A听three-dimensional integrated circuit听(3D IC) is a听MOS听(metal-oxide semiconductor)听integrated circuit听(IC) manufactured by stacking听silicon wafers听or听dies听and interconnecting them vertically using.
The global 3D Chips (3D IC) market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for 3D Chips (3D IC) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for 3D Chips (3D IC) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of 3D Chips (3D IC) include ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics and Broadcom, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for 3D Chips (3D IC), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 3D Chips (3D IC).
The 3D Chips (3D IC) market size, estimations, and forecasts are provided in terms of output/shipments (K Units) and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global 3D Chips (3D IC) market comprehensively. Regional market sizes, concerning products by type, by application and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 3D Chips (3D IC) manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASE Group
Samsung Electronics Co., Ltd.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corporation
Amkor Technology
United Microelectronics
Stmicroelectronics
Broadcom
Intel
Jiangsu Changjiang Electronics Technology
TSMC
Micron Technology
Segment by Type
3D Wafer-Level Chip-Scale Packaging (WLCSP)
3D TSV
Others
Segment by Application
Consumer Electronics
Telecommunication
Automotive
Others
Production by Region
North America
Europe
China
Japan
South Korea
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by type, by application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of 3D Chips (3D IC) manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of 3D Chips (3D IC) by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of 3D Chips (3D IC) in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
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1 3D Chips (3D IC) 麻豆原创 Overview
1.1 Product Definition
1.2 3D Chips (3D IC) Segment by Type
1.2.1 Global 3D Chips (3D IC) 麻豆原创 Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.2.3 3D TSV
1.2.4 Others
1.3 3D Chips (3D IC) Segment by Application
1.3.1 Global 3D Chips (3D IC) 麻豆原创 Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Telecommunication
1.3.4 Automotive
1.3.5 Others
1.4 Global 麻豆原创 Growth Prospects
1.4.1 Global 3D Chips (3D IC) Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global 3D Chips (3D IC) Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global 3D Chips (3D IC) Production Estimates and Forecasts (2018-2029)
1.4.4 Global 3D Chips (3D IC) 麻豆原创 Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 麻豆原创 Competition by Manufacturers
2.1 Global 3D Chips (3D IC) Production 麻豆原创 Share by Manufacturers (2018-2023)
2.2 Global 3D Chips (3D IC) Production Value 麻豆原创 Share by Manufacturers (2018-2023)
2.3 Global Key Players of 3D Chips (3D IC), Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global 3D Chips (3D IC) 麻豆原创 Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global 3D Chips (3D IC) Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of 3D Chips (3D IC), Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of 3D Chips (3D IC), Product Offered and Application
2.8 Global Key Manufacturers of 3D Chips (3D IC), Date of Enter into This Industry
2.9 3D Chips (3D IC) 麻豆原创 Competitive Situation and Trends
2.9.1 3D Chips (3D IC) 麻豆原创 Concentration Rate
2.9.2 Global 5 and 10 Largest 3D Chips (3D IC) Players 麻豆原创 Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 3D Chips (3D IC) Production by Region
3.1 Global 3D Chips (3D IC) Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global 3D Chips (3D IC) Production Value by Region (2018-2029)
3.2.1 Global 3D Chips (3D IC) Production Value 麻豆原创 Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of 3D Chips (3D IC) by Region (2024-2029)
3.3 Global 3D Chips (3D IC) Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global 3D Chips (3D IC) Production by Region (2018-2029)
3.4.1 Global 3D Chips (3D IC) Production 麻豆原创 Share by Region (2018-2023)
3.4.2 Global Forecasted Production of 3D Chips (3D IC) by Region (2024-2029)
3.5 Global 3D Chips (3D IC) 麻豆原创 Price Analysis by Region (2018-2023)
3.6 Global 3D Chips (3D IC) Production and Value, Year-over-Year Growth
3.6.1 North America 3D Chips (3D IC) Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe 3D Chips (3D IC) Production Value Estimates and Forecasts (2018-2029)
3.6.3 China 3D Chips (3D IC) Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan 3D Chips (3D IC) Production Value Estimates and Forecasts (2018-2029)
3.6.5 South Korea 3D Chips (3D IC) Production Value Estimates and Forecasts (2018-2029)
4 3D Chips (3D IC) Consumption by Region
4.1 Global 3D Chips (3D IC) Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global 3D Chips (3D IC) Consumption by Region (2018-2029)
4.2.1 Global 3D Chips (3D IC) Consumption by Region (2018-2023)
4.2.2 Global 3D Chips (3D IC) Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America 3D Chips (3D IC) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America 3D Chips (3D IC) Consumption by Country (2018-2029)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe 3D Chips (3D IC) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe 3D Chips (3D IC) Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific 3D Chips (3D IC) Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific 3D Chips (3D IC) Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa 3D Chips (3D IC) Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa 3D Chips (3D IC) Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global 3D Chips (3D IC) Production by Type (2018-2029)
5.1.1 Global 3D Chips (3D IC) Production by Type (2018-2023)
5.1.2 Global 3D Chips (3D IC) Production by Type (2024-2029)
5.1.3 Global 3D Chips (3D IC) Production 麻豆原创 Share by Type (2018-2029)
5.2 Global 3D Chips (3D IC) Production Value by Type (2018-2029)
5.2.1 Global 3D Chips (3D IC) Production Value by Type (2018-2023)
5.2.2 Global 3D Chips (3D IC) Production Value by Type (2024-2029)
5.2.3 Global 3D Chips (3D IC) Production Value 麻豆原创 Share by Type (2018-2029)
5.3 Global 3D Chips (3D IC) Price by Type (2018-2029)
6 Segment by Application
6.1 Global 3D Chips (3D IC) Production by Application (2018-2029)
6.1.1 Global 3D Chips (3D IC) Production by Application (2018-2023)
6.1.2 Global 3D Chips (3D IC) Production by Application (2024-2029)
6.1.3 Global 3D Chips (3D IC) Production 麻豆原创 Share by Application (2018-2029)
6.2 Global 3D Chips (3D IC) Production Value by Application (2018-2029)
6.2.1 Global 3D Chips (3D IC) Production Value by Application (2018-2023)
6.2.2 Global 3D Chips (3D IC) Production Value by Application (2024-2029)
6.2.3 Global 3D Chips (3D IC) Production Value 麻豆原创 Share by Application (2018-2029)
6.3 Global 3D Chips (3D IC) Price by Application (2018-2029)
7 Key Companies Profiled
7.1 ASE Group
7.1.1 ASE Group 3D Chips (3D IC) Corporation Information
7.1.2 ASE Group 3D Chips (3D IC) Product Portfolio
7.1.3 ASE Group 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.1.4 ASE Group Main Business and 麻豆原创s Served
7.1.5 ASE Group Recent Developments/Updates
7.2 Samsung Electronics Co., Ltd.
7.2.1 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Corporation Information
7.2.2 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Product Portfolio
7.2.3 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.2.4 Samsung Electronics Co., Ltd. Main Business and 麻豆原创s Served
7.2.5 Samsung Electronics Co., Ltd. Recent Developments/Updates
7.3 STMicroelectronics N.V.
7.3.1 STMicroelectronics N.V. 3D Chips (3D IC) Corporation Information
7.3.2 STMicroelectronics N.V. 3D Chips (3D IC) Product Portfolio
7.3.3 STMicroelectronics N.V. 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.3.4 STMicroelectronics N.V. Main Business and 麻豆原创s Served
7.3.5 STMicroelectronics N.V. Recent Developments/Updates
7.4 Taiwan Semiconductor Manufacturing Company Limited
7.4.1 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Corporation Information
7.4.2 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Product Portfolio
7.4.3 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Taiwan Semiconductor Manufacturing Company Limited Main Business and 麻豆原创s Served
7.4.5 Taiwan Semiconductor Manufacturing Company Limited Recent Developments/Updates
7.5 Toshiba Corporation
7.5.1 Toshiba Corporation 3D Chips (3D IC) Corporation Information
7.5.2 Toshiba Corporation 3D Chips (3D IC) Product Portfolio
7.5.3 Toshiba Corporation 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Toshiba Corporation Main Business and 麻豆原创s Served
7.5.5 Toshiba Corporation Recent Developments/Updates
7.6 Amkor Technology
7.6.1 Amkor Technology 3D Chips (3D IC) Corporation Information
7.6.2 Amkor Technology 3D Chips (3D IC) Product Portfolio
7.6.3 Amkor Technology 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Amkor Technology Main Business and 麻豆原创s Served
7.6.5 Amkor Technology Recent Developments/Updates
7.7 United Microelectronics
7.7.1 United Microelectronics 3D Chips (3D IC) Corporation Information
7.7.2 United Microelectronics 3D Chips (3D IC) Product Portfolio
7.7.3 United Microelectronics 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.7.4 United Microelectronics Main Business and 麻豆原创s Served
7.7.5 United Microelectronics Recent Developments/Updates
7.8 Stmicroelectronics
7.8.1 Stmicroelectronics 3D Chips (3D IC) Corporation Information
7.8.2 Stmicroelectronics 3D Chips (3D IC) Product Portfolio
7.8.3 Stmicroelectronics 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Stmicroelectronics Main Business and 麻豆原创s Served
7.7.5 Stmicroelectronics Recent Developments/Updates
7.9 Broadcom
7.9.1 Broadcom 3D Chips (3D IC) Corporation Information
7.9.2 Broadcom 3D Chips (3D IC) Product Portfolio
7.9.3 Broadcom 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Broadcom Main Business and 麻豆原创s Served
7.9.5 Broadcom Recent Developments/Updates
7.10 Intel
7.10.1 Intel 3D Chips (3D IC) Corporation Information
7.10.2 Intel 3D Chips (3D IC) Product Portfolio
7.10.3 Intel 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Intel Main Business and 麻豆原创s Served
7.10.5 Intel Recent Developments/Updates
7.11 Jiangsu Changjiang Electronics Technology
7.11.1 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Corporation Information
7.11.2 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Product Portfolio
7.11.3 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Jiangsu Changjiang Electronics Technology Main Business and 麻豆原创s Served
7.11.5 Jiangsu Changjiang Electronics Technology Recent Developments/Updates
7.12 TSMC
7.12.1 TSMC 3D Chips (3D IC) Corporation Information
7.12.2 TSMC 3D Chips (3D IC) Product Portfolio
7.12.3 TSMC 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.12.4 TSMC Main Business and 麻豆原创s Served
7.12.5 TSMC Recent Developments/Updates
7.13 Micron Technology
7.13.1 Micron Technology 3D Chips (3D IC) Corporation Information
7.13.2 Micron Technology 3D Chips (3D IC) Product Portfolio
7.13.3 Micron Technology 3D Chips (3D IC) Production, Value, Price and Gross Margin (2018-2023)
7.13.4 Micron Technology Main Business and 麻豆原创s Served
7.13.5 Micron Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 3D Chips (3D IC) Industry Chain Analysis
8.2 3D Chips (3D IC) Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 3D Chips (3D IC) Production Mode & Process
8.4 3D Chips (3D IC) Sales and 麻豆原创ing
8.4.1 3D Chips (3D IC) Sales Channels
8.4.2 3D Chips (3D IC) Distributors
8.5 3D Chips (3D IC) Customers
9 3D Chips (3D IC) 麻豆原创 Dynamics
9.1 3D Chips (3D IC) Industry Trends
9.2 3D Chips (3D IC) 麻豆原创 Drivers
9.3 3D Chips (3D IC) 麻豆原创 Challenges
9.4 3D Chips (3D IC) 麻豆原创 Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 麻豆原创 Size Estimation
11.1.3 麻豆原创 Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
ASE Group
Samsung Electronics Co., Ltd.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corporation
Amkor Technology
United Microelectronics
Stmicroelectronics
Broadcom
Intel
Jiangsu Changjiang Electronics Technology
TSMC
Micron Technology
听
听
*If Applicable.
