Copper Foil for Printed Circuit Board is a thin layer of copper used as a substrate in the fabrication of printed circuit boards (PCBs). It provides the conductive pathways that connect various electronic components on the board. Copper foils with specific thicknesses and characteristics are used to meet the electrical and manufacturing requirements of different PCB designs.
The global Copper Foil for Printed Circuit Board market is projected to reach US$ 6046.9 million in 2029, increasing from US$ 5065.3 million in 2022, with the CAGR of 2.6% during the period of 2023 to 2029.
According to our Semiconductor Research Center, the global total output value of PCB was about US$ 81 billion in 2022. With strong drivers from new technology, such as AI, 5G and new energy vehicles, it is estimated that the PCB industry will continue to grow steadily in the next six years. Global PCB manufacturers are mainly located in China mainland, China Taiwan, Japan, South Korea, Europe and the United States. Among them, Chinese local PCB companies hold the biggest share.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Copper Foil for Printed Circuit Board market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
Fukuda
Mitsui Mining and Smelting
Furukawa Electric
JX Nippon Mining and Metal
Olin Brass
LS Mtron
Iljin Materials
CCP
NPC
Co-Tech
LYCT
Jinbao Electronics
Kingboard Chemical
NUODE
Tongling Nonferrous Metal Group
Segment by Type
Rolled Copper Foil
Electrolytic Copper Foil
Segment by Application
Direct Sales
Indirect Sales
Automobile Industry
Military and Aerospace
Other
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Copper Foil for Printed Circuit Board report covers below items:
Chapter 1: Product Basic Information (Definition, type and application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Âé¶¹Ô´´ Channel and Customer Analysis
Chapter 9: Âé¶¹Ô´´ Opportunities and Challenges
Chapter 10: Âé¶¹Ô´´ Conclusions
Chapter 11: Research Methodology and Data Source
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Overview
1.1 Product Definition
1.2 Copper Foil for Printed Circuit Board Segment by Type
1.2.1 Global Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 Rolled Copper Foil
1.2.3 Electrolytic Copper Foil
1.3 Copper Foil for Printed Circuit Board Segment by Application
1.3.1 Global Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Direct Sales
1.3.3 Indirect Sales
1.3.4 Automobile Industry
1.3.5 Military and Aerospace
1.3.6 Other
1.4 Global Âé¶¹Ô´´ Growth Prospects
1.4.1 Global Copper Foil for Printed Circuit Board Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Copper Foil for Printed Circuit Board Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Copper Foil for Printed Circuit Board Production Estimates and Forecasts (2018-2029)
1.4.4 Global Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Âé¶¹Ô´´ Competition by Manufacturers
2.1 Global Copper Foil for Printed Circuit Board Production Âé¶¹Ô´´ Share by Manufacturers (2018-2023)
2.2 Global Copper Foil for Printed Circuit Board Production Value Âé¶¹Ô´´ Share by Manufacturers (2018-2023)
2.3 Global Key Players of Copper Foil for Printed Circuit Board, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Copper Foil for Printed Circuit Board Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Copper Foil for Printed Circuit Board, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Copper Foil for Printed Circuit Board, Product Offered and Application
2.8 Global Key Manufacturers of Copper Foil for Printed Circuit Board, Date of Enter into This Industry
2.9 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Competitive Situation and Trends
2.9.1 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Concentration Rate
2.9.2 Global 5 and 10 Largest Copper Foil for Printed Circuit Board Players Âé¶¹Ô´´ Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Copper Foil for Printed Circuit Board Production by Region
3.1 Global Copper Foil for Printed Circuit Board Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Copper Foil for Printed Circuit Board Production Value by Region (2018-2029)
3.2.1 Global Copper Foil for Printed Circuit Board Production Value Âé¶¹Ô´´ Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Copper Foil for Printed Circuit Board by Region (2024-2029)
3.3 Global Copper Foil for Printed Circuit Board Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Copper Foil for Printed Circuit Board Production by Region (2018-2029)
3.4.1 Global Copper Foil for Printed Circuit Board Production Âé¶¹Ô´´ Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Copper Foil for Printed Circuit Board by Region (2024-2029)
3.5 Global Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Price Analysis by Region (2018-2023)
3.6 Global Copper Foil for Printed Circuit Board Production and Value, Year-over-Year Growth
3.6.1 North America Copper Foil for Printed Circuit Board Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Copper Foil for Printed Circuit Board Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Copper Foil for Printed Circuit Board Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Copper Foil for Printed Circuit Board Production Value Estimates and Forecasts (2018-2029)
4 Copper Foil for Printed Circuit Board Consumption by Region
4.1 Global Copper Foil for Printed Circuit Board Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Copper Foil for Printed Circuit Board Consumption by Region (2018-2029)
4.2.1 Global Copper Foil for Printed Circuit Board Consumption by Region (2018-2023)
4.2.2 Global Copper Foil for Printed Circuit Board Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Copper Foil for Printed Circuit Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Copper Foil for Printed Circuit Board Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Copper Foil for Printed Circuit Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Copper Foil for Printed Circuit Board Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Copper Foil for Printed Circuit Board Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Copper Foil for Printed Circuit Board Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Copper Foil for Printed Circuit Board Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Copper Foil for Printed Circuit Board Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Copper Foil for Printed Circuit Board Production by Type (2018-2029)
5.1.1 Global Copper Foil for Printed Circuit Board Production by Type (2018-2023)
5.1.2 Global Copper Foil for Printed Circuit Board Production by Type (2024-2029)
5.1.3 Global Copper Foil for Printed Circuit Board Production Âé¶¹Ô´´ Share by Type (2018-2029)
5.2 Global Copper Foil for Printed Circuit Board Production Value by Type (2018-2029)
5.2.1 Global Copper Foil for Printed Circuit Board Production Value by Type (2018-2023)
5.2.2 Global Copper Foil for Printed Circuit Board Production Value by Type (2024-2029)
5.2.3 Global Copper Foil for Printed Circuit Board Production Value Âé¶¹Ô´´ Share by Type (2018-2029)
5.3 Global Copper Foil for Printed Circuit Board Price by Type (2018-2029)
6 Segment by Application
6.1 Global Copper Foil for Printed Circuit Board Production by Application (2018-2029)
6.1.1 Global Copper Foil for Printed Circuit Board Production by Application (2018-2023)
6.1.2 Global Copper Foil for Printed Circuit Board Production by Application (2024-2029)
6.1.3 Global Copper Foil for Printed Circuit Board Production Âé¶¹Ô´´ Share by Application (2018-2029)
6.2 Global Copper Foil for Printed Circuit Board Production Value by Application (2018-2029)
6.2.1 Global Copper Foil for Printed Circuit Board Production Value by Application (2018-2023)
6.2.2 Global Copper Foil for Printed Circuit Board Production Value by Application (2024-2029)
6.2.3 Global Copper Foil for Printed Circuit Board Production Value Âé¶¹Ô´´ Share by Application (2018-2029)
6.3 Global Copper Foil for Printed Circuit Board Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Fukuda
7.1.1 Fukuda Copper Foil for Printed Circuit Board Corporation Information
7.1.2 Fukuda Copper Foil for Printed Circuit Board Product Portfolio
7.1.3 Fukuda Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Fukuda Main Business and Âé¶¹Ô´´s Served
7.1.5 Fukuda Recent Developments/Updates
7.2 Mitsui Mining and Smelting
7.2.1 Mitsui Mining and Smelting Copper Foil for Printed Circuit Board Corporation Information
7.2.2 Mitsui Mining and Smelting Copper Foil for Printed Circuit Board Product Portfolio
7.2.3 Mitsui Mining and Smelting Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Mitsui Mining and Smelting Main Business and Âé¶¹Ô´´s Served
7.2.5 Mitsui Mining and Smelting Recent Developments/Updates
7.3 Furukawa Electric
7.3.1 Furukawa Electric Copper Foil for Printed Circuit Board Corporation Information
7.3.2 Furukawa Electric Copper Foil for Printed Circuit Board Product Portfolio
7.3.3 Furukawa Electric Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Furukawa Electric Main Business and Âé¶¹Ô´´s Served
7.3.5 Furukawa Electric Recent Developments/Updates
7.4 JX Nippon Mining and Metal
7.4.1 JX Nippon Mining and Metal Copper Foil for Printed Circuit Board Corporation Information
7.4.2 JX Nippon Mining and Metal Copper Foil for Printed Circuit Board Product Portfolio
7.4.3 JX Nippon Mining and Metal Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.4.4 JX Nippon Mining and Metal Main Business and Âé¶¹Ô´´s Served
7.4.5 JX Nippon Mining and Metal Recent Developments/Updates
7.5 Olin Brass
7.5.1 Olin Brass Copper Foil for Printed Circuit Board Corporation Information
7.5.2 Olin Brass Copper Foil for Printed Circuit Board Product Portfolio
7.5.3 Olin Brass Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Olin Brass Main Business and Âé¶¹Ô´´s Served
7.5.5 Olin Brass Recent Developments/Updates
7.6 LS Mtron
7.6.1 LS Mtron Copper Foil for Printed Circuit Board Corporation Information
7.6.2 LS Mtron Copper Foil for Printed Circuit Board Product Portfolio
7.6.3 LS Mtron Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.6.4 LS Mtron Main Business and Âé¶¹Ô´´s Served
7.6.5 LS Mtron Recent Developments/Updates
7.7 Iljin Materials
7.7.1 Iljin Materials Copper Foil for Printed Circuit Board Corporation Information
7.7.2 Iljin Materials Copper Foil for Printed Circuit Board Product Portfolio
7.7.3 Iljin Materials Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.7.4 Iljin Materials Main Business and Âé¶¹Ô´´s Served
7.7.5 Iljin Materials Recent Developments/Updates
7.8 CCP
7.8.1 CCP Copper Foil for Printed Circuit Board Corporation Information
7.8.2 CCP Copper Foil for Printed Circuit Board Product Portfolio
7.8.3 CCP Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.8.4 CCP Main Business and Âé¶¹Ô´´s Served
7.7.5 CCP Recent Developments/Updates
7.9 NPC
7.9.1 NPC Copper Foil for Printed Circuit Board Corporation Information
7.9.2 NPC Copper Foil for Printed Circuit Board Product Portfolio
7.9.3 NPC Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.9.4 NPC Main Business and Âé¶¹Ô´´s Served
7.9.5 NPC Recent Developments/Updates
7.10 Co-Tech
7.10.1 Co-Tech Copper Foil for Printed Circuit Board Corporation Information
7.10.2 Co-Tech Copper Foil for Printed Circuit Board Product Portfolio
7.10.3 Co-Tech Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Co-Tech Main Business and Âé¶¹Ô´´s Served
7.10.5 Co-Tech Recent Developments/Updates
7.11 LYCT
7.11.1 LYCT Copper Foil for Printed Circuit Board Corporation Information
7.11.2 LYCT Copper Foil for Printed Circuit Board Product Portfolio
7.11.3 LYCT Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.11.4 LYCT Main Business and Âé¶¹Ô´´s Served
7.11.5 LYCT Recent Developments/Updates
7.12 Jinbao Electronics
7.12.1 Jinbao Electronics Copper Foil for Printed Circuit Board Corporation Information
7.12.2 Jinbao Electronics Copper Foil for Printed Circuit Board Product Portfolio
7.12.3 Jinbao Electronics Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Jinbao Electronics Main Business and Âé¶¹Ô´´s Served
7.12.5 Jinbao Electronics Recent Developments/Updates
7.13 Kingboard Chemical
7.13.1 Kingboard Chemical Copper Foil for Printed Circuit Board Corporation Information
7.13.2 Kingboard Chemical Copper Foil for Printed Circuit Board Product Portfolio
7.13.3 Kingboard Chemical Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Kingboard Chemical Main Business and Âé¶¹Ô´´s Served
7.13.5 Kingboard Chemical Recent Developments/Updates
7.14 NUODE
7.14.1 NUODE Copper Foil for Printed Circuit Board Corporation Information
7.14.2 NUODE Copper Foil for Printed Circuit Board Product Portfolio
7.14.3 NUODE Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.14.4 NUODE Main Business and Âé¶¹Ô´´s Served
7.14.5 NUODE Recent Developments/Updates
7.15 Tongling Nonferrous Metal Group
7.15.1 Tongling Nonferrous Metal Group Copper Foil for Printed Circuit Board Corporation Information
7.15.2 Tongling Nonferrous Metal Group Copper Foil for Printed Circuit Board Product Portfolio
7.15.3 Tongling Nonferrous Metal Group Copper Foil for Printed Circuit Board Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Tongling Nonferrous Metal Group Main Business and Âé¶¹Ô´´s Served
7.15.5 Tongling Nonferrous Metal Group Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Copper Foil for Printed Circuit Board Industry Chain Analysis
8.2 Copper Foil for Printed Circuit Board Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Copper Foil for Printed Circuit Board Production Mode & Process
8.4 Copper Foil for Printed Circuit Board Sales and Âé¶¹Ô´´ing
8.4.1 Copper Foil for Printed Circuit Board Sales Channels
8.4.2 Copper Foil for Printed Circuit Board Distributors
8.5 Copper Foil for Printed Circuit Board Customers
9 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Dynamics
9.1 Copper Foil for Printed Circuit Board Industry Trends
9.2 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Drivers
9.3 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Challenges
9.4 Copper Foil for Printed Circuit Board Âé¶¹Ô´´ Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Âé¶¹Ô´´ Size Estimation
11.1.3 Âé¶¹Ô´´ Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Fukuda
Mitsui Mining and Smelting
Furukawa Electric
JX Nippon Mining and Metal
Olin Brass
LS Mtron
Iljin Materials
CCP
NPC
Co-Tech
LYCT
Jinbao Electronics
Kingboard Chemical
NUODE
Tongling Nonferrous Metal Group
Ìý
Ìý
*If Applicable.