Global Fan-Out Packaging 麻豆原创 Research Report 2024

Publication ID:

PB502244625

Publication Date:

March 6, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

Fan-Out Packaging can be defined as any package with connections fanned-out of the chip surface, enabling more external I/Os. Conventional fan-out packages use an epoxy mold compound to fully embed the dies, rather than placing them upon a substrate or interposer. Fan-Out packaging typically involves dicing chips on a silicon wafer, and then very precisely positioning the known-good chips on a thin 鈥渞econstituted鈥� or carrier wafer/panel, which is then molded and followed by a redistribution layer (RDL) atop the molded area (chip and fan-out area), and then forming solder balls on top.
The global Fan-Out Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
North American market for Fan-Out Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for Fan-Out Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for Fan-Out Packaging in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of Fan-Out Packaging include ASE Group, YoleDeveloppement, Atotech, NXP, Camtek, STATS ChipPAC, Deca Technologies, INTEVAC and Onto Innovation, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for Fan-Out Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Fan-Out Packaging.
Report Scope
The Fan-Out Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Fan-Out Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Fan-Out Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.
Segment by Type
Core Fan-Out Packaging
High-Density Fan-Out Packaging
Segment by Application
Consumer Electronics
Automobile Industry
Aerospace and Defense
Telecom Industry
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Fan-Out Packaging companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Fan-Out Packaging 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 Core Fan-Out Packaging
1.2.3 High-Density Fan-Out Packaging
1.3 麻豆原创 by Application
1.3.1 Global Fan-Out Packaging 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Automobile Industry
1.3.4 Aerospace and Defense
1.3.5 Telecom Industry
1.3.6 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Fan-Out Packaging 麻豆原创 Perspective (2019-2030)
2.2 Fan-Out Packaging Growth Trends by Region
2.2.1 Global Fan-Out Packaging 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 Fan-Out Packaging Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 Fan-Out Packaging Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 Fan-Out Packaging 麻豆原创 Dynamics
2.3.1 Fan-Out Packaging Industry Trends
2.3.2 Fan-Out Packaging 麻豆原创 Drivers
2.3.3 Fan-Out Packaging 麻豆原创 Challenges
2.3.4 Fan-Out Packaging 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Fan-Out Packaging Players by Revenue
3.1.1 Global Top Fan-Out Packaging Players by Revenue (2019-2024)
3.1.2 Global Fan-Out Packaging Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global Fan-Out Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Fan-Out Packaging Revenue
3.4 Global Fan-Out Packaging 麻豆原创 Concentration Ratio
3.4.1 Global Fan-Out Packaging 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Fan-Out Packaging Revenue in 2023
3.5 Fan-Out Packaging Key Players Head office and Area Served
3.6 Key Players Fan-Out Packaging Product Solution and Service
3.7 Date of Enter into Fan-Out Packaging 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Fan-Out Packaging Breakdown Data by Type
4.1 Global Fan-Out Packaging Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global Fan-Out Packaging Forecasted 麻豆原创 Size by Type (2025-2030)
5 Fan-Out Packaging Breakdown Data by Application
5.1 Global Fan-Out Packaging Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global Fan-Out Packaging Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America Fan-Out Packaging 麻豆原创 Size (2019-2030)
6.2 North America Fan-Out Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Fan-Out Packaging 麻豆原创 Size by Country (2019-2024)
6.4 North America Fan-Out Packaging 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Fan-Out Packaging 麻豆原创 Size (2019-2030)
7.2 Europe Fan-Out Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Fan-Out Packaging 麻豆原创 Size by Country (2019-2024)
7.4 Europe Fan-Out Packaging 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Fan-Out Packaging 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific Fan-Out Packaging 麻豆原创 Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Fan-Out Packaging 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific Fan-Out Packaging 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Fan-Out Packaging 麻豆原创 Size (2019-2030)
9.2 Latin America Fan-Out Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Fan-Out Packaging 麻豆原创 Size by Country (2019-2024)
9.4 Latin America Fan-Out Packaging 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Fan-Out Packaging 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa Fan-Out Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Fan-Out Packaging 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa Fan-Out Packaging 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Group
11.1.1 ASE Group Company Detail
11.1.2 ASE Group Business Overview
11.1.3 ASE Group Fan-Out Packaging Introduction
11.1.4 ASE Group Revenue in Fan-Out Packaging Business (2019-2024)
11.1.5 ASE Group Recent Development
11.2 YoleDeveloppement
11.2.1 YoleDeveloppement Company Detail
11.2.2 YoleDeveloppement Business Overview
11.2.3 YoleDeveloppement Fan-Out Packaging Introduction
11.2.4 YoleDeveloppement Revenue in Fan-Out Packaging Business (2019-2024)
11.2.5 YoleDeveloppement Recent Development
11.3 Atotech
11.3.1 Atotech Company Detail
11.3.2 Atotech Business Overview
11.3.3 Atotech Fan-Out Packaging Introduction
11.3.4 Atotech Revenue in Fan-Out Packaging Business (2019-2024)
11.3.5 Atotech Recent Development
11.4 NXP
11.4.1 NXP Company Detail
11.4.2 NXP Business Overview
11.4.3 NXP Fan-Out Packaging Introduction
11.4.4 NXP Revenue in Fan-Out Packaging Business (2019-2024)
11.4.5 NXP Recent Development
11.5 Camtek
11.5.1 Camtek Company Detail
11.5.2 Camtek Business Overview
11.5.3 Camtek Fan-Out Packaging Introduction
11.5.4 Camtek Revenue in Fan-Out Packaging Business (2019-2024)
11.5.5 Camtek Recent Development
11.6 STATS ChipPAC
11.6.1 STATS ChipPAC Company Detail
11.6.2 STATS ChipPAC Business Overview
11.6.3 STATS ChipPAC Fan-Out Packaging Introduction
11.6.4 STATS ChipPAC Revenue in Fan-Out Packaging Business (2019-2024)
11.6.5 STATS ChipPAC Recent Development
11.7 Deca Technologies
11.7.1 Deca Technologies Company Detail
11.7.2 Deca Technologies Business Overview
11.7.3 Deca Technologies Fan-Out Packaging Introduction
11.7.4 Deca Technologies Revenue in Fan-Out Packaging Business (2019-2024)
11.7.5 Deca Technologies Recent Development
11.8 INTEVAC
11.8.1 INTEVAC Company Detail
11.8.2 INTEVAC Business Overview
11.8.3 INTEVAC Fan-Out Packaging Introduction
11.8.4 INTEVAC Revenue in Fan-Out Packaging Business (2019-2024)
11.8.5 INTEVAC Recent Development
11.9 Onto Innovation
11.9.1 Onto Innovation Company Detail
11.9.2 Onto Innovation Business Overview
11.9.3 Onto Innovation Fan-Out Packaging Introduction
11.9.4 Onto Innovation Revenue in Fan-Out Packaging Business (2019-2024)
11.9.5 Onto Innovation Recent Development
11.10 Amkor Technology Inc.
11.10.1 Amkor Technology Inc. Company Detail
11.10.2 Amkor Technology Inc. Business Overview
11.10.3 Amkor Technology Inc. Fan-Out Packaging Introduction
11.10.4 Amkor Technology Inc. Revenue in Fan-Out Packaging Business (2019-2024)
11.10.5 Amkor Technology Inc. Recent Development
11.11 Samsung Electro-Mechanics
11.11.1 Samsung Electro-Mechanics Company Detail
11.11.2 Samsung Electro-Mechanics Business Overview
11.11.3 Samsung Electro-Mechanics Fan-Out Packaging Introduction
11.11.4 Samsung Electro-Mechanics Revenue in Fan-Out Packaging Business (2019-2024)
11.11.5 Samsung Electro-Mechanics Recent Development
11.12 Powertech Technology Inc.
11.12.1 Powertech Technology Inc. Company Detail
11.12.2 Powertech Technology Inc. Business Overview
11.12.3 Powertech Technology Inc. Fan-Out Packaging Introduction
11.12.4 Powertech Technology Inc. Revenue in Fan-Out Packaging Business (2019-2024)
11.12.5 Powertech Technology Inc. Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

ASE Group
YoleDeveloppement
Atotech
NXP
Camtek
STATS ChipPAC
Deca Technologies
INTEVAC
Onto Innovation
Amkor Technology Inc.
Samsung Electro-Mechanics
Powertech Technology Inc.

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