Application
6.1 Global Flip Chip Bonder Sales by Application
6.1.1 Global Flip Chip Bonder Historical Sales by Application (2019-2024)
6.1.2 Global Flip Chip Bonder Forecasted Sales by Application (2025-2030)
6.1.3 Global Flip Chip Bonder Sales 麻豆原创 Share by Application (2019-2030)
6.2 Global Flip Chip Bonder Revenue by Application
6.2.1 Global Flip Chip Bonder Historical Revenue by Application (2019-2024)
6.2.2 Global Flip Chip Bonder Forecasted Revenue by Application (2025-2030)
6.2.3 Global Flip Chip Bonder Revenue 麻豆原创 Share by Application (2019-2030)
6.3 Global Flip Chip Bonder Price by Application
6.3.1 Global Flip Chip Bonder Price by Application (2019-2024)
6.3.2 Global Flip Chip Bonder Price Forecast by Application (2025-2030)
7 US & Canada
7.1 US & Canada Flip Chip Bonder 麻豆原创 Size by Type
7.1.1 US & Canada Flip Chip Bonder Sales by Type (2019-2030)
7.1.2 US & Canada Flip Chip Bonder Revenue by Type (2019-2030)
7.2 US & Canada Flip Chip Bonder 麻豆原创 Size by Application
7.2.1 US & Canada Flip Chip Bonder Sales by Application (2019-2030)
7.2.2 US & Canada Flip Chip Bonder Revenue by Application (2019-2030)
7.3 US & Canada Flip Chip Bonder Sales by Country
7.3.1 US & Canada Flip Chip Bonder Revenue by Country: 2019 VS 2023 VS 2030
7.3.2 US & Canada Flip Chip Bonder Sales by Country (2019-2030)
7.3.3 US & Canada Flip Chip Bonder Revenue by Country (2019-2030)
7.3.4 U.S.
7.3.5 Canada
8 Europe
8.1 Europe Flip Chip Bonder 麻豆原创 Size by Type
8.1.1 Europe Flip Chip Bonder Sales by Type (2019-2030)
8.1.2 Europe Flip Chip Bonder Revenue by Type (2019-2030)
8.2 Europe Flip Chip Bonder 麻豆原创 Size by Application
8.2.1 Europe Flip Chip Bonder Sales by Application (2019-2030)
8.2.2 Europe Flip Chip Bonder Revenue by Application (2019-2030)
8.3 Europe Flip Chip Bonder Sales by Country
8.3.1 Europe Flip Chip Bonder Revenue by Country: 2019 VS 2023 VS 2030
8.3.2 Europe Flip Chip Bonder Sales by Country (2019-2030)
8.3.3 Europe Flip Chip Bonder Revenue by Country (2019-2030)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China Flip Chip Bonder 麻豆原创 Size by Type
9.1.1 China Flip Chip Bonder Sales by Type (2019-2030)
9.1.2 China Flip Chip Bonder Revenue by Type (2019-2030)
9.2 China Flip Chip Bonder 麻豆原创 Size by Application
9.2.1 China Flip Chip Bonder Sales by Application (2019-2030)
9.2.2 China Flip Chip Bonder Revenue by Application (2019-2030)
10 Asia (excluding China)
10.1 Asia Flip Chip Bonder 麻豆原创 Size by Type
10.1.1 Asia Flip Chip Bonder Sales by Type (2019-2030)
10.1.2 Asia Flip Chip Bonder Revenue by Type (2019-2030)
10.2 Asia Flip Chip Bonder 麻豆原创 Size by Application
10.2.1 Asia Flip Chip Bonder Sales by Application (2019-2030)
10.2.2 Asia Flip Chip Bonder Revenue by Application (2019-2030)
10.3 Asia Flip Chip Bonder Sales by Region
10.3.1 Asia Flip Chip Bonder Revenue by Region: 2019 VS 2023 VS 2030
10.3.2 Asia Flip Chip Bonder Revenue by Region (2019-2030)
10.3.3 Asia Flip Chip Bonder Sales by Region (2019-2030)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America Flip Chip Bonder 麻豆原创 Size by Type
11.1.1 Middle East, Africa and Latin America Flip Chip Bonder Sales by Type (2019-2030)
11.1.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Type (2019-2030)
11.2 Middle East, Africa and Latin America Flip Chip Bonder 麻豆原创 Size by Application
11.2.1 Middle East, Africa and Latin America Flip Chip Bonder Sales by Application (2019-2030)
11.2.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Application (2019-2030)
11.3 Middle East, Africa and Latin America Flip Chip Bonder Sales by Country
11.3.1 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Country: 2019 VS 2023 VS 2030
11.3.2 Middle East, Africa and Latin America Flip Chip Bonder Revenue by Country (2019-2030)
11.3.3 Middle East, Africa and Latin America Flip Chip Bonder Sales by Country (2019-2030)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 BESI
12.1.1 BESI Company Information
12.1.2 BESI Overview
12.1.3 BESI Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.1.4 BESI Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 BESI Recent Developments
12.2 ASMPT
12.2.1 ASMPT Company Information
12.2.2 ASMPT Overview
12.2.3 ASMPT Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.2.4 ASMPT Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 ASMPT Recent Developments
12.3 Shibaura
12.3.1 Shibaura Company Information
12.3.2 Shibaura Overview
12.3.3 Shibaura Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.3.4 Shibaura Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 Shibaura Recent Developments
12.4 Muehlbauer
12.4.1 Muehlbauer Company Information
12.4.2 Muehlbauer Overview
12.4.3 Muehlbauer Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.4.4 Muehlbauer Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Muehlbauer Recent Developments
12.5 K&S
12.5.1 K&S Company Information
12.5.2 K&S Overview
12.5.3 K&S Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.5.4 K&S Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 K&S Recent Developments
12.6 Hamni
12.6.1 Hamni Company Information
12.6.2 Hamni Overview
12.6.3 Hamni Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.6.4 Hamni Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Hamni Recent Developments
12.7 AMICRA Microtechnologies
12.7.1 AMICRA Microtechnologies Company Information
12.7.2 AMICRA Microtechnologies Overview
12.7.3 AMICRA Microtechnologies Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.7.4 AMICRA Microtechnologies Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 AMICRA Microtechnologies Recent Developments
12.8 SET
12.8.1 SET Company Information
12.8.2 SET Overview
12.8.3 SET Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.8.4 SET Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 SET Recent Developments
12.9 Athlete FA
12.9.1 Athlete FA Company Information
12.9.2 Athlete FA Overview
12.9.3 Athlete FA Flip Chip Bonder Sales, Price, Revenue and Gross Margin (2019-2024)
12.9.4 Athlete FA Flip Chip Bonder Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Athlete FA Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 Flip Chip Bonder Industry Chain Analysis
13.2 Flip Chip Bonder Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 Flip Chip Bonder Production Mode & Process
13.4 Flip Chip Bonder Sales and 麻豆原创ing
13.4.1 Flip Chip Bonder Sales Channels
13.4.2 Flip Chip Bonder Distributors
13.5 Flip Chip Bonder Customers
14 Flip Chip Bonder 麻豆原创 Dynamics
14.1 Flip Chip Bonder Industry Trends
14.2 Flip Chip Bonder 麻豆原创 Drivers
14.3 Flip Chip Bonder 麻豆原创 Challenges
14.4 Flip Chip Bonder 麻豆原创 Restraints
15 Key Finding in The Global Flip Chip Bonder Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
听
听
*If Applicable.