Global 3D-IC Packaging 麻豆原创 Research Report 2025

Publication ID:

PB501250130

Publication Date:

January 27, 2025

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global market for 3D-IC Packaging was valued at US$ 18470 million in the year 2024 and is projected to reach a revised size of US$ 29850 million by 2031, growing at a CAGR of 7.2% during the forecast period.
3D-IC (Three-Dimensional Integrated Circuit) packaging is an advanced packaging technology used in the semiconductor industry to vertically stack multiple integrated circuit (IC) dies or chips. It involves stacking and interconnecting multiple IC chips within a single package, allowing for increased integration, improved performance, and reduced form factor of electronic devices.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for 3D-IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D-IC Packaging.
The 3D-IC Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. This report segments the global 3D-IC Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D-IC Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx
Segment by Type
TSV
TGV
Silicon Interposer
Segment by Application
Consumer Electronics
Medical Devices
Automotive
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Europe
Germany
France
U.K.
Italy
Russia
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 3D-IC Packaging company competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global 3D-IC Packaging 麻豆原创 Size Growth Rate by Type: 2020 VS 2024 VS 2031
1.2.2 TSV
1.2.3 TGV
1.2.4 Silicon Interposer
1.3 麻豆原创 by Application
1.3.1 Global 3D-IC Packaging 麻豆原创 Growth by Application: 2020 VS 2024 VS 2031
1.3.2 Consumer Electronics
1.3.3 Medical Devices
1.3.4 Automotive
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global Growth Trends
2.1 Global 3D-IC Packaging 麻豆原创 Perspective (2020-2031)
2.2 Global 3D-IC Packaging Growth Trends by Region
2.2.1 Global 3D-IC Packaging 麻豆原创 Size by Region: 2020 VS 2024 VS 2031
2.2.2 3D-IC Packaging Historic 麻豆原创 Size by Region (2020-2025)
2.2.3 3D-IC Packaging Forecasted 麻豆原创 Size by Region (2026-2031)
2.3 3D-IC Packaging 麻豆原创 Dynamics
2.3.1 3D-IC Packaging Industry Trends
2.3.2 3D-IC Packaging 麻豆原创 Drivers
2.3.3 3D-IC Packaging 麻豆原创 Challenges
2.3.4 3D-IC Packaging 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top 3D-IC Packaging Players by Revenue
3.1.1 Global Top 3D-IC Packaging Players by Revenue (2020-2025)
3.1.2 Global 3D-IC Packaging Revenue 麻豆原创 Share by Players (2020-2025)
3.2 Global 3D-IC Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Global Key Players Ranking by 3D-IC Packaging Revenue
3.4 Global 3D-IC Packaging 麻豆原创 Concentration Ratio
3.4.1 Global 3D-IC Packaging 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 3D-IC Packaging Revenue in 2024
3.5 Global Key Players of 3D-IC Packaging Head office and Area Served
3.6 Global Key Players of 3D-IC Packaging, Product and Application
3.7 Global Key Players of 3D-IC Packaging, Date of Enter into This Industry
3.8 Mergers & Acquisitions, Expansion Plans
4 3D-IC Packaging Breakdown Data by Type
4.1 Global 3D-IC Packaging Historic 麻豆原创 Size by Type (2020-2025)
4.2 Global 3D-IC Packaging Forecasted 麻豆原创 Size by Type (2026-2031)
5 3D-IC Packaging Breakdown Data by Application
5.1 Global 3D-IC Packaging Historic 麻豆原创 Size by Application (2020-2025)
5.2 Global 3D-IC Packaging Forecasted 麻豆原创 Size by Application (2026-2031)
6 North America
6.1 North America 3D-IC Packaging 麻豆原创 Size (2020-2031)
6.2 North America 3D-IC Packaging 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
6.3 North America 3D-IC Packaging 麻豆原创 Size by Country (2020-2025)
6.4 North America 3D-IC Packaging 麻豆原创 Size by Country (2026-2031)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 3D-IC Packaging 麻豆原创 Size (2020-2031)
7.2 Europe 3D-IC Packaging 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
7.3 Europe 3D-IC Packaging 麻豆原创 Size by Country (2020-2025)
7.4 Europe 3D-IC Packaging 麻豆原创 Size by Country (2026-2031)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 3D-IC Packaging 麻豆原创 Size (2020-2031)
8.2 Asia-Pacific 3D-IC Packaging 麻豆原创 Growth Rate by Region: 2020 VS 2024 VS 2031
8.3 Asia-Pacific 3D-IC Packaging 麻豆原创 Size by Region (2020-2025)
8.4 Asia-Pacific 3D-IC Packaging 麻豆原创 Size by Region (2026-2031)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 3D-IC Packaging 麻豆原创 Size (2020-2031)
9.2 Latin America 3D-IC Packaging 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
9.3 Latin America 3D-IC Packaging 麻豆原创 Size by Country (2020-2025)
9.4 Latin America 3D-IC Packaging 麻豆原创 Size by Country (2026-2031)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 3D-IC Packaging 麻豆原创 Size (2020-2031)
10.2 Middle East & Africa 3D-IC Packaging 麻豆原创 Growth Rate by Country: 2020 VS 2024 VS 2031
10.3 Middle East & Africa 3D-IC Packaging 麻豆原创 Size by Country (2020-2025)
10.4 Middle East & Africa 3D-IC Packaging 麻豆原创 Size by Country (2026-2031)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Synopsys
11.1.1 Synopsys Company Details
11.1.2 Synopsys Business Overview
11.1.3 Synopsys 3D-IC Packaging Introduction
11.1.4 Synopsys Revenue in 3D-IC Packaging Business (2020-2025)
11.1.5 Synopsys Recent Development
11.2 Cadence
11.2.1 Cadence Company Details
11.2.2 Cadence Business Overview
11.2.3 Cadence 3D-IC Packaging Introduction
11.2.4 Cadence Revenue in 3D-IC Packaging Business (2020-2025)
11.2.5 Cadence Recent Development
11.3 XMC
11.3.1 XMC Company Details
11.3.2 XMC Business Overview
11.3.3 XMC 3D-IC Packaging Introduction
11.3.4 XMC Revenue in 3D-IC Packaging Business (2020-2025)
11.3.5 XMC Recent Development
11.4 United Microelectronics Corp
11.4.1 United Microelectronics Corp Company Details
11.4.2 United Microelectronics Corp Business Overview
11.4.3 United Microelectronics Corp 3D-IC Packaging Introduction
11.4.4 United Microelectronics Corp Revenue in 3D-IC Packaging Business (2020-2025)
11.4.5 United Microelectronics Corp Recent Development
11.5 TSMC
11.5.1 TSMC Company Details
11.5.2 TSMC Business Overview
11.5.3 TSMC 3D-IC Packaging Introduction
11.5.4 TSMC Revenue in 3D-IC Packaging Business (2020-2025)
11.5.5 TSMC Recent Development
11.6 SPIL
11.6.1 SPIL Company Details
11.6.2 SPIL Business Overview
11.6.3 SPIL 3D-IC Packaging Introduction
11.6.4 SPIL Revenue in 3D-IC Packaging Business (2020-2025)
11.6.5 SPIL Recent Development
11.7 STMicroelectronics
11.7.1 STMicroelectronics Company Details
11.7.2 STMicroelectronics Business Overview
11.7.3 STMicroelectronics 3D-IC Packaging Introduction
11.7.4 STMicroelectronics Revenue in 3D-IC Packaging Business (2020-2025)
11.7.5 STMicroelectronics Recent Development
11.8 ASE Group
11.8.1 ASE Group Company Details
11.8.2 ASE Group Business Overview
11.8.3 ASE Group 3D-IC Packaging Introduction
11.8.4 ASE Group Revenue in 3D-IC Packaging Business (2020-2025)
11.8.5 ASE Group Recent Development
11.9 Amkor Technology
11.9.1 Amkor Technology Company Details
11.9.2 Amkor Technology Business Overview
11.9.3 Amkor Technology 3D-IC Packaging Introduction
11.9.4 Amkor Technology Revenue in 3D-IC Packaging Business (2020-2025)
11.9.5 Amkor Technology Recent Development
11.10 Intel Corporation
11.10.1 Intel Corporation Company Details
11.10.2 Intel Corporation Business Overview
11.10.3 Intel Corporation 3D-IC Packaging Introduction
11.10.4 Intel Corporation Revenue in 3D-IC Packaging Business (2020-2025)
11.10.5 Intel Corporation Recent Development
11.11 GlobalFoundries
11.11.1 GlobalFoundries Company Details
11.11.2 GlobalFoundries Business Overview
11.11.3 GlobalFoundries 3D-IC Packaging Introduction
11.11.4 GlobalFoundries Revenue in 3D-IC Packaging Business (2020-2025)
11.11.5 GlobalFoundries Recent Development
11.12 Invensas
11.12.1 Invensas Company Details
11.12.2 Invensas Business Overview
11.12.3 Invensas 3D-IC Packaging Introduction
11.12.4 Invensas Revenue in 3D-IC Packaging Business (2020-2025)
11.12.5 Invensas Recent Development
11.13 Toshiba Corporation
11.13.1 Toshiba Corporation Company Details
11.13.2 Toshiba Corporation Business Overview
11.13.3 Toshiba Corporation 3D-IC Packaging Introduction
11.13.4 Toshiba Corporation Revenue in 3D-IC Packaging Business (2020-2025)
11.13.5 Toshiba Corporation Recent Development
11.14 Micron Technology
11.14.1 Micron Technology Company Details
11.14.2 Micron Technology Business Overview
11.14.3 Micron Technology 3D-IC Packaging Introduction
11.14.4 Micron Technology Revenue in 3D-IC Packaging Business (2020-2025)
11.14.5 Micron Technology Recent Development
11.15 Xilinx
11.15.1 Xilinx Company Details
11.15.2 Xilinx Business Overview
11.15.3 Xilinx 3D-IC Packaging Introduction
11.15.4 Xilinx Revenue in 3D-IC Packaging Business (2020-2025)
11.15.5 Xilinx Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.1.1 Research Programs/Design
13.1.1.2 麻豆原创 Size Estimation
13.1.1.3 麻豆原创 Breakdown and Data Triangulation
13.1.2 Data Source
13.1.2.1 Secondary Sources
13.1.2.2 Primary Sources
13.2 Author Details
13.3 Disclaimer

Companies Mentioned:

Synopsys
Cadence
XMC
United Microelectronics Corp
TSMC
SPIL
STMicroelectronics
ASE Group
Amkor Technology
Intel Corporation
GlobalFoundries
Invensas
Toshiba Corporation
Micron Technology
Xilinx

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