Back End of Line Semi-Conductor Equipment is the second part of semiconductor devices where single devices such as capacitors, transistors and resistors, among others are interconnected by wires on wafer which are made by pure silicon and metal layers to form required electrical circuits. Common metal that forms layers are aluminum interconnect and copper interconnect. Back end of the line in semiconductor equipments is started when the wafer gets deposited by the first layer of metal. Back end of line consists of metal levels, insulating layers (dielectrics), and bonding sites for chip to package connections. In back end of the line the formation of interconnect wires, contacts (pads), and dielectric structures takes place. Ten metal layers or more are added in back end of the line stage in semiconductor electronics. Steps of back end of line includes silicidation of the polysilicon region, drain regions and source, addition of dielectric and its processing, making holes in PMD in order to make contacts in them, adding the first metal layer, addition of second dielectric, connection of lower metal with higher metal by making vias through dielectric and passivation layer addition in order to protect the micro chip.
Highlights
The global Back End of the Line Semiconductor Equipment market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
This market research analysis identifies the miniaturization of electronic devices as one of the primary growth factors for this market. The recent years have seen an increasing demand for compact electronic devices from several sectors such as communication, automotive, industrial manufacturing, and healthcare. This has induced the semiconductor manufacturers to invest in their R&D to reduce the size and increase the performance of ICs, which, in turn, has led to the emergence of micro-electro-mechanical systems (MEMS) and 3D chip packaging. Also, the increasing number of interconnects and transistors in the existing space on the ICs requires finer deposition, which in turn, will create the demand for BEOL semiconductor equipment. In addition, increasing technological functionalities in mobile devices is a major driver driving the global back end of the line semiconductor equipments market. Asia Pacific is expected to dominate the market share of the back end of the line semiconductor equipment global market.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Back End of the Line Semiconductor Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Back End of the Line Semiconductor Equipment.
The Back End of the Line Semiconductor Equipment market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global Back End of the Line Semiconductor Equipment market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Back End of the Line Semiconductor Equipment companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Applied Materials
ASML
KLA-Tencor
Tokyo Electron Limited (TEL)
Segment by Type
CVD
CMP
Coater Developer
PVD
Metal Etching
Stepper
Wet Station
Segment by Application
Foundry
Memory
IDM
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Back End of the Line Semiconductor Equipment companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global Back End of the Line Semiconductor Equipment 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 CVD
1.2.3 CMP
1.2.4 Coater Developer
1.2.5 PVD
1.2.6 Metal Etching
1.2.7 Stepper
1.2.8 Wet Station
1.3 麻豆原创 by Application
1.3.1 Global Back End of the Line Semiconductor Equipment 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Foundry
1.3.3 Memory
1.3.4 IDM
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Back End of the Line Semiconductor Equipment 麻豆原创 Perspective (2018-2029)
2.2 Back End of the Line Semiconductor Equipment Growth Trends by Region
2.2.1 Global Back End of the Line Semiconductor Equipment 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 Back End of the Line Semiconductor Equipment Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 Back End of the Line Semiconductor Equipment Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 Back End of the Line Semiconductor Equipment 麻豆原创 Dynamics
2.3.1 Back End of the Line Semiconductor Equipment Industry Trends
2.3.2 Back End of the Line Semiconductor Equipment 麻豆原创 Drivers
2.3.3 Back End of the Line Semiconductor Equipment 麻豆原创 Challenges
2.3.4 Back End of the Line Semiconductor Equipment 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top Back End of the Line Semiconductor Equipment Players by Revenue
3.1.1 Global Top Back End of the Line Semiconductor Equipment Players by Revenue (2018-2023)
3.1.2 Global Back End of the Line Semiconductor Equipment Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global Back End of the Line Semiconductor Equipment 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Back End of the Line Semiconductor Equipment Revenue
3.4 Global Back End of the Line Semiconductor Equipment 麻豆原创 Concentration Ratio
3.4.1 Global Back End of the Line Semiconductor Equipment 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Back End of the Line Semiconductor Equipment Revenue in 2022
3.5 Back End of the Line Semiconductor Equipment Key Players Head office and Area Served
3.6 Key Players Back End of the Line Semiconductor Equipment Product Solution and Service
3.7 Date of Enter into Back End of the Line Semiconductor Equipment 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 Back End of the Line Semiconductor Equipment Breakdown Data by Type
4.1 Global Back End of the Line Semiconductor Equipment Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global Back End of the Line Semiconductor Equipment Forecasted 麻豆原创 Size by Type (2024-2029)
5 Back End of the Line Semiconductor Equipment Breakdown Data by Application
5.1 Global Back End of the Line Semiconductor Equipment Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global Back End of the Line Semiconductor Equipment Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America Back End of the Line Semiconductor Equipment 麻豆原创 Size (2018-2029)
6.2 North America Back End of the Line Semiconductor Equipment 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2018-2023)
6.4 North America Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Back End of the Line Semiconductor Equipment 麻豆原创 Size (2018-2029)
7.2 Europe Back End of the Line Semiconductor Equipment 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2018-2023)
7.4 Europe Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Back End of the Line Semiconductor Equipment 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific Back End of the Line Semiconductor Equipment 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific Back End of the Line Semiconductor Equipment 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific Back End of the Line Semiconductor Equipment 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Back End of the Line Semiconductor Equipment 麻豆原创 Size (2018-2029)
9.2 Latin America Back End of the Line Semiconductor Equipment 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2018-2023)
9.4 Latin America Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Back End of the Line Semiconductor Equipment 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa Back End of the Line Semiconductor Equipment 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa Back End of the Line Semiconductor Equipment 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Applied Materials
11.1.1 Applied Materials Company Detail
11.1.2 Applied Materials Business Overview
11.1.3 Applied Materials Back End of the Line Semiconductor Equipment Introduction
11.1.4 Applied Materials Revenue in Back End of the Line Semiconductor Equipment Business (2018-2023)
11.1.5 Applied Materials Recent Development
11.2 ASML
11.2.1 ASML Company Detail
11.2.2 ASML Business Overview
11.2.3 ASML Back End of the Line Semiconductor Equipment Introduction
11.2.4 ASML Revenue in Back End of the Line Semiconductor Equipment Business (2018-2023)
11.2.5 ASML Recent Development
11.3 KLA-Tencor
11.3.1 KLA-Tencor Company Detail
11.3.2 KLA-Tencor Business Overview
11.3.3 KLA-Tencor Back End of the Line Semiconductor Equipment Introduction
11.3.4 KLA-Tencor Revenue in Back End of the Line Semiconductor Equipment Business (2018-2023)
11.3.5 KLA-Tencor Recent Development
11.4 Tokyo Electron Limited (TEL)
11.4.1 Tokyo Electron Limited (TEL) Company Detail
11.4.2 Tokyo Electron Limited (TEL) Business Overview
11.4.3 Tokyo Electron Limited (TEL) Back End of the Line Semiconductor Equipment Introduction
11.4.4 Tokyo Electron Limited (TEL) Revenue in Back End of the Line Semiconductor Equipment Business (2018-2023)
11.4.5 Tokyo Electron Limited (TEL) Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
Applied Materials
ASML
KLA-Tencor
Tokyo Electron Limited (TEL)
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*If Applicable.
