Compound semiconductor materials and devices refer to materials that are made by combining two or more elements from different groups in the periodic table. These materials exhibit unique electronic and optical properties, making them ideal for various applications in electronics, telecommunications, optoelectronics, and power electronics.
Some common types of compound semiconductors include:
Gallium arsenide (GaAs): Widely used in high-speed electronic devices, such as transistors, integrated circuits, and laser diodes.
Indium phosphide (InP): Used in high-frequency and high-power applications, including communication systems, laser diodes, and solar cells.
Gallium nitride (GaN): Known for its wide bandgap, GaN is used in high-frequency power amplifiers, LEDs, and radio frequency devices.
Silicon carbide (SiC): Known for its high-temperature stability and high breakdown voltage, SiC is used in power electronics, LED lighting, and advanced sensors.
Zinc selenide (ZnSe): Widely used in optoelectronic devices, such as lasers, LEDs, and photodiodes.
Copper indium gallium selenide (CIGS): Used in thin-film solar cells for photovoltaic applications.
Compound semiconductor devices include various electronic and optoelectronic components, such as transistors, diodes, lasers, photodetectors, solar cells, and integrated circuits. These devices offer advantages like high efficiency, high power density, and high-speed operation compared to traditional semiconductor devices made of silicon.
Compound semiconductor materials and devices play a crucial role in advancing technology and enabling various applications, including wireless communication, renewable energy, lighting, and medical devices.
The global Compound Semiconductor Material And Device market was valued at US$ 1052.6 million in 2023 and is anticipated to reach US$ 1435.7 million by 2030, witnessing a CAGR of 4.6% during the forecast period 2024-2030.
The global compound semiconductor material and device market refers to the market for materials and electronic devices that are based on compound semiconductors. Compound semiconductors are made by combining two or more elements from different groups of the periodic table, such as gallium arsenide (GaAs), indium phosphide (InP), and silicon carbide (SiC), among others.
Compound semiconductors offer several advantages over traditional silicon-based semiconductors, including higher electron mobility, wider energy bandgaps, and better thermal conductivity. These properties make compound semiconductors suitable for a wide range of applications, including optoelectronics, power electronics, radio frequency devices, and electronic integrated circuits.
The market for compound semiconductor materials and devices is driven by factors such as the increasing demand for high-speed and high-power electronic devices, advancements in wireless communication technologies, and the growing adoption of compound semiconductors in emerging applications like 5G communications, electric vehicles, and renewable energy systems.
The market is segmented based on the type of material and the type of device. Compound semiconductor materials include III-V semiconductors (such as GaAs, InP, and Gallium Nitride), II-VI semiconductors (such as Zinc Oxide and Cadmium Sulfide), and other compound materials. Compound semiconductor devices include lasers, photodetectors, transistors, diodes, and integrated circuits, among others.
Asia-Pacific is a prominent region in the compound semiconductor material and device market, driven by the presence of key market players, significant investments in research and development, and the growing demand for electronic devices and telecommunications infrastructure.
Key players in the global compound semiconductor material and device market include companies like Cree Inc., Samsung Electronics Co. Ltd., Qorvo Inc., Broadcom Inc., and Nichia Corporation, among others. These companies are involved in research, development, and manufacturing of compound semiconductor materials and devices.
The market is expected to witness significant growth in the coming years, driven by advancements in compound semiconductor technologies, the increasing demand for high-performance electronic devices, and the growing need for efficient energy solutions. However, challenges such as high manufacturing costs and limited availability of raw materials may hinder market growth to some extent.
This report aims to provide a comprehensive presentation of the global market for Compound Semiconductor Material And Device, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Compound Semiconductor Material And Device.
Report Scope
The Compound Semiconductor Material And Device market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Compound Semiconductor Material And Device market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Compound Semiconductor Material And Device companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Cree Inc.
IQE plc
Nichia Corporation
Sumitomo Electric Industries, Ltd.
II-VI Incorporated
Samsung Electronics Co., Ltd.
Broadcom Inc.
Texas Instruments Inc.
Infineon Technologies AG
MACOM Technology Solutions Holdings, Inc.
NXP Semiconductors N.V.
Taiwan Semiconductor Manufacturing Company (TSMC)
Stmicroelectronics
Freescale Semiconductor
Texas Instruments
Renesas Electronics
Koninklijke Philips
International Quantum Epitaxy
Toshiba America Electronic Components, Inc.
Mitsubishi Electric Corporation
Analog Devices, Inc.
Skyworks Solutions, Inc.
Segment by Type
SiGe
GaAs
GaN
ZnSe
InP
SiC
InGaAlP
InGaN
Others
Segment by Application
Automotive
Medical
ICT Industry
Energy Industry
Consumer Electronics
Aerospace and Defense
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Compound Semiconductor Material And Device companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Compound Semiconductor Material And Device 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 SiGe
1.2.3 GaAs
1.2.4 GaN
1.2.5 ZnSe
1.2.6 InP
1.2.7 SiC
1.2.8 InGaAlP
1.2.9 InGaN
1.2.10 Others
1.3 麻豆原创 by Application
1.3.1 Global Compound Semiconductor Material And Device 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Automotive
1.3.3 Medical
1.3.4 ICT Industry
1.3.5 Energy Industry
1.3.6 Consumer Electronics
1.3.7 Aerospace and Defense
1.3.8 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Compound Semiconductor Material And Device 麻豆原创 Perspective (2019-2030)
2.2 Compound Semiconductor Material And Device Growth Trends by Region
2.2.1 Global Compound Semiconductor Material And Device 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 Compound Semiconductor Material And Device Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 Compound Semiconductor Material And Device Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 Compound Semiconductor Material And Device 麻豆原创 Dynamics
2.3.1 Compound Semiconductor Material And Device Industry Trends
2.3.2 Compound Semiconductor Material And Device 麻豆原创 Drivers
2.3.3 Compound Semiconductor Material And Device 麻豆原创 Challenges
2.3.4 Compound Semiconductor Material And Device 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Compound Semiconductor Material And Device Players by Revenue
3.1.1 Global Top Compound Semiconductor Material And Device Players by Revenue (2019-2024)
3.1.2 Global Compound Semiconductor Material And Device Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global Compound Semiconductor Material And Device 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Compound Semiconductor Material And Device Revenue
3.4 Global Compound Semiconductor Material And Device 麻豆原创 Concentration Ratio
3.4.1 Global Compound Semiconductor Material And Device 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Compound Semiconductor Material And Device Revenue in 2023
3.5 Compound Semiconductor Material And Device Key Players Head office and Area Served
3.6 Key Players Compound Semiconductor Material And Device Product Solution and Service
3.7 Date of Enter into Compound Semiconductor Material And Device 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Compound Semiconductor Material And Device Breakdown Data by Type
4.1 Global Compound Semiconductor Material And Device Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global Compound Semiconductor Material And Device Forecasted 麻豆原创 Size by Type (2025-2030)
5 Compound Semiconductor Material And Device Breakdown Data by Application
5.1 Global Compound Semiconductor Material And Device Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global Compound Semiconductor Material And Device Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America Compound Semiconductor Material And Device 麻豆原创 Size (2019-2030)
6.2 North America Compound Semiconductor Material And Device 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Compound Semiconductor Material And Device 麻豆原创 Size by Country (2019-2024)
6.4 North America Compound Semiconductor Material And Device 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Compound Semiconductor Material And Device 麻豆原创 Size (2019-2030)
7.2 Europe Compound Semiconductor Material And Device 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Compound Semiconductor Material And Device 麻豆原创 Size by Country (2019-2024)
7.4 Europe Compound Semiconductor Material And Device 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Compound Semiconductor Material And Device 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific Compound Semiconductor Material And Device 麻豆原创 Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Compound Semiconductor Material And Device 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific Compound Semiconductor Material And Device 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Compound Semiconductor Material And Device 麻豆原创 Size (2019-2030)
9.2 Latin America Compound Semiconductor Material And Device 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Compound Semiconductor Material And Device 麻豆原创 Size by Country (2019-2024)
9.4 Latin America Compound Semiconductor Material And Device 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Compound Semiconductor Material And Device 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa Compound Semiconductor Material And Device 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Compound Semiconductor Material And Device 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa Compound Semiconductor Material And Device 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Cree Inc.
11.1.1 Cree Inc. Company Detail
11.1.2 Cree Inc. Business Overview
11.1.3 Cree Inc. Compound Semiconductor Material And Device Introduction
11.1.4 Cree Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.1.5 Cree Inc. Recent Development
11.2 IQE plc
11.2.1 IQE plc Company Detail
11.2.2 IQE plc Business Overview
11.2.3 IQE plc Compound Semiconductor Material And Device Introduction
11.2.4 IQE plc Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.2.5 IQE plc Recent Development
11.3 Nichia Corporation
11.3.1 Nichia Corporation Company Detail
11.3.2 Nichia Corporation Business Overview
11.3.3 Nichia Corporation Compound Semiconductor Material And Device Introduction
11.3.4 Nichia Corporation Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.3.5 Nichia Corporation Recent Development
11.4 Sumitomo Electric Industries, Ltd.
11.4.1 Sumitomo Electric Industries, Ltd. Company Detail
11.4.2 Sumitomo Electric Industries, Ltd. Business Overview
11.4.3 Sumitomo Electric Industries, Ltd. Compound Semiconductor Material And Device Introduction
11.4.4 Sumitomo Electric Industries, Ltd. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.4.5 Sumitomo Electric Industries, Ltd. Recent Development
11.5 II-VI Incorporated
11.5.1 II-VI Incorporated Company Detail
11.5.2 II-VI Incorporated Business Overview
11.5.3 II-VI Incorporated Compound Semiconductor Material And Device Introduction
11.5.4 II-VI Incorporated Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.5.5 II-VI Incorporated Recent Development
11.6 Samsung Electronics Co., Ltd.
11.6.1 Samsung Electronics Co., Ltd. Company Detail
11.6.2 Samsung Electronics Co., Ltd. Business Overview
11.6.3 Samsung Electronics Co., Ltd. Compound Semiconductor Material And Device Introduction
11.6.4 Samsung Electronics Co., Ltd. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.6.5 Samsung Electronics Co., Ltd. Recent Development
11.7 Broadcom Inc.
11.7.1 Broadcom Inc. Company Detail
11.7.2 Broadcom Inc. Business Overview
11.7.3 Broadcom Inc. Compound Semiconductor Material And Device Introduction
11.7.4 Broadcom Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.7.5 Broadcom Inc. Recent Development
11.8 Texas Instruments Inc.
11.8.1 Texas Instruments Inc. Company Detail
11.8.2 Texas Instruments Inc. Business Overview
11.8.3 Texas Instruments Inc. Compound Semiconductor Material And Device Introduction
11.8.4 Texas Instruments Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.8.5 Texas Instruments Inc. Recent Development
11.9 Infineon Technologies AG
11.9.1 Infineon Technologies AG Company Detail
11.9.2 Infineon Technologies AG Business Overview
11.9.3 Infineon Technologies AG Compound Semiconductor Material And Device Introduction
11.9.4 Infineon Technologies AG Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.9.5 Infineon Technologies AG Recent Development
11.10 MACOM Technology Solutions Holdings, Inc.
11.10.1 MACOM Technology Solutions Holdings, Inc. Company Detail
11.10.2 MACOM Technology Solutions Holdings, Inc. Business Overview
11.10.3 MACOM Technology Solutions Holdings, Inc. Compound Semiconductor Material And Device Introduction
11.10.4 MACOM Technology Solutions Holdings, Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.10.5 MACOM Technology Solutions Holdings, Inc. Recent Development
11.11 NXP Semiconductors N.V.
11.11.1 NXP Semiconductors N.V. Company Detail
11.11.2 NXP Semiconductors N.V. Business Overview
11.11.3 NXP Semiconductors N.V. Compound Semiconductor Material And Device Introduction
11.11.4 NXP Semiconductors N.V. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.11.5 NXP Semiconductors N.V. Recent Development
11.12 Taiwan Semiconductor Manufacturing Company (TSMC)
11.12.1 Taiwan Semiconductor Manufacturing Company (TSMC) Company Detail
11.12.2 Taiwan Semiconductor Manufacturing Company (TSMC) Business Overview
11.12.3 Taiwan Semiconductor Manufacturing Company (TSMC) Compound Semiconductor Material And Device Introduction
11.12.4 Taiwan Semiconductor Manufacturing Company (TSMC) Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.12.5 Taiwan Semiconductor Manufacturing Company (TSMC) Recent Development
11.13 Stmicroelectronics
11.13.1 Stmicroelectronics Company Detail
11.13.2 Stmicroelectronics Business Overview
11.13.3 Stmicroelectronics Compound Semiconductor Material And Device Introduction
11.13.4 Stmicroelectronics Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.13.5 Stmicroelectronics Recent Development
11.14 Freescale Semiconductor
11.14.1 Freescale Semiconductor Company Detail
11.14.2 Freescale Semiconductor Business Overview
11.14.3 Freescale Semiconductor Compound Semiconductor Material And Device Introduction
11.14.4 Freescale Semiconductor Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.14.5 Freescale Semiconductor Recent Development
11.15 Texas Instruments
11.15.1 Texas Instruments Company Detail
11.15.2 Texas Instruments Business Overview
11.15.3 Texas Instruments Compound Semiconductor Material And Device Introduction
11.15.4 Texas Instruments Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.15.5 Texas Instruments Recent Development
11.16 Renesas Electronics
11.16.1 Renesas Electronics Company Detail
11.16.2 Renesas Electronics Business Overview
11.16.3 Renesas Electronics Compound Semiconductor Material And Device Introduction
11.16.4 Renesas Electronics Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.16.5 Renesas Electronics Recent Development
11.17 Koninklijke Philips
11.17.1 Koninklijke Philips Company Detail
11.17.2 Koninklijke Philips Business Overview
11.17.3 Koninklijke Philips Compound Semiconductor Material And Device Introduction
11.17.4 Koninklijke Philips Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.17.5 Koninklijke Philips Recent Development
11.18 International Quantum Epitaxy
11.18.1 International Quantum Epitaxy Company Detail
11.18.2 International Quantum Epitaxy Business Overview
11.18.3 International Quantum Epitaxy Compound Semiconductor Material And Device Introduction
11.18.4 International Quantum Epitaxy Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.18.5 International Quantum Epitaxy Recent Development
11.19 Toshiba America Electronic Components, Inc.
11.19.1 Toshiba America Electronic Components, Inc. Company Detail
11.19.2 Toshiba America Electronic Components, Inc. Business Overview
11.19.3 Toshiba America Electronic Components, Inc. Compound Semiconductor Material And Device Introduction
11.19.4 Toshiba America Electronic Components, Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.19.5 Toshiba America Electronic Components, Inc. Recent Development
11.20 Mitsubishi Electric Corporation
11.20.1 Mitsubishi Electric Corporation Company Detail
11.20.2 Mitsubishi Electric Corporation Business Overview
11.20.3 Mitsubishi Electric Corporation Compound Semiconductor Material And Device Introduction
11.20.4 Mitsubishi Electric Corporation Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.20.5 Mitsubishi Electric Corporation Recent Development
11.21 Analog Devices, Inc.
11.21.1 Analog Devices, Inc. Company Detail
11.21.2 Analog Devices, Inc. Business Overview
11.21.3 Analog Devices, Inc. Compound Semiconductor Material And Device Introduction
11.21.4 Analog Devices, Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.21.5 Analog Devices, Inc. Recent Development
11.22 Skyworks Solutions, Inc.
11.22.1 Skyworks Solutions, Inc. Company Detail
11.22.2 Skyworks Solutions, Inc. Business Overview
11.22.3 Skyworks Solutions, Inc. Compound Semiconductor Material And Device Introduction
11.22.4 Skyworks Solutions, Inc. Revenue in Compound Semiconductor Material And Device Business (2019-2024)
11.22.5 Skyworks Solutions, Inc. Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Cree Inc.
IQE plc
Nichia Corporation
Sumitomo Electric Industries, Ltd.
II-VI Incorporated
Samsung Electronics Co., Ltd.
Broadcom Inc.
Texas Instruments Inc.
Infineon Technologies AG
MACOM Technology Solutions Holdings, Inc.
NXP Semiconductors N.V.
Taiwan Semiconductor Manufacturing Company (TSMC)
Stmicroelectronics
Freescale Semiconductor
Texas Instruments
Renesas Electronics
Koninklijke Philips
International Quantum Epitaxy
Toshiba America Electronic Components, Inc.
Mitsubishi Electric Corporation
Analog Devices, Inc.
Skyworks Solutions, Inc.
听
听
*If Applicable.
