Global 3D IC and 2.5D IC Packaging 麻豆原创 Research Report 2023

Publication ID:

PB501232735

Publication Date:

January 30, 2023

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

The global 3D IC and 2.5D IC Packaging market was valued at US$ 100020 million in 2022 and is anticipated to reach US$ 268230 million by 2029, witnessing a CAGR of 15.0% during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for 3D IC and 2.5D IC Packaging is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for 3D IC and 2.5D IC Packaging is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of 3D IC and 2.5D IC Packaging include Taiwan Semiconductor, Samsung Electronics, Toshiba Corp, Advanced Semiconductor Engineering and Amkor Technology, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D IC and 2.5D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D IC and 2.5D IC Packaging.
The 3D IC and 2.5D IC Packaging market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global 3D IC and 2.5D IC Packaging market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D IC and 2.5D IC Packaging manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology
Segment by Type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segment by Application
Logic
Imaging & Optoelectronics
Memory
MEMS/Sensors
LED
Power
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 3D IC and 2.5D IC Packaging manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 3D IC and 2.5D IC Packaging by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 3D IC and 2.5D IC Packaging in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 3D IC and 2.5D IC Packaging 麻豆原创 Overview
1.1 Product Definition
1.2 3D IC and 2.5D IC Packaging Segment by Type
1.2.1 Global 3D IC and 2.5D IC Packaging 麻豆原创 Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 3D Wafer-level Chip-scale Packaging
1.2.3 3D TSV
1.2.4 2.5D
1.3 3D IC and 2.5D IC Packaging Segment by Application
1.3.1 Global 3D IC and 2.5D IC Packaging 麻豆原创 Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Logic
1.3.3 Imaging & Optoelectronics
1.3.4 Memory
1.3.5 MEMS/Sensors
1.3.6 LED
1.3.7 Power
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global 3D IC and 2.5D IC Packaging Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts (2018-2029)
1.4.4 Global 3D IC and 2.5D IC Packaging 麻豆原创 Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global 3D IC and 2.5D IC Packaging Production 麻豆原创 Share by Manufacturers (2018-2023)
2.2 Global 3D IC and 2.5D IC Packaging Production Value 麻豆原创 Share by Manufacturers (2018-2023)
2.3 Global Key Players of 3D IC and 2.5D IC Packaging, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global 3D IC and 2.5D IC Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global 3D IC and 2.5D IC Packaging Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Product Offered and Application
2.8 Global Key Manufacturers of 3D IC and 2.5D IC Packaging, Date of Enter into This Industry
2.9 3D IC and 2.5D IC Packaging 麻豆原创 Competitive Situation and Trends
2.9.1 3D IC and 2.5D IC Packaging 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest 3D IC and 2.5D IC Packaging Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 3D IC and 2.5D IC Packaging Production by Region
3.1 Global 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global 3D IC and 2.5D IC Packaging Production Value by Region (2018-2029)
3.2.1 Global 3D IC and 2.5D IC Packaging Production Value 麻豆原创 Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of 3D IC and 2.5D IC Packaging by Region (2024-2029)
3.3 Global 3D IC and 2.5D IC Packaging Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global 3D IC and 2.5D IC Packaging Production by Region (2018-2029)
3.4.1 Global 3D IC and 2.5D IC Packaging Production 麻豆原创 Share by Region (2018-2023)
3.4.2 Global Forecasted Production of 3D IC and 2.5D IC Packaging by Region (2024-2029)
3.5 Global 3D IC and 2.5D IC Packaging 麻豆原创 Price Analysis by Region (2018-2023)
3.6 Global 3D IC and 2.5D IC Packaging Production and Value, Year-over-Year Growth
3.6.1 North America 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.3 China 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea 3D IC and 2.5D IC Packaging Production Value Estimates and Forecasts (2018-2029)
4 3D IC and 2.5D IC Packaging Consumption by Region
4.1 Global 3D IC and 2.5D IC Packaging Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global 3D IC and 2.5D IC Packaging Consumption by Region (2018-2029)
4.2.1 Global 3D IC and 2.5D IC Packaging Consumption by Region (2018-2023)
4.2.2 Global 3D IC and 2.5D IC Packaging Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America 3D IC and 2.5D IC Packaging Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe 3D IC and 2.5D IC Packaging Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific 3D IC and 2.5D IC Packaging Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific 3D IC and 2.5D IC Packaging Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa 3D IC and 2.5D IC Packaging Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global 3D IC and 2.5D IC Packaging Production by Type (2018-2029)
5.1.1 Global 3D IC and 2.5D IC Packaging Production by Type (2018-2023)
5.1.2 Global 3D IC and 2.5D IC Packaging Production by Type (2024-2029)
5.1.3 Global 3D IC and 2.5D IC Packaging Production 麻豆原创 Share by Type (2018-2029)
5.2 Global 3D IC and 2.5D IC Packaging Production Value by Type (2018-2029)
5.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Type (2018-2023)
5.2.2 Global 3D IC and 2.5D IC Packaging Production Value by Type (2024-2029)
5.2.3 Global 3D IC and 2.5D IC Packaging Production Value 麻豆原创 Share by Type (2018-2029)
5.3 Global 3D IC and 2.5D IC Packaging Price by Type (2018-2029)
6 Segment by Application
6.1 Global 3D IC and 2.5D IC Packaging Production by Application (2018-2029)
6.1.1 Global 3D IC and 2.5D IC Packaging Production by Application (2018-2023)
6.1.2 Global 3D IC and 2.5D IC Packaging Production by Application (2024-2029)
6.1.3 Global 3D IC and 2.5D IC Packaging Production 麻豆原创 Share by Application (2018-2029)
6.2 Global 3D IC and 2.5D IC Packaging Production Value by Application (2018-2029)
6.2.1 Global 3D IC and 2.5D IC Packaging Production Value by Application (2018-2023)
6.2.2 Global 3D IC and 2.5D IC Packaging Production Value by Application (2024-2029)
6.2.3 Global 3D IC and 2.5D IC Packaging Production Value 麻豆原创 Share by Application (2018-2029)
6.3 Global 3D IC and 2.5D IC Packaging Price by Application (2018-2029)
7 Key Companies Profiled
7.1 Taiwan Semiconductor
7.1.1 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Corporation Information
7.1.2 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Product Portfolio
7.1.3 Taiwan Semiconductor 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2018-2023)
7.1.4 Taiwan Semiconductor Main Business and 麻豆原创s Served
7.1.5 Taiwan Semiconductor Recent Developments/Updates
7.2 Samsung Electronics
7.2.1 Samsung Electronics 3D IC and 2.5D IC Packaging Corporation Information
7.2.2 Samsung Electronics 3D IC and 2.5D IC Packaging Product Portfolio
7.2.3 Samsung Electronics 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Samsung Electronics Main Business and 麻豆原创s Served
7.2.5 Samsung Electronics Recent Developments/Updates
7.3 Toshiba Corp
7.3.1 Toshiba Corp 3D IC and 2.5D IC Packaging Corporation Information
7.3.2 Toshiba Corp 3D IC and 2.5D IC Packaging Product Portfolio
7.3.3 Toshiba Corp 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Toshiba Corp Main Business and 麻豆原创s Served
7.3.5 Toshiba Corp Recent Developments/Updates
7.4 Advanced Semiconductor Engineering
7.4.1 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Corporation Information
7.4.2 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Product Portfolio
7.4.3 Advanced Semiconductor Engineering 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Advanced Semiconductor Engineering Main Business and 麻豆原创s Served
7.4.5 Advanced Semiconductor Engineering Recent Developments/Updates
7.5 Amkor Technology
7.5.1 Amkor Technology 3D IC and 2.5D IC Packaging Corporation Information
7.5.2 Amkor Technology 3D IC and 2.5D IC Packaging Product Portfolio
7.5.3 Amkor Technology 3D IC and 2.5D IC Packaging Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Amkor Technology Main Business and 麻豆原创s Served
7.5.5 Amkor Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 3D IC and 2.5D IC Packaging Industry Chain Analysis
8.2 3D IC and 2.5D IC Packaging Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 3D IC and 2.5D IC Packaging Production Mode & Process
8.4 3D IC and 2.5D IC Packaging Sales and 麻豆原创ing
8.4.1 3D IC and 2.5D IC Packaging Sales Channels
8.4.2 3D IC and 2.5D IC Packaging Distributors
8.5 3D IC and 2.5D IC Packaging Customers
9 3D IC and 2.5D IC Packaging 麻豆原创 Dynamics
9.1 3D IC and 2.5D IC Packaging Industry Trends
9.2 3D IC and 2.5D IC Packaging 麻豆原创 Drivers
9.3 3D IC and 2.5D IC Packaging 麻豆原创 Challenges
9.4 3D IC and 2.5D IC Packaging 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer

Companies Mentioned:

Taiwan Semiconductor
Samsung Electronics
Toshiba Corp
Advanced Semiconductor Engineering
Amkor Technology

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