BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB).
The global BGA Packaging Solder Ball market was valued at US$ 154.3 million in 2023 and is anticipated to reach US$ 236.3 million by 2030, witnessing a CAGR of 6.2% during the forecast period 2024-2030.
麻豆原创 Drivers: Miniaturization of Electronic Devices: The trend toward smaller and more compact electronic devices, such as smartphones, tablets, and wearables, drives the demand for BGA packaging with solder balls. BGA offers a high pin count in a smaller footprint, making it suitable for miniaturized electronics.
Increasing Demand for High-Performance Computing: Growing demand for high-performance computing, data centers, and graphics processing units (GPUs) fuels the adoption of advanced packaging solutions like BGA. Solder balls contribute to the reliability and thermal performance of these high-power components.
Advancements in Semiconductor Technology: Ongoing advancements in semiconductor manufacturing technologies, including finer pitch and higher pin counts, necessitate the development of solder balls with improved materials and manufacturing processes to meet the requirements of next-generation electronic devices.
Rise in Internet of Things (IoT) Devices: The proliferation of IoT devices, which require compact and efficient packaging solutions, boosts the demand for BGA packaging with solder balls. BGA technology supports the integration of sensors and processors in small form factors.
Consumer Electronics Industry Growth: The consumer electronics industry's continual growth, driven by innovations in smartphones, laptops, gaming consoles, and other electronic gadgets, contributes significantly to the demand for BGA packaging solder balls.
麻豆原创 Restrictions: Cost and Complexity of Manufacturing: The manufacturing processes involved in producing BGA packaging with solder balls can be complex and may require advanced equipment. The associated costs, including material and manufacturing expenses, could be a limitation for some manufacturers or applications.
Stringent Quality and Compliance Standards: Industries such as aerospace and automotive have stringent quality and compliance standards. Meeting these standards, including requirements for high-reliability solder joints, can be challenging and may act as a restriction for certain applications.
This report aims to provide a comprehensive presentation of the global market for BGA Packaging Solder Ball, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding BGA Packaging Solder Ball.
Report Scope
The BGA Packaging Solder Ball market size, estimations, and forecasts are provided in terms of output/shipments (Million Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global BGA Packaging Solder Ball market comprehensively. Regional market sizes, concerning products by Diameter, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the BGA Packaging Solder Ball manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Diameter, by Application, and by regions.
麻豆原创 Segmentation
By Company
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Segment by Diameter
Up to 0.2 mm
0.2-0.5 mm
Above 0.5 mm
Segment by Application
IDM
OSAT
Production by Region
North America
Europe
China
Japan
South Korea
Taiwan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Netherlands
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Diameter, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of BGA Packaging Solder Ball manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of BGA Packaging Solder Ball by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of BGA Packaging Solder Ball in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Diameter, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 BGA Packaging Solder Ball 麻豆原创 Overview
1.1 Product Definition
1.2 BGA Packaging Solder Ball Segment by Diameter
1.2.1 Global BGA Packaging Solder Ball 麻豆原创 Value Growth Rate Analysis by Diameter 2023 VS 2030
1.2.2 Up to 0.2 mm
1.2.3 0.2-0.5 mm
1.2.4 Above 0.5 mm
1.3 BGA Packaging Solder Ball Segment by Application
1.3.1 Global BGA Packaging Solder Ball 麻豆原创 Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 IDM
1.3.3 OSAT
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global BGA Packaging Solder Ball Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global BGA Packaging Solder Ball Production Estimates and Forecasts (2019-2030)
1.4.4 Global BGA Packaging Solder Ball 麻豆原创 Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global BGA Packaging Solder Ball Production 麻豆原创 Share by Manufacturers (2019-2024)
2.2 Global BGA Packaging Solder Ball Production Value 麻豆原创 Share by Manufacturers (2019-2024)
2.3 Global Key Players of BGA Packaging Solder Ball, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global BGA Packaging Solder Ball 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global BGA Packaging Solder Ball Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of BGA Packaging Solder Ball, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of BGA Packaging Solder Ball, Product Offered and Application
2.8 Global Key Manufacturers of BGA Packaging Solder Ball, Date of Enter into This Industry
2.9 BGA Packaging Solder Ball 麻豆原创 Competitive Situation and Trends
2.9.1 BGA Packaging Solder Ball 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest BGA Packaging Solder Ball Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 BGA Packaging Solder Ball Production by Region
3.1 Global BGA Packaging Solder Ball Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global BGA Packaging Solder Ball Production Value by Region (2019-2030)
3.2.1 Global BGA Packaging Solder Ball Production Value 麻豆原创 Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of BGA Packaging Solder Ball by Region (2025-2030)
3.3 Global BGA Packaging Solder Ball Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global BGA Packaging Solder Ball Production by Region (2019-2030)
3.4.1 Global BGA Packaging Solder Ball Production 麻豆原创 Share by Region (2019-2024)
3.4.2 Global Forecasted Production of BGA Packaging Solder Ball by Region (2025-2030)
3.5 Global BGA Packaging Solder Ball 麻豆原创 Price Analysis by Region (2019-2024)
3.6 Global BGA Packaging Solder Ball Production and Value, Year-over-Year Growth
3.6.1 North America BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.3 China BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.5 South Korea BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
3.6.6 Taiwan BGA Packaging Solder Ball Production Value Estimates and Forecasts (2019-2030)
4 BGA Packaging Solder Ball Consumption by Region
4.1 Global BGA Packaging Solder Ball Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global BGA Packaging Solder Ball Consumption by Region (2019-2030)
4.2.1 Global BGA Packaging Solder Ball Consumption by Region (2019-2024)
4.2.2 Global BGA Packaging Solder Ball Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America BGA Packaging Solder Ball Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe BGA Packaging Solder Ball Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Netherlands
4.5 Asia Pacific
4.5.1 Asia Pacific BGA Packaging Solder Ball Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific BGA Packaging Solder Ball Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa BGA Packaging Solder Ball Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
4.6.6 GCC Countries
5 Segment by Diameter
5.1 Global BGA Packaging Solder Ball Production by Diameter (2019-2030)
5.1.1 Global BGA Packaging Solder Ball Production by Diameter (2019-2024)
5.1.2 Global BGA Packaging Solder Ball Production by Diameter (2025-2030)
5.1.3 Global BGA Packaging Solder Ball Production 麻豆原创 Share by Diameter (2019-2030)
5.2 Global BGA Packaging Solder Ball Production Value by Diameter (2019-2030)
5.2.1 Global BGA Packaging Solder Ball Production Value by Diameter (2019-2024)
5.2.2 Global BGA Packaging Solder Ball Production Value by Diameter (2025-2030)
5.2.3 Global BGA Packaging Solder Ball Production Value 麻豆原创 Share by Diameter (2019-2030)
5.3 Global BGA Packaging Solder Ball Price by Diameter (2019-2030)
6 Segment by Application
6.1 Global BGA Packaging Solder Ball Production by Application (2019-2030)
6.1.1 Global BGA Packaging Solder Ball Production by Application (2019-2024)
6.1.2 Global BGA Packaging Solder Ball Production by Application (2025-2030)
6.1.3 Global BGA Packaging Solder Ball Production 麻豆原创 Share by Application (2019-2030)
6.2 Global BGA Packaging Solder Ball Production Value by Application (2019-2030)
6.2.1 Global BGA Packaging Solder Ball Production Value by Application (2019-2024)
6.2.2 Global BGA Packaging Solder Ball Production Value by Application (2025-2030)
6.2.3 Global BGA Packaging Solder Ball Production Value 麻豆原创 Share by Application (2019-2030)
6.3 Global BGA Packaging Solder Ball Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Senju Metal
7.1.1 Senju Metal BGA Packaging Solder Ball Corporation Information
7.1.2 Senju Metal BGA Packaging Solder Ball Product Portfolio
7.1.3 Senju Metal BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Senju Metal Main Business and 麻豆原创s Served
7.1.5 Senju Metal Recent Developments/Updates
7.2 Accurus
7.2.1 Accurus BGA Packaging Solder Ball Corporation Information
7.2.2 Accurus BGA Packaging Solder Ball Product Portfolio
7.2.3 Accurus BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Accurus Main Business and 麻豆原创s Served
7.2.5 Accurus Recent Developments/Updates
7.3 DS HiMetal
7.3.1 DS HiMetal BGA Packaging Solder Ball Corporation Information
7.3.2 DS HiMetal BGA Packaging Solder Ball Product Portfolio
7.3.3 DS HiMetal BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.3.4 DS HiMetal Main Business and 麻豆原创s Served
7.3.5 DS HiMetal Recent Developments/Updates
7.4 NMC
7.4.1 NMC BGA Packaging Solder Ball Corporation Information
7.4.2 NMC BGA Packaging Solder Ball Product Portfolio
7.4.3 NMC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.4.4 NMC Main Business and 麻豆原创s Served
7.4.5 NMC Recent Developments/Updates
7.5 MKE
7.5.1 MKE BGA Packaging Solder Ball Corporation Information
7.5.2 MKE BGA Packaging Solder Ball Product Portfolio
7.5.3 MKE BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.5.4 MKE Main Business and 麻豆原创s Served
7.5.5 MKE Recent Developments/Updates
7.6 PMTC
7.6.1 PMTC BGA Packaging Solder Ball Corporation Information
7.6.2 PMTC BGA Packaging Solder Ball Product Portfolio
7.6.3 PMTC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.6.4 PMTC Main Business and 麻豆原创s Served
7.6.5 PMTC Recent Developments/Updates
7.7 Indium Corporation
7.7.1 Indium Corporation BGA Packaging Solder Ball Corporation Information
7.7.2 Indium Corporation BGA Packaging Solder Ball Product Portfolio
7.7.3 Indium Corporation BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Indium Corporation Main Business and 麻豆原创s Served
7.7.5 Indium Corporation Recent Developments/Updates
7.8 YCTC
7.8.1 YCTC BGA Packaging Solder Ball Corporation Information
7.8.2 YCTC BGA Packaging Solder Ball Product Portfolio
7.8.3 YCTC BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.8.4 YCTC Main Business and 麻豆原创s Served
7.7.5 YCTC Recent Developments/Updates
7.9 Shenmao Technology
7.9.1 Shenmao Technology BGA Packaging Solder Ball Corporation Information
7.9.2 Shenmao Technology BGA Packaging Solder Ball Product Portfolio
7.9.3 Shenmao Technology BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shenmao Technology Main Business and 麻豆原创s Served
7.9.5 Shenmao Technology Recent Developments/Updates
7.10 Shanghai hiking solder material
7.10.1 Shanghai hiking solder material BGA Packaging Solder Ball Corporation Information
7.10.2 Shanghai hiking solder material BGA Packaging Solder Ball Product Portfolio
7.10.3 Shanghai hiking solder material BGA Packaging Solder Ball Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Shanghai hiking solder material Main Business and 麻豆原创s Served
7.10.5 Shanghai hiking solder material Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 BGA Packaging Solder Ball Industry Chain Analysis
8.2 BGA Packaging Solder Ball Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 BGA Packaging Solder Ball Production Mode & Process
8.4 BGA Packaging Solder Ball Sales and 麻豆原创ing
8.4.1 BGA Packaging Solder Ball Sales Channels
8.4.2 BGA Packaging Solder Ball Distributors
8.5 BGA Packaging Solder Ball Customers
9 BGA Packaging Solder Ball 麻豆原创 Dynamics
9.1 BGA Packaging Solder Ball Industry Trends
9.2 BGA Packaging Solder Ball 麻豆原创 Drivers
9.3 BGA Packaging Solder Ball 麻豆原创 Challenges
9.4 BGA Packaging Solder Ball 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
听
听
*If Applicable.
