Global Chip Design Platform as a Service 麻豆原创 Research Report 2024

Publication ID:

PB507244626

Publication Date:

July 16, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

The global Chip Design Platform as a Service market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Chip Design Platform as a Service, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Design Platform as a Service.
Report Scope
The Chip Design Platform as a Service market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Chip Design Platform as a Service market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Chip Design Platform as a Service companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
VeriSilicon
Cyient
Marvell
MediaTek Inc
Microsemi/Microchip
Segment by Type
IP-centric
Platform-based Custom Silicon Solutions
End-to-end Semiconductor Turnkey Service
Other
Segment by Application
Mobile Internet Devices
Data Center
Internet of Things (IoT)
Wearable Electronics
Smart 麻豆原创
Automobile
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Chip Design Platform as a Service companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Chip Design Platform as a Service 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 IP-centric
1.2.3 Platform-based Custom Silicon Solutions
1.2.4 End-to-end Semiconductor Turnkey Service
1.2.5 Other
1.3 麻豆原创 by Application
1.3.1 Global Chip Design Platform as a Service 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Mobile Internet Devices
1.3.3 Data Center
1.3.4 Internet of Things (IoT)
1.3.5 Wearable Electronics
1.3.6 Smart 麻豆原创
1.3.7 Automobile
1.3.8 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Design Platform as a Service 麻豆原创 Perspective (2019-2030)
2.2 Chip Design Platform as a Service Growth Trends by Region
2.2.1 Global Chip Design Platform as a Service 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 Chip Design Platform as a Service Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 Chip Design Platform as a Service Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 Chip Design Platform as a Service 麻豆原创 Dynamics
2.3.1 Chip Design Platform as a Service Industry Trends
2.3.2 Chip Design Platform as a Service 麻豆原创 Drivers
2.3.3 Chip Design Platform as a Service 麻豆原创 Challenges
2.3.4 Chip Design Platform as a Service 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Design Platform as a Service Players by Revenue
3.1.1 Global Top Chip Design Platform as a Service Players by Revenue (2019-2024)
3.1.2 Global Chip Design Platform as a Service Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global Chip Design Platform as a Service 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Design Platform as a Service Revenue
3.4 Global Chip Design Platform as a Service 麻豆原创 Concentration Ratio
3.4.1 Global Chip Design Platform as a Service 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Design Platform as a Service Revenue in 2023
3.5 Chip Design Platform as a Service Key Players Head office and Area Served
3.6 Key Players Chip Design Platform as a Service Product Solution and Service
3.7 Date of Enter into Chip Design Platform as a Service 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Design Platform as a Service Breakdown Data by Type
4.1 Global Chip Design Platform as a Service Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global Chip Design Platform as a Service Forecasted 麻豆原创 Size by Type (2025-2030)
5 Chip Design Platform as a Service Breakdown Data by Application
5.1 Global Chip Design Platform as a Service Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global Chip Design Platform as a Service Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America Chip Design Platform as a Service 麻豆原创 Size (2019-2030)
6.2 North America Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Chip Design Platform as a Service 麻豆原创 Size by Country (2019-2024)
6.4 North America Chip Design Platform as a Service 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Design Platform as a Service 麻豆原创 Size (2019-2030)
7.2 Europe Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Chip Design Platform as a Service 麻豆原创 Size by Country (2019-2024)
7.4 Europe Chip Design Platform as a Service 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Design Platform as a Service 麻豆原创 Size (2019-2030)
9.2 Latin America Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Chip Design Platform as a Service 麻豆原创 Size by Country (2019-2024)
9.4 Latin America Chip Design Platform as a Service 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 VeriSilicon
11.1.1 VeriSilicon Company Detail
11.1.2 VeriSilicon Business Overview
11.1.3 VeriSilicon Chip Design Platform as a Service Introduction
11.1.4 VeriSilicon Revenue in Chip Design Platform as a Service Business (2019-2024)
11.1.5 VeriSilicon Recent Development
11.2 Cyient
11.2.1 Cyient Company Detail
11.2.2 Cyient Business Overview
11.2.3 Cyient Chip Design Platform as a Service Introduction
11.2.4 Cyient Revenue in Chip Design Platform as a Service Business (2019-2024)
11.2.5 Cyient Recent Development
11.3 Marvell
11.3.1 Marvell Company Detail
11.3.2 Marvell Business Overview
11.3.3 Marvell Chip Design Platform as a Service Introduction
11.3.4 Marvell Revenue in Chip Design Platform as a Service Business (2019-2024)
11.3.5 Marvell Recent Development
11.4 MediaTek Inc
11.4.1 MediaTek Inc Company Detail
11.4.2 MediaTek Inc Business Overview
11.4.3 MediaTek Inc Chip Design Platform as a Service Introduction
11.4.4 MediaTek Inc Revenue in Chip Design Platform as a Service Business (2019-2024)
11.4.5 MediaTek Inc Recent Development
11.5 Microsemi/Microchip
11.5.1 Microsemi/Microchip Company Detail
11.5.2 Microsemi/Microchip Business Overview
11.5.3 Microsemi/Microchip Chip Design Platform as a Service Introduction
11.5.4 Microsemi/Microchip Revenue in Chip Design Platform as a Service Business (2019-2024)
11.5.5 Microsemi/Microchip Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

VeriSilicon
Cyient
Marvell
MediaTek Inc
Microsemi/Microchip

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.