Global Chip Design Platform as a Service 麻豆原创 Research Report 2023

Publication ID:

PB511232258

Publication Date:

November 7, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

IT Services [2]

Computing & Electronics [3]

Description:

The global Chip Design Platform as a Service market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Chip Design Platform as a Service market with multiple angles, which provides sufficient supports to readers鈥� strategy and decision making.
By Company
VeriSilicon
Cyient
Marvell
MediaTek Inc
Microsemi/Microchip
Segment by Type
IP-centric
Platform-based Custom Silicon Solutions
End-to-end Semiconductor Turnkey Service
Other
Segment by Application
Mobile Internet Devices
Data Center
Internet of Things (IoT)
Wearable Electronics
Smart 麻豆原创
Automobile
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
The Chip Design Platform as a Service report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Global market size, regional market size. 麻豆原创 Opportunities and Challenges
Chapter 3: Companies鈥� Competition Patterns
Chapter 4: Product Type Analysis
Chapter 5: Product Application Analysis
Chapter 6 to 10: Country Level Value Analysis
Chapter 11: Companies鈥� Outline
Chapter 12: 麻豆原创 Conclusions
Chapter 13: Research Methodology and Data Source

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Chip Design Platform as a Service 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 IP-centric
1.2.3 Platform-based Custom Silicon Solutions
1.2.4 End-to-end Semiconductor Turnkey Service
1.2.5 Other
1.3 麻豆原创 by Application
1.3.1 Global Chip Design Platform as a Service 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Mobile Internet Devices
1.3.3 Data Center
1.3.4 Internet of Things (IoT)
1.3.5 Wearable Electronics
1.3.6 Smart 麻豆原创
1.3.7 Automobile
1.3.8 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Chip Design Platform as a Service 麻豆原创 Perspective (2018-2029)
2.2 Chip Design Platform as a Service Growth Trends by Region
2.2.1 Global Chip Design Platform as a Service 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 Chip Design Platform as a Service Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 Chip Design Platform as a Service Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 Chip Design Platform as a Service 麻豆原创 Dynamics
2.3.1 Chip Design Platform as a Service Industry Trends
2.3.2 Chip Design Platform as a Service 麻豆原创 Drivers
2.3.3 Chip Design Platform as a Service 麻豆原创 Challenges
2.3.4 Chip Design Platform as a Service 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Chip Design Platform as a Service Players by Revenue
3.1.1 Global Top Chip Design Platform as a Service Players by Revenue (2018-2023)
3.1.2 Global Chip Design Platform as a Service Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global Chip Design Platform as a Service 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Chip Design Platform as a Service Revenue
3.4 Global Chip Design Platform as a Service 麻豆原创 Concentration Ratio
3.4.1 Global Chip Design Platform as a Service 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Chip Design Platform as a Service Revenue in 2022
3.5 Chip Design Platform as a Service Key Players Head office and Area Served
3.6 Key Players Chip Design Platform as a Service Product Solution and Service
3.7 Date of Enter into Chip Design Platform as a Service 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Chip Design Platform as a Service Breakdown Data by Type
4.1 Global Chip Design Platform as a Service Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global Chip Design Platform as a Service Forecasted 麻豆原创 Size by Type (2024-2029)
5 Chip Design Platform as a Service Breakdown Data by Application
5.1 Global Chip Design Platform as a Service Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global Chip Design Platform as a Service Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America Chip Design Platform as a Service 麻豆原创 Size (2018-2029)
6.2 North America Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Chip Design Platform as a Service 麻豆原创 Size by Country (2018-2023)
6.4 North America Chip Design Platform as a Service 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Chip Design Platform as a Service 麻豆原创 Size (2018-2029)
7.2 Europe Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Chip Design Platform as a Service 麻豆原创 Size by Country (2018-2023)
7.4 Europe Chip Design Platform as a Service 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific Chip Design Platform as a Service 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Chip Design Platform as a Service 麻豆原创 Size (2018-2029)
9.2 Latin America Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Chip Design Platform as a Service 麻豆原创 Size by Country (2018-2023)
9.4 Latin America Chip Design Platform as a Service 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa Chip Design Platform as a Service 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 VeriSilicon
11.1.1 VeriSilicon Company Detail
11.1.2 VeriSilicon Business Overview
11.1.3 VeriSilicon Chip Design Platform as a Service Introduction
11.1.4 VeriSilicon Revenue in Chip Design Platform as a Service Business (2018-2023)
11.1.5 VeriSilicon Recent Development
11.2 Cyient
11.2.1 Cyient Company Detail
11.2.2 Cyient Business Overview
11.2.3 Cyient Chip Design Platform as a Service Introduction
11.2.4 Cyient Revenue in Chip Design Platform as a Service Business (2018-2023)
11.2.5 Cyient Recent Development
11.3 Marvell
11.3.1 Marvell Company Detail
11.3.2 Marvell Business Overview
11.3.3 Marvell Chip Design Platform as a Service Introduction
11.3.4 Marvell Revenue in Chip Design Platform as a Service Business (2018-2023)
11.3.5 Marvell Recent Development
11.4 MediaTek Inc
11.4.1 MediaTek Inc Company Detail
11.4.2 MediaTek Inc Business Overview
11.4.3 MediaTek Inc Chip Design Platform as a Service Introduction
11.4.4 MediaTek Inc Revenue in Chip Design Platform as a Service Business (2018-2023)
11.4.5 MediaTek Inc Recent Development
11.5 Microsemi/Microchip
11.5.1 Microsemi/Microchip Company Detail
11.5.2 Microsemi/Microchip Business Overview
11.5.3 Microsemi/Microchip Chip Design Platform as a Service Introduction
11.5.4 Microsemi/Microchip Revenue in Chip Design Platform as a Service Business (2018-2023)
11.5.5 Microsemi/Microchip Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

VeriSilicon
Cyient
Marvell
MediaTek Inc
Microsemi/Microchip

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