Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global Electronic Potting and Encapsulating market is projected to reach US$ 3404 million in 2029, increasing from US$ 1803.6 million in 2022, with the CAGR of 9.3% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Electronic Potting and Encapsulating market research.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Electronic Potting and Encapsulating market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Segment by Type
Epoxy
Silicones
Polyurethane
Ohers
Segment by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Electronic Potting and Encapsulating report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. 麻豆原创 Opportunities and Challenges
Chapter 3: Companies鈥� Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies鈥� Outline
Chapter 12: 麻豆原创 Conclusions
Chapter 13: Research Methodology and Data Source
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Electronic Potting and Encapsulating 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 Epoxy
1.2.3 Silicones
1.2.4 Polyurethane
1.2.5 Ohers
1.3 麻豆原创 by Application
1.3.1 Global Electronic Potting and Encapsulating 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Automotive
1.3.4 Medical
1.3.5 Telecommunications
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Electronic Potting and Encapsulating 麻豆原创 Perspective (2018-2029)
2.2 Electronic Potting and Encapsulating Growth Trends by Region
2.2.1 Global Electronic Potting and Encapsulating 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 Electronic Potting and Encapsulating Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 Electronic Potting and Encapsulating Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 Electronic Potting and Encapsulating 麻豆原创 Dynamics
2.3.1 Electronic Potting and Encapsulating Industry Trends
2.3.2 Electronic Potting and Encapsulating 麻豆原创 Drivers
2.3.3 Electronic Potting and Encapsulating 麻豆原创 Challenges
2.3.4 Electronic Potting and Encapsulating 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Electronic Potting and Encapsulating Players by Revenue
3.1.1 Global Top Electronic Potting and Encapsulating Players by Revenue (2018-2023)
3.1.2 Global Electronic Potting and Encapsulating Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global Electronic Potting and Encapsulating 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Electronic Potting and Encapsulating Revenue
3.4 Global Electronic Potting and Encapsulating 麻豆原创 Concentration Ratio
3.4.1 Global Electronic Potting and Encapsulating 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Electronic Potting and Encapsulating Revenue in 2022
3.5 Electronic Potting and Encapsulating Key Players Head office and Area Served
3.6 Key Players Electronic Potting and Encapsulating Product Solution and Service
3.7 Date of Enter into Electronic Potting and Encapsulating 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Electronic Potting and Encapsulating Breakdown Data by Type
4.1 Global Electronic Potting and Encapsulating Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global Electronic Potting and Encapsulating Forecasted 麻豆原创 Size by Type (2024-2029)
5 Electronic Potting and Encapsulating Breakdown Data by Application
5.1 Global Electronic Potting and Encapsulating Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global Electronic Potting and Encapsulating Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America Electronic Potting and Encapsulating 麻豆原创 Size (2018-2029)
6.2 North America Electronic Potting and Encapsulating 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Electronic Potting and Encapsulating 麻豆原创 Size by Country (2018-2023)
6.4 North America Electronic Potting and Encapsulating 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Electronic Potting and Encapsulating 麻豆原创 Size (2018-2029)
7.2 Europe Electronic Potting and Encapsulating 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Electronic Potting and Encapsulating 麻豆原创 Size by Country (2018-2023)
7.4 Europe Electronic Potting and Encapsulating 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Electronic Potting and Encapsulating 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific Electronic Potting and Encapsulating 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Electronic Potting and Encapsulating 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific Electronic Potting and Encapsulating 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Electronic Potting and Encapsulating 麻豆原创 Size (2018-2029)
9.2 Latin America Electronic Potting and Encapsulating 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Electronic Potting and Encapsulating 麻豆原创 Size by Country (2018-2023)
9.4 Latin America Electronic Potting and Encapsulating 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Electronic Potting and Encapsulating 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa Electronic Potting and Encapsulating 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Electronic Potting and Encapsulating 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa Electronic Potting and Encapsulating 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Henkel
11.1.1 Henkel Company Detail
11.1.2 Henkel Business Overview
11.1.3 Henkel Electronic Potting and Encapsulating Introduction
11.1.4 Henkel Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.1.5 Henkel Recent Development
11.2 Dow Corning
11.2.1 Dow Corning Company Detail
11.2.2 Dow Corning Business Overview
11.2.3 Dow Corning Electronic Potting and Encapsulating Introduction
11.2.4 Dow Corning Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.2.5 Dow Corning Recent Development
11.3 Hitachi Chemical
11.3.1 Hitachi Chemical Company Detail
11.3.2 Hitachi Chemical Business Overview
11.3.3 Hitachi Chemical Electronic Potting and Encapsulating Introduction
11.3.4 Hitachi Chemical Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.3.5 Hitachi Chemical Recent Development
11.4 LORD Corporation
11.4.1 LORD Corporation Company Detail
11.4.2 LORD Corporation Business Overview
11.4.3 LORD Corporation Electronic Potting and Encapsulating Introduction
11.4.4 LORD Corporation Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.4.5 LORD Corporation Recent Development
11.5 Huntsman Corporation
11.5.1 Huntsman Corporation Company Detail
11.5.2 Huntsman Corporation Business Overview
11.5.3 Huntsman Corporation Electronic Potting and Encapsulating Introduction
11.5.4 Huntsman Corporation Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.5.5 Huntsman Corporation Recent Development
11.6 ITW Engineered Polymers
11.6.1 ITW Engineered Polymers Company Detail
11.6.2 ITW Engineered Polymers Business Overview
11.6.3 ITW Engineered Polymers Electronic Potting and Encapsulating Introduction
11.6.4 ITW Engineered Polymers Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.6.5 ITW Engineered Polymers Recent Development
11.7 3M
11.7.1 3M Company Detail
11.7.2 3M Business Overview
11.7.3 3M Electronic Potting and Encapsulating Introduction
11.7.4 3M Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.7.5 3M Recent Development
11.8 H.B. Fuller
11.8.1 H.B. Fuller Company Detail
11.8.2 H.B. Fuller Business Overview
11.8.3 H.B. Fuller Electronic Potting and Encapsulating Introduction
11.8.4 H.B. Fuller Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.8.5 H.B. Fuller Recent Development
11.9 John C. Dolph
11.9.1 John C. Dolph Company Detail
11.9.2 John C. Dolph Business Overview
11.9.3 John C. Dolph Electronic Potting and Encapsulating Introduction
11.9.4 John C. Dolph Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.9.5 John C. Dolph Recent Development
11.10 Master Bond
11.10.1 Master Bond Company Detail
11.10.2 Master Bond Business Overview
11.10.3 Master Bond Electronic Potting and Encapsulating Introduction
11.10.4 Master Bond Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.10.5 Master Bond Recent Development
11.11 ACC Silicones
11.11.1 ACC Silicones Company Detail
11.11.2 ACC Silicones Business Overview
11.11.3 ACC Silicones Electronic Potting and Encapsulating Introduction
11.11.4 ACC Silicones Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.11.5 ACC Silicones Recent Development
11.12 Epic Resins
11.12.1 Epic Resins Company Detail
11.12.2 Epic Resins Business Overview
11.12.3 Epic Resins Electronic Potting and Encapsulating Introduction
11.12.4 Epic Resins Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.12.5 Epic Resins Recent Development
11.13 Plasma Ruggedized Solutions
11.13.1 Plasma Ruggedized Solutions Company Detail
11.13.2 Plasma Ruggedized Solutions Business Overview
11.13.3 Plasma Ruggedized Solutions Electronic Potting and Encapsulating Introduction
11.13.4 Plasma Ruggedized Solutions Revenue in Electronic Potting and Encapsulating Business (2018-2023)
11.13.5 Plasma Ruggedized Solutions Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
听
听
*If Applicable.
