A听three-dimensional integrated circuit听(3D IC) is a听MOS听(metal-oxide semiconductor)听integrated circuit听(IC) manufactured by stacking听silicon wafers听or听dies听and interconnecting them vertically using.
The global 3D Chips (3D IC) market is projected to grow from US$ million in 2023 to US$ million by 2029, at a Compound Annual Growth Rate (CAGR) of % during the forecast period.
The US & Canada market for 3D Chips (3D IC) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The China market for 3D Chips (3D IC) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The Europe market for 3D Chips (3D IC) is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global key manufacturers of 3D Chips (3D IC) include ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics and Broadcom, etc. In 2022, the global top five players had a share approximately % in terms of revenue.
In terms of production side, this report researches the 3D Chips (3D IC) production, growth rate, market share by manufacturers and by region (region level and country level), from 2018 to 2023, and forecast to 2029.
In terms of consumption side, this report focuses on the sales of 3D Chips (3D IC) by region (region level and country level), by company, by Type and by Application. from 2018 to 2023 and forecast to 2029.
Report Includes:
This report presents an overview of global market for 3D Chips (3D IC), capacity, output, revenue and price. Analyses of the global market trends, with historic market revenue/sales data for 2018 - 2022, estimates for 2023, and projections of CAGR through 2029.
This report researches the key producers of 3D Chips (3D IC), also provides the consumption of main regions and countries. Highlights of the upcoming market potential for 3D Chips (3D IC), and key regions/countries of focus to forecast this market into various segments and sub-segments. Country specific data and market value analysis for the U.S., Canada, Mexico, Brazil, China, Japan, South Korea, Southeast Asia, India, Germany, the U.K., Italy, Middle East, Africa, and Other Countries.
This report focuses on the 3D Chips (3D IC) sales, revenue, market share and industry ranking of main manufacturers, data from 2018 to 2023. Identification of the major stakeholders in the global 3D Chips (3D IC) market, and analysis of their competitive landscape and market positioning based on recent developments and segmental revenues. This report will help stakeholders to understand the competitive landscape and gain more insights and position their businesses and market strategies in a better way.
This report analyzes the segments data by Type and by Application, sales, revenue, and price, from 2018 to 2029. Evaluation and forecast the market size for 3D Chips (3D IC) sales, projected growth trends, production technology, application and end-user industry.
Descriptive company profiles of the major global players, including ASE Group, Samsung Electronics Co., Ltd., STMicroelectronics N.V., Taiwan Semiconductor Manufacturing Company Limited, Toshiba Corporation, Amkor Technology, United Microelectronics, Stmicroelectronics and Broadcom, etc.
By Company
ASE Group
Samsung Electronics Co., Ltd.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corporation
Amkor Technology
United Microelectronics
Stmicroelectronics
Broadcom
Intel
Jiangsu Changjiang Electronics Technology
TSMC
Micron Technology
Segment by Type
3D Wafer-Level Chip-Scale Packaging (WLCSP)
3D TSV
Others
Segment by Application
Consumer Electronics
Telecommunication
Automotive
Others
Production by Region
North America
Europe
China
Japan
South Korea
Sales by Region
US & Canada
U.S.
Canada
China
Asia (excluding China)
Japan
South Korea
China Taiwan
Southeast Asia
India
Europe
Germany
France
U.K.
Italy
Russia
Middle East, Africa, Latin America
Brazil
Mexico
Turkey
Israel
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type and by Application, etc.), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: 3D Chips (3D IC) production/output of global and key producers (regions/countries). It provides a quantitative analysis of the production and development potential of each producer in the next six years.
Chapter 3: Sales (consumption), revenue of 3D Chips (3D IC) in global, regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 4: Detailed analysis of 3D Chips (3D IC) manufacturers competitive landscape, price, sales, revenue, market share and industry ranking, latest development plan, merger, and acquisition information, etc.
Chapter 5: Provides the analysis of various market segments by type, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by application, covering the sales, revenue, average price, and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: North America (US & Canada) by type, by application and by country, sales and revenue for each segment.
Chapter 8: Europe by type, by application and by country, sales and revenue for each segment.
Chapter 9: China by type and by application sales and revenue for each segment.
Chapter 10: Asia (excluding China) by type, by application and by region, sales and revenue for each segment.
Chapter 11: Middle East, Africa, Latin America by type, by application and by country, sales and revenue for each segment.
Chapter 12: Provides profiles of key manufacturers, introducing the basic situation of the main companies in the market in detail, including product descriptions and specifications, 3D Chips (3D IC) sales, revenue, price, gross margin, and recent development, etc.
Chapter 13: Analysis of industrial chain, sales channel, key raw materials, distributors and customers.
Chapter 14: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 15: The main points and conclusions of the report.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Study Coverage
1.1 3D Chips (3D IC) Product Introduction
1.2 麻豆原创 by Type
1.2.1 Global 3D Chips (3D IC) 麻豆原创 Size by Type, 2018 VS 2022 VS 2029
1.2.2 3D Wafer-Level Chip-Scale Packaging (WLCSP)
1.2.3 3D TSV
1.2.4 Others
1.3 麻豆原创 by Application
1.3.1 Global 3D Chips (3D IC) 麻豆原创 Size by Application, 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Telecommunication
1.3.4 Automotive
1.3.5 Others
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Global 3D Chips (3D IC) Production
2.1 Global 3D Chips (3D IC) Production Capacity (2018-2029)
2.2 Global 3D Chips (3D IC) Production by Region: 2018 VS 2022 VS 2029
2.3 Global 3D Chips (3D IC) Production by Region
2.3.1 Global 3D Chips (3D IC) Historic Production by Region (2018-2023)
2.3.2 Global 3D Chips (3D IC) Forecasted Production by Region (2024-2029)
2.3.3 Global 3D Chips (3D IC) Production 麻豆原创 Share by Region (2018-2029)
2.4 North America
2.5 Europe
2.6 China
2.7 Japan
2.8 South Korea
3 Executive Summary
3.1 Global 3D Chips (3D IC) Revenue Estimates and Forecasts 2018-2029
3.2 Global 3D Chips (3D IC) Revenue by Region
3.2.1 Global 3D Chips (3D IC) Revenue by Region: 2018 VS 2022 VS 2029
3.2.2 Global 3D Chips (3D IC) Revenue by Region (2018-2023)
3.2.3 Global 3D Chips (3D IC) Revenue by Region (2024-2029)
3.2.4 Global 3D Chips (3D IC) Revenue 麻豆原创 Share by Region (2018-2029)
3.3 Global 3D Chips (3D IC) Sales Estimates and Forecasts 2018-2029
3.4 Global 3D Chips (3D IC) Sales by Region
3.4.1 Global 3D Chips (3D IC) Sales by Region: 2018 VS 2022 VS 2029
3.4.2 Global 3D Chips (3D IC) Sales by Region (2018-2023)
3.4.3 Global 3D Chips (3D IC) Sales by Region (2024-2029)
3.4.4 Global 3D Chips (3D IC) Sales 麻豆原创 Share by Region (2018-2029)
3.5 US & Canada
3.6 Europe
3.7 China
3.8 Asia (excluding China)
3.9 Middle East, Africa and Latin America
4 Competition by Manufactures
4.1 Global 3D Chips (3D IC) Sales by Manufacturers
4.1.1 Global 3D Chips (3D IC) Sales by Manufacturers (2018-2023)
4.1.2 Global 3D Chips (3D IC) Sales 麻豆原创 Share by Manufacturers (2018-2023)
4.1.3 Global Top 10 and Top 5 Largest Manufacturers of 3D Chips (3D IC) in 2022
4.2 Global 3D Chips (3D IC) Revenue by Manufacturers
4.2.1 Global 3D Chips (3D IC) Revenue by Manufacturers (2018-2023)
4.2.2 Global 3D Chips (3D IC) Revenue 麻豆原创 Share by Manufacturers (2018-2023)
4.2.3 Global Top 10 and Top 5 Companies by 3D Chips (3D IC) Revenue in 2022
4.3 Global 3D Chips (3D IC) Sales Price by Manufacturers
4.4 Global Key Players of 3D Chips (3D IC), Industry Ranking, 2021 VS 2022 VS 2023
4.5 Analysis of Competitive Landscape
4.5.1 Manufacturers 麻豆原创 Concentration Ratio (CR5 and HHI)
4.5.2 Global 3D Chips (3D IC) 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
4.6 Global Key Manufacturers of 3D Chips (3D IC), Manufacturing Base Distribution and Headquarters
4.7 Global Key Manufacturers of 3D Chips (3D IC), Product Offered and Application
4.8 Global Key Manufacturers of 3D Chips (3D IC), Date of Enter into This Industry
4.9 Mergers & Acquisitions, Expansion Plans
5 麻豆原创 Size by Type
5.1 Global 3D Chips (3D IC) Sales by Type
5.1.1 Global 3D Chips (3D IC) Historical Sales by Type (2018-2023)
5.1.2 Global 3D Chips (3D IC) Forecasted Sales by Type (2024-2029)
5.1.3 Global 3D Chips (3D IC) Sales 麻豆原创 Share by Type (2018-2029)
5.2 Global 3D Chips (3D IC) Revenue by Type
5.2.1 Global 3D Chips (3D IC) Historical Revenue by Type (2018-2023)
5.2.2 Global 3D Chips (3D IC) Forecasted Revenue by Type (2024-2029)
5.2.3 Global 3D Chips (3D IC) Revenue 麻豆原创 Share by Type (2018-2029)
5.3 Global 3D Chips (3D IC) Price by Type
5.3.1 Global 3D Chips (3D IC) Price by Type (2018-2023)
5.3.2 Global 3D Chips (3D IC) Price Forecast by Type (2024-2029)
6 麻豆原创 Size by Application
6.1 Global 3D Chips (3D IC) Sales by Application
6.1.1 Global 3D Chips (3D IC) Historical Sales by Application (2018-2023)
6.1.2 Global 3D Chips (3D IC) Forecasted Sales by Application (2024-2029)
6.1.3 Global 3D Chips (3D IC) Sales 麻豆原创 Share by Application (2018-2029)
6.2 Global 3D Chips (3D IC) Revenue by Application
6.2.1 Global 3D Chips (3D IC) Historical Revenue by Application (2018-2023)
6.2.2 Global 3D Chips (3D IC) Forecasted Revenue by Application (2024-2029)
6.2.3 Global 3D Chips (3D IC) Revenue 麻豆原创 Share by Application (2018-2029)
6.3 Global 3D Chips (3D IC) Price by Application
6.3.1 Global 3D Chips (3D IC) Price by Application (2018-2023)
6.3.2 Global 3D Chips (3D IC) Price Forecast by Application (2024-2029)
7 US & Canada
7.1 US & Canada 3D Chips (3D IC) 麻豆原创 Size by Type
7.1.1 US & Canada 3D Chips (3D IC) Sales by Type (2018-2029)
7.1.2 US & Canada 3D Chips (3D IC) Revenue by Type (2018-2029)
7.2 US & Canada 3D Chips (3D IC) 麻豆原创 Size by Application
7.2.1 US & Canada 3D Chips (3D IC) Sales by Application (2018-2029)
7.2.2 US & Canada 3D Chips (3D IC) Revenue by Application (2018-2029)
7.3 US & Canada 3D Chips (3D IC) Sales by Country
7.3.1 US & Canada 3D Chips (3D IC) Revenue by Country: 2018 VS 2022 VS 2029
7.3.2 US & Canada 3D Chips (3D IC) Sales by Country (2018-2029)
7.3.3 US & Canada 3D Chips (3D IC) Revenue by Country (2018-2029)
7.3.4 United States
7.3.5 Canada
8 Europe
8.1 Europe 3D Chips (3D IC) 麻豆原创 Size by Type
8.1.1 Europe 3D Chips (3D IC) Sales by Type (2018-2029)
8.1.2 Europe 3D Chips (3D IC) Revenue by Type (2018-2029)
8.2 Europe 3D Chips (3D IC) 麻豆原创 Size by Application
8.2.1 Europe 3D Chips (3D IC) Sales by Application (2018-2029)
8.2.2 Europe 3D Chips (3D IC) Revenue by Application (2018-2029)
8.3 Europe 3D Chips (3D IC) Sales by Country
8.3.1 Europe 3D Chips (3D IC) Revenue by Country: 2018 VS 2022 VS 2029
8.3.2 Europe 3D Chips (3D IC) Sales by Country (2018-2029)
8.3.3 Europe 3D Chips (3D IC) Revenue by Country (2018-2029)
8.3.4 Germany
8.3.5 France
8.3.6 U.K.
8.3.7 Italy
8.3.8 Russia
9 China
9.1 China 3D Chips (3D IC) 麻豆原创 Size by Type
9.1.1 China 3D Chips (3D IC) Sales by Type (2018-2029)
9.1.2 China 3D Chips (3D IC) Revenue by Type (2018-2029)
9.2 China 3D Chips (3D IC) 麻豆原创 Size by Application
9.2.1 China 3D Chips (3D IC) Sales by Application (2018-2029)
9.2.2 China 3D Chips (3D IC) Revenue by Application (2018-2029)
10 Asia (excluding China)
10.1 Asia 3D Chips (3D IC) 麻豆原创 Size by Type
10.1.1 Asia 3D Chips (3D IC) Sales by Type (2018-2029)
10.1.2 Asia 3D Chips (3D IC) Revenue by Type (2018-2029)
10.2 Asia 3D Chips (3D IC) 麻豆原创 Size by Application
10.2.1 Asia 3D Chips (3D IC) Sales by Application (2018-2029)
10.2.2 Asia 3D Chips (3D IC) Revenue by Application (2018-2029)
10.3 Asia 3D Chips (3D IC) Sales by Region
10.3.1 Asia 3D Chips (3D IC) Revenue by Region: 2018 VS 2022 VS 2029
10.3.2 Asia 3D Chips (3D IC) Revenue by Region (2018-2029)
10.3.3 Asia 3D Chips (3D IC) Sales by Region (2018-2029)
10.3.4 Japan
10.3.5 South Korea
10.3.6 China Taiwan
10.3.7 Southeast Asia
10.3.8 India
11 Middle East, Africa and Latin America
11.1 Middle East, Africa and Latin America 3D Chips (3D IC) 麻豆原创 Size by Type
11.1.1 Middle East, Africa and Latin America 3D Chips (3D IC) Sales by Type (2018-2029)
11.1.2 Middle East, Africa and Latin America 3D Chips (3D IC) Revenue by Type (2018-2029)
11.2 Middle East, Africa and Latin America 3D Chips (3D IC) 麻豆原创 Size by Application
11.2.1 Middle East, Africa and Latin America 3D Chips (3D IC) Sales by Application (2018-2029)
11.2.2 Middle East, Africa and Latin America 3D Chips (3D IC) Revenue by Application (2018-2029)
11.3 Middle East, Africa and Latin America 3D Chips (3D IC) Sales by Country
11.3.1 Middle East, Africa and Latin America 3D Chips (3D IC) Revenue by Country: 2018 VS 2022 VS 2029
11.3.2 Middle East, Africa and Latin America 3D Chips (3D IC) Revenue by Country (2018-2029)
11.3.3 Middle East, Africa and Latin America 3D Chips (3D IC) Sales by Country (2018-2029)
11.3.4 Brazil
11.3.5 Mexico
11.3.6 Turkey
11.3.7 Israel
11.3.8 GCC Countries
12 Corporate Profiles
12.1 ASE Group
12.1.1 ASE Group Company Information
12.1.2 ASE Group Overview
12.1.3 ASE Group 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.1.4 ASE Group 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.1.5 ASE Group Recent Developments
12.2 Samsung Electronics Co., Ltd.
12.2.1 Samsung Electronics Co., Ltd. Company Information
12.2.2 Samsung Electronics Co., Ltd. Overview
12.2.3 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.2.4 Samsung Electronics Co., Ltd. 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.2.5 Samsung Electronics Co., Ltd. Recent Developments
12.3 STMicroelectronics N.V.
12.3.1 STMicroelectronics N.V. Company Information
12.3.2 STMicroelectronics N.V. Overview
12.3.3 STMicroelectronics N.V. 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.3.4 STMicroelectronics N.V. 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.3.5 STMicroelectronics N.V. Recent Developments
12.4 Taiwan Semiconductor Manufacturing Company Limited
12.4.1 Taiwan Semiconductor Manufacturing Company Limited Company Information
12.4.2 Taiwan Semiconductor Manufacturing Company Limited Overview
12.4.3 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.4.4 Taiwan Semiconductor Manufacturing Company Limited 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.4.5 Taiwan Semiconductor Manufacturing Company Limited Recent Developments
12.5 Toshiba Corporation
12.5.1 Toshiba Corporation Company Information
12.5.2 Toshiba Corporation Overview
12.5.3 Toshiba Corporation 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.5.4 Toshiba Corporation 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.5.5 Toshiba Corporation Recent Developments
12.6 Amkor Technology
12.6.1 Amkor Technology Company Information
12.6.2 Amkor Technology Overview
12.6.3 Amkor Technology 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.6.4 Amkor Technology 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.6.5 Amkor Technology Recent Developments
12.7 United Microelectronics
12.7.1 United Microelectronics Company Information
12.7.2 United Microelectronics Overview
12.7.3 United Microelectronics 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.7.4 United Microelectronics 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.7.5 United Microelectronics Recent Developments
12.8 Stmicroelectronics
12.8.1 Stmicroelectronics Company Information
12.8.2 Stmicroelectronics Overview
12.8.3 Stmicroelectronics 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.8.4 Stmicroelectronics 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.8.5 Stmicroelectronics Recent Developments
12.9 Broadcom
12.9.1 Broadcom Company Information
12.9.2 Broadcom Overview
12.9.3 Broadcom 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.9.4 Broadcom 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.9.5 Broadcom Recent Developments
12.10 Intel
12.10.1 Intel Company Information
12.10.2 Intel Overview
12.10.3 Intel 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.10.4 Intel 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.10.5 Intel Recent Developments
12.11 Jiangsu Changjiang Electronics Technology
12.11.1 Jiangsu Changjiang Electronics Technology Company Information
12.11.2 Jiangsu Changjiang Electronics Technology Overview
12.11.3 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.11.4 Jiangsu Changjiang Electronics Technology 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.11.5 Jiangsu Changjiang Electronics Technology Recent Developments
12.12 TSMC
12.12.1 TSMC Company Information
12.12.2 TSMC Overview
12.12.3 TSMC 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.12.4 TSMC 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.12.5 TSMC Recent Developments
12.13 Micron Technology
12.13.1 Micron Technology Company Information
12.13.2 Micron Technology Overview
12.13.3 Micron Technology 3D Chips (3D IC) Sales, Price, Revenue and Gross Margin (2018-2023)
12.13.4 Micron Technology 3D Chips (3D IC) Product Model Numbers, Pictures, Descriptions and Specifications
12.13.5 Micron Technology Recent Developments
13 Industry Chain and Sales Channels Analysis
13.1 3D Chips (3D IC) Industry Chain Analysis
13.2 3D Chips (3D IC) Key Raw Materials
13.2.1 Key Raw Materials
13.2.2 Raw Materials Key Suppliers
13.3 3D Chips (3D IC) Production Mode & Process
13.4 3D Chips (3D IC) Sales and 麻豆原创ing
13.4.1 3D Chips (3D IC) Sales Channels
13.4.2 3D Chips (3D IC) Distributors
13.5 3D Chips (3D IC) Customers
14 3D Chips (3D IC) 麻豆原创 Dynamics
14.1 3D Chips (3D IC) Industry Trends
14.2 3D Chips (3D IC) 麻豆原创 Drivers
14.3 3D Chips (3D IC) 麻豆原创 Challenges
14.4 3D Chips (3D IC) 麻豆原创 Restraints
15 Key Finding in The Global 3D Chips (3D IC) Study
16 Appendix
16.1 Research Methodology
16.1.1 Methodology/Research Approach
16.1.2 Data Source
16.2 Author Details
16.3 Disclaimer
ASE Group
Samsung Electronics Co., Ltd.
STMicroelectronics N.V.
Taiwan Semiconductor Manufacturing Company Limited
Toshiba Corporation
Amkor Technology
United Microelectronics
Stmicroelectronics
Broadcom
Intel
Jiangsu Changjiang Electronics Technology
TSMC
Micron Technology
听
听
*If Applicable.
