The global market for Electrodeposited Copper Foil for Printed Circuit Boards was valued at US$ 385 million in the year 2024 and is projected to reach a revised size of US$ 532 million by 2031, growing at a CAGR of 4.8% during the forecast period.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Electrodeposited Copper Foil for Printed Circuit Boards, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electrodeposited Copper Foil for Printed Circuit Boards.
The Electrodeposited Copper Foil for Printed Circuit Boards market size, estimations, and forecasts are provided in terms of output/shipments (Kiloton) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Electrodeposited Copper Foil for Printed Circuit Boards market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Electrodeposited Copper Foil for Printed Circuit Boards manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Jiangxi Copper
Furukawa Electric
Nan Ya Plastics
Arcotech
Kingboard Copper Foil
Guangdong Chaohua Technology
Ls Mtron
Chang Chun Petrochemical
Minerex
Circuit Foil Luxembourg
Suzhou Fukuda Metal
LingBao Wason Copper Foil
Targray Technology International
Shandong Jinbao Electronics
by Type
Below 20 渭m
20-50 渭m
Above 50 渭m
by Application
Single Sided Board
Double Sided Board
Multi Layered Board
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Electrodeposited Copper Foil for Printed Circuit Boards manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Electrodeposited Copper Foil for Printed Circuit Boards by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Electrodeposited Copper Foil for Printed Circuit Boards in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Overview
1.1 Product Definition
1.2 Electrodeposited Copper Foil for Printed Circuit Boards by Type
1.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Below 20 渭m
1.2.3 20-50 渭m
1.2.4 Above 50 渭m
1.3 Electrodeposited Copper Foil for Printed Circuit Boards by Application
1.3.1 Global Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Single Sided Board
1.3.3 Double Sided Board
1.3.4 Multi Layered Board
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Estimates and Forecasts (2020-2031)
1.4.4 Global Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production 麻豆原创 Share by Manufacturers (2020-2025)
2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value 麻豆原创 Share by Manufacturers (2020-2025)
2.3 Global Key Players of Electrodeposited Copper Foil for Printed Circuit Boards, Industry Ranking, 2023 VS 2024
2.4 Global Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Electrodeposited Copper Foil for Printed Circuit Boards Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards, Product Offered and Application
2.8 Global Key Manufacturers of Electrodeposited Copper Foil for Printed Circuit Boards, Date of Enter into This Industry
2.9 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Competitive Situation and Trends
2.9.1 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Electrodeposited Copper Foil for Printed Circuit Boards Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Electrodeposited Copper Foil for Printed Circuit Boards Production by Region
3.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Region (2020-2031)
3.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Electrodeposited Copper Foil for Printed Circuit Boards by Region (2026-2031)
3.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Volume by Region (2020-2031)
3.4.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Electrodeposited Copper Foil for Printed Circuit Boards by Region (2026-2031)
3.5 Global Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Price Analysis by Region (2020-2025)
3.6 Global Electrodeposited Copper Foil for Printed Circuit Boards Production and Value, Year-over-Year Growth
3.6.1 North America Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Electrodeposited Copper Foil for Printed Circuit Boards Production Value Estimates and Forecasts (2020-2031)
4 Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region
4.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region (2020-2031)
4.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region (2020-2025)
4.2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Electrodeposited Copper Foil for Printed Circuit Boards Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Electrodeposited Copper Foil for Printed Circuit Boards Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Type
5.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Type (2020-2031)
5.1.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Type (2020-2025)
5.1.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Type (2026-2031)
5.1.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production 麻豆原创 Share by Type (2020-2031)
5.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Type (2020-2031)
5.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Type (2020-2025)
5.2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Type (2026-2031)
5.2.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value 麻豆原创 Share by Type (2020-2031)
5.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Price by Type (2020-2031)
6 Segment by Application
6.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Application (2020-2031)
6.1.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Application (2020-2025)
6.1.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production by Application (2026-2031)
6.1.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production 麻豆原创 Share by Application (2020-2031)
6.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Application (2020-2031)
6.2.1 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Application (2020-2025)
6.2.2 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value by Application (2026-2031)
6.2.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Production Value 麻豆原创 Share by Application (2020-2031)
6.3 Global Electrodeposited Copper Foil for Printed Circuit Boards Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Mitsui Mining & Smelting
7.1.1 Mitsui Mining & Smelting Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.1.2 Mitsui Mining & Smelting Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.1.3 Mitsui Mining & Smelting Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Mitsui Mining & Smelting Main Business and 麻豆原创s Served
7.1.5 Mitsui Mining & Smelting Recent Developments/Updates
7.2 JX Nippon Mining & Metals
7.2.1 JX Nippon Mining & Metals Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.2.2 JX Nippon Mining & Metals Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.2.3 JX Nippon Mining & Metals Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.2.4 JX Nippon Mining & Metals Main Business and 麻豆原创s Served
7.2.5 JX Nippon Mining & Metals Recent Developments/Updates
7.3 Jiangxi Copper
7.3.1 Jiangxi Copper Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.3.2 Jiangxi Copper Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.3.3 Jiangxi Copper Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Jiangxi Copper Main Business and 麻豆原创s Served
7.3.5 Jiangxi Copper Recent Developments/Updates
7.4 Furukawa Electric
7.4.1 Furukawa Electric Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.4.2 Furukawa Electric Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.4.3 Furukawa Electric Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.4.4 Furukawa Electric Main Business and 麻豆原创s Served
7.4.5 Furukawa Electric Recent Developments/Updates
7.5 Nan Ya Plastics
7.5.1 Nan Ya Plastics Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.5.2 Nan Ya Plastics Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.5.3 Nan Ya Plastics Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Nan Ya Plastics Main Business and 麻豆原创s Served
7.5.5 Nan Ya Plastics Recent Developments/Updates
7.6 Arcotech
7.6.1 Arcotech Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.6.2 Arcotech Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.6.3 Arcotech Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.6.4 Arcotech Main Business and 麻豆原创s Served
7.6.5 Arcotech Recent Developments/Updates
7.7 Kingboard Copper Foil
7.7.1 Kingboard Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.7.2 Kingboard Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.7.3 Kingboard Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Kingboard Copper Foil Main Business and 麻豆原创s Served
7.7.5 Kingboard Copper Foil Recent Developments/Updates
7.8 Guangdong Chaohua Technology
7.8.1 Guangdong Chaohua Technology Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.8.2 Guangdong Chaohua Technology Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.8.3 Guangdong Chaohua Technology Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Guangdong Chaohua Technology Main Business and 麻豆原创s Served
7.8.5 Guangdong Chaohua Technology Recent Developments/Updates
7.9 Ls Mtron
7.9.1 Ls Mtron Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.9.2 Ls Mtron Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.9.3 Ls Mtron Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Ls Mtron Main Business and 麻豆原创s Served
7.9.5 Ls Mtron Recent Developments/Updates
7.10 Chang Chun Petrochemical
7.10.1 Chang Chun Petrochemical Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.10.2 Chang Chun Petrochemical Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.10.3 Chang Chun Petrochemical Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.10.4 Chang Chun Petrochemical Main Business and 麻豆原创s Served
7.10.5 Chang Chun Petrochemical Recent Developments/Updates
7.11 Minerex
7.11.1 Minerex Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.11.2 Minerex Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.11.3 Minerex Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.11.4 Minerex Main Business and 麻豆原创s Served
7.11.5 Minerex Recent Developments/Updates
7.12 Circuit Foil Luxembourg
7.12.1 Circuit Foil Luxembourg Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.12.2 Circuit Foil Luxembourg Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.12.3 Circuit Foil Luxembourg Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.12.4 Circuit Foil Luxembourg Main Business and 麻豆原创s Served
7.12.5 Circuit Foil Luxembourg Recent Developments/Updates
7.13 Suzhou Fukuda Metal
7.13.1 Suzhou Fukuda Metal Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.13.2 Suzhou Fukuda Metal Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.13.3 Suzhou Fukuda Metal Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.13.4 Suzhou Fukuda Metal Main Business and 麻豆原创s Served
7.13.5 Suzhou Fukuda Metal Recent Developments/Updates
7.14 LingBao Wason Copper Foil
7.14.1 LingBao Wason Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.14.2 LingBao Wason Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.14.3 LingBao Wason Copper Foil Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.14.4 LingBao Wason Copper Foil Main Business and 麻豆原创s Served
7.14.5 LingBao Wason Copper Foil Recent Developments/Updates
7.15 Targray Technology International
7.15.1 Targray Technology International Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.15.2 Targray Technology International Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.15.3 Targray Technology International Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.15.4 Targray Technology International Main Business and 麻豆原创s Served
7.15.5 Targray Technology International Recent Developments/Updates
7.16 Shandong Jinbao Electronics
7.16.1 Shandong Jinbao Electronics Electrodeposited Copper Foil for Printed Circuit Boards Company Information
7.16.2 Shandong Jinbao Electronics Electrodeposited Copper Foil for Printed Circuit Boards Product Portfolio
7.16.3 Shandong Jinbao Electronics Electrodeposited Copper Foil for Printed Circuit Boards Production, Value, Price and Gross Margin (2020-2025)
7.16.4 Shandong Jinbao Electronics Main Business and 麻豆原创s Served
7.16.5 Shandong Jinbao Electronics Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Electrodeposited Copper Foil for Printed Circuit Boards Industry Chain Analysis
8.2 Electrodeposited Copper Foil for Printed Circuit Boards Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Electrodeposited Copper Foil for Printed Circuit Boards Production Mode & Process Analysis
8.4 Electrodeposited Copper Foil for Printed Circuit Boards Sales and 麻豆原创ing
8.4.1 Electrodeposited Copper Foil for Printed Circuit Boards Sales Channels
8.4.2 Electrodeposited Copper Foil for Printed Circuit Boards Distributors
8.5 Electrodeposited Copper Foil for Printed Circuit Boards Customer Analysis
9 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Dynamics
9.1 Electrodeposited Copper Foil for Printed Circuit Boards Industry Trends
9.2 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Drivers
9.3 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Challenges
9.4 Electrodeposited Copper Foil for Printed Circuit Boards 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Mitsui Mining & Smelting
JX Nippon Mining & Metals
Jiangxi Copper
Furukawa Electric
Nan Ya Plastics
Arcotech
Kingboard Copper Foil
Guangdong Chaohua Technology
Ls Mtron
Chang Chun Petrochemical
Minerex
Circuit Foil Luxembourg
Suzhou Fukuda Metal
LingBao Wason Copper Foil
Targray Technology International
Shandong Jinbao Electronics
听
听
*If Applicable.
