The global market for Die Attach Adhesives for Semiconductor was valued at US$ million in the year 2024 and is projected to reach a revised size of US$ million by 2031, growing at a CAGR of %during the forecast period.
Die attach adhesive is an insulator that is dispensed in a pattern, and is used to bond the opposite side of the circuit on an IC chip, which has conductive bumps, to a mounting substrate.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Die Attach Adhesives for Semiconductor, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Die Attach Adhesives for Semiconductor.
The Die Attach Adhesives for Semiconductor market size, estimations, and forecasts are provided in terms of output/shipments (Tons) and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global Die Attach Adhesives for Semiconductor market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Die Attach Adhesives for Semiconductor manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Dupont
Henkel
Namics
AI Technology
Advanced Packaging
DELO
Protavic
Master Bond
Nagase ChemteX
by Type
Insulating Type
Sintering Type
Heat-curing Type
by Application
Consumer Electronic
Automotive Electronic
Optical Imaging Device
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Rest of Europe
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Die Attach Adhesives for Semiconductor manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Die Attach Adhesives for Semiconductor by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Die Attach Adhesives for Semiconductor in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 Die Attach Adhesives for Semiconductor 麻豆原创 Overview
1.1 Product Definition
1.2 Die Attach Adhesives for Semiconductor by Type
1.2.1 Global Die Attach Adhesives for Semiconductor 麻豆原创 Value Growth Rate Analysis by Type: 2024 VS 2031
1.2.2 Insulating Type
1.2.3 Sintering Type
1.2.4 Heat-curing Type
1.3 Die Attach Adhesives for Semiconductor by Application
1.3.1 Global Die Attach Adhesives for Semiconductor 麻豆原创 Value Growth Rate Analysis by Application: 2024 VS 2031
1.3.2 Consumer Electronic
1.3.3 Automotive Electronic
1.3.4 Optical Imaging Device
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts (2020-2031)
1.4.2 Global Die Attach Adhesives for Semiconductor Production Capacity Estimates and Forecasts (2020-2031)
1.4.3 Global Die Attach Adhesives for Semiconductor Production Estimates and Forecasts (2020-2031)
1.4.4 Global Die Attach Adhesives for Semiconductor 麻豆原创 Average Price Estimates and Forecasts (2020-2031)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global Die Attach Adhesives for Semiconductor Production 麻豆原创 Share by Manufacturers (2020-2025)
2.2 Global Die Attach Adhesives for Semiconductor Production Value 麻豆原创 Share by Manufacturers (2020-2025)
2.3 Global Key Players of Die Attach Adhesives for Semiconductor, Industry Ranking, 2023 VS 2024
2.4 Global Die Attach Adhesives for Semiconductor 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
2.5 Global Die Attach Adhesives for Semiconductor Average Price by Manufacturers (2020-2025)
2.6 Global Key Manufacturers of Die Attach Adhesives for Semiconductor, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Die Attach Adhesives for Semiconductor, Product Offered and Application
2.8 Global Key Manufacturers of Die Attach Adhesives for Semiconductor, Date of Enter into This Industry
2.9 Die Attach Adhesives for Semiconductor 麻豆原创 Competitive Situation and Trends
2.9.1 Die Attach Adhesives for Semiconductor 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest Die Attach Adhesives for Semiconductor Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Die Attach Adhesives for Semiconductor Production by Region
3.1 Global Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.2 Global Die Attach Adhesives for Semiconductor Production Value by Region (2020-2031)
3.2.1 Global Die Attach Adhesives for Semiconductor Production Value by Region (2020-2025)
3.2.2 Global Forecasted Production Value of Die Attach Adhesives for Semiconductor by Region (2026-2031)
3.3 Global Die Attach Adhesives for Semiconductor Production Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
3.4 Global Die Attach Adhesives for Semiconductor Production Volume by Region (2020-2031)
3.4.1 Global Die Attach Adhesives for Semiconductor Production by Region (2020-2025)
3.4.2 Global Forecasted Production of Die Attach Adhesives for Semiconductor by Region (2026-2031)
3.5 Global Die Attach Adhesives for Semiconductor 麻豆原创 Price Analysis by Region (2020-2025)
3.6 Global Die Attach Adhesives for Semiconductor Production and Value, Year-over-Year Growth
3.6.1 North America Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.2 Europe Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.3 China Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.4 Japan Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts (2020-2031)
3.6.5 South Korea Die Attach Adhesives for Semiconductor Production Value Estimates and Forecasts (2020-2031)
4 Die Attach Adhesives for Semiconductor Consumption by Region
4.1 Global Die Attach Adhesives for Semiconductor Consumption Estimates and Forecasts by Region: 2020 VS 2024 VS 2031
4.2 Global Die Attach Adhesives for Semiconductor Consumption by Region (2020-2031)
4.2.1 Global Die Attach Adhesives for Semiconductor Consumption by Region (2020-2025)
4.2.2 Global Die Attach Adhesives for Semiconductor Forecasted Consumption by Region (2026-2031)
4.3 North America
4.3.1 North America Die Attach Adhesives for Semiconductor Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.3.2 North America Die Attach Adhesives for Semiconductor Consumption by Country (2020-2031)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Die Attach Adhesives for Semiconductor Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.4.2 Europe Die Attach Adhesives for Semiconductor Consumption by Country (2020-2031)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific Die Attach Adhesives for Semiconductor Consumption Growth Rate by Region: 2020 VS 2024 VS 2031
4.5.2 Asia Pacific Die Attach Adhesives for Semiconductor Consumption by Region (2020-2031)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Die Attach Adhesives for Semiconductor Consumption Growth Rate by Country: 2020 VS 2024 VS 2031
4.6.2 Latin America, Middle East & Africa Die Attach Adhesives for Semiconductor Consumption by Country (2020-2031)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Israel
5 Segment by Type
5.1 Global Die Attach Adhesives for Semiconductor Production by Type (2020-2031)
5.1.1 Global Die Attach Adhesives for Semiconductor Production by Type (2020-2025)
5.1.2 Global Die Attach Adhesives for Semiconductor Production by Type (2026-2031)
5.1.3 Global Die Attach Adhesives for Semiconductor Production 麻豆原创 Share by Type (2020-2031)
5.2 Global Die Attach Adhesives for Semiconductor Production Value by Type (2020-2031)
5.2.1 Global Die Attach Adhesives for Semiconductor Production Value by Type (2020-2025)
5.2.2 Global Die Attach Adhesives for Semiconductor Production Value by Type (2026-2031)
5.2.3 Global Die Attach Adhesives for Semiconductor Production Value 麻豆原创 Share by Type (2020-2031)
5.3 Global Die Attach Adhesives for Semiconductor Price by Type (2020-2031)
6 Segment by Application
6.1 Global Die Attach Adhesives for Semiconductor Production by Application (2020-2031)
6.1.1 Global Die Attach Adhesives for Semiconductor Production by Application (2020-2025)
6.1.2 Global Die Attach Adhesives for Semiconductor Production by Application (2026-2031)
6.1.3 Global Die Attach Adhesives for Semiconductor Production 麻豆原创 Share by Application (2020-2031)
6.2 Global Die Attach Adhesives for Semiconductor Production Value by Application (2020-2031)
6.2.1 Global Die Attach Adhesives for Semiconductor Production Value by Application (2020-2025)
6.2.2 Global Die Attach Adhesives for Semiconductor Production Value by Application (2026-2031)
6.2.3 Global Die Attach Adhesives for Semiconductor Production Value 麻豆原创 Share by Application (2020-2031)
6.3 Global Die Attach Adhesives for Semiconductor Price by Application (2020-2031)
7 Key Companies Profiled
7.1 Dupont
7.1.1 Dupont Die Attach Adhesives for Semiconductor Company Information
7.1.2 Dupont Die Attach Adhesives for Semiconductor Product Portfolio
7.1.3 Dupont Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.1.4 Dupont Main Business and 麻豆原创s Served
7.1.5 Dupont Recent Developments/Updates
7.2 Henkel
7.2.1 Henkel Die Attach Adhesives for Semiconductor Company Information
7.2.2 Henkel Die Attach Adhesives for Semiconductor Product Portfolio
7.2.3 Henkel Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.2.4 Henkel Main Business and 麻豆原创s Served
7.2.5 Henkel Recent Developments/Updates
7.3 Namics
7.3.1 Namics Die Attach Adhesives for Semiconductor Company Information
7.3.2 Namics Die Attach Adhesives for Semiconductor Product Portfolio
7.3.3 Namics Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.3.4 Namics Main Business and 麻豆原创s Served
7.3.5 Namics Recent Developments/Updates
7.4 AI Technology
7.4.1 AI Technology Die Attach Adhesives for Semiconductor Company Information
7.4.2 AI Technology Die Attach Adhesives for Semiconductor Product Portfolio
7.4.3 AI Technology Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.4.4 AI Technology Main Business and 麻豆原创s Served
7.4.5 AI Technology Recent Developments/Updates
7.5 Advanced Packaging
7.5.1 Advanced Packaging Die Attach Adhesives for Semiconductor Company Information
7.5.2 Advanced Packaging Die Attach Adhesives for Semiconductor Product Portfolio
7.5.3 Advanced Packaging Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.5.4 Advanced Packaging Main Business and 麻豆原创s Served
7.5.5 Advanced Packaging Recent Developments/Updates
7.6 DELO
7.6.1 DELO Die Attach Adhesives for Semiconductor Company Information
7.6.2 DELO Die Attach Adhesives for Semiconductor Product Portfolio
7.6.3 DELO Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.6.4 DELO Main Business and 麻豆原创s Served
7.6.5 DELO Recent Developments/Updates
7.7 Protavic
7.7.1 Protavic Die Attach Adhesives for Semiconductor Company Information
7.7.2 Protavic Die Attach Adhesives for Semiconductor Product Portfolio
7.7.3 Protavic Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.7.4 Protavic Main Business and 麻豆原创s Served
7.7.5 Protavic Recent Developments/Updates
7.8 Master Bond
7.8.1 Master Bond Die Attach Adhesives for Semiconductor Company Information
7.8.2 Master Bond Die Attach Adhesives for Semiconductor Product Portfolio
7.8.3 Master Bond Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.8.4 Master Bond Main Business and 麻豆原创s Served
7.8.5 Master Bond Recent Developments/Updates
7.9 Nagase ChemteX
7.9.1 Nagase ChemteX Die Attach Adhesives for Semiconductor Company Information
7.9.2 Nagase ChemteX Die Attach Adhesives for Semiconductor Product Portfolio
7.9.3 Nagase ChemteX Die Attach Adhesives for Semiconductor Production, Value, Price and Gross Margin (2020-2025)
7.9.4 Nagase ChemteX Main Business and 麻豆原创s Served
7.9.5 Nagase ChemteX Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Die Attach Adhesives for Semiconductor Industry Chain Analysis
8.2 Die Attach Adhesives for Semiconductor Raw Material Supply Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Die Attach Adhesives for Semiconductor Production Mode & Process Analysis
8.4 Die Attach Adhesives for Semiconductor Sales and 麻豆原创ing
8.4.1 Die Attach Adhesives for Semiconductor Sales Channels
8.4.2 Die Attach Adhesives for Semiconductor Distributors
8.5 Die Attach Adhesives for Semiconductor Customer Analysis
9 Die Attach Adhesives for Semiconductor 麻豆原创 Dynamics
9.1 Die Attach Adhesives for Semiconductor Industry Trends
9.2 Die Attach Adhesives for Semiconductor 麻豆原创 Drivers
9.3 Die Attach Adhesives for Semiconductor 麻豆原创 Challenges
9.4 Die Attach Adhesives for Semiconductor 麻豆原创 Restraints
10 Research Findings and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Dupont
Henkel
Namics
AI Technology
Advanced Packaging
DELO
Protavic
Master Bond
Nagase ChemteX
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*If Applicable.
