Global 2.5D Semiconductor Packaging 麻豆原创 Research Report 2024

Publication ID:

PB508242949

Publication Date:

August 19, 2024

Pages:

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

2.5D packaging puts die closer together and with smaller bumps using silicon interposers to connect to standard packaging technology.
The global 2.5D Semiconductor Packaging market was valued at US$ 526 million in 2023 and is anticipated to reach US$ 875.3 million by 2030, witnessing a CAGR of 7.6% during the forecast period 2024-2030.
North American market for 2.5D Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
Asia-Pacific market for 2.5D Semiconductor Packaging is estimated to increase from $ million in 2023 to reach $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The global market for 2.5D Semiconductor Packaging in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2030, at a CAGR of % during the forecast period of 2024 through 2030.
The major global companies of 2.5D Semiconductor Packaging include ASE, Intel, Samsung, Amkor, TSMC, OSATs, JCET, IBM and SK Hynix, etc. In 2023, the world's top three vendors accounted for approximately % of the revenue.
This report aims to provide a comprehensive presentation of the global market for 2.5D Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D Semiconductor Packaging.
Report Scope
The 2.5D Semiconductor Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 2.5D Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 2.5D Semiconductor Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
ASE
Intel
Samsung
Amkor
TSMC
OSATs
JCET
IBM
SK Hynix
GlobalFoundries
Segment by Type
FOEB
CoWoS
Others
Segment by Application
Consumer Electronics
Industrial
Automotive and Transport
IT and Telecommunication
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 2.5D Semiconductor Packaging companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global 2.5D Semiconductor Packaging 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 FOEB
1.2.3 CoWoS
1.2.4 Others
1.3 麻豆原创 by Application
1.3.1 Global 2.5D Semiconductor Packaging 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive and Transport
1.3.5 IT and Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 2.5D Semiconductor Packaging 麻豆原创 Perspective (2019-2030)
2.2 2.5D Semiconductor Packaging Growth Trends by Region
2.2.1 Global 2.5D Semiconductor Packaging 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 2.5D Semiconductor Packaging Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 2.5D Semiconductor Packaging Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 2.5D Semiconductor Packaging 麻豆原创 Dynamics
2.3.1 2.5D Semiconductor Packaging Industry Trends
2.3.2 2.5D Semiconductor Packaging 麻豆原创 Drivers
2.3.3 2.5D Semiconductor Packaging 麻豆原创 Challenges
2.3.4 2.5D Semiconductor Packaging 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top 2.5D Semiconductor Packaging Players by Revenue
3.1.1 Global Top 2.5D Semiconductor Packaging Players by Revenue (2019-2024)
3.1.2 Global 2.5D Semiconductor Packaging Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global 2.5D Semiconductor Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 2.5D Semiconductor Packaging Revenue
3.4 Global 2.5D Semiconductor Packaging 麻豆原创 Concentration Ratio
3.4.1 Global 2.5D Semiconductor Packaging 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 2.5D Semiconductor Packaging Revenue in 2023
3.5 2.5D Semiconductor Packaging Key Players Head office and Area Served
3.6 Key Players 2.5D Semiconductor Packaging Product Solution and Service
3.7 Date of Enter into 2.5D Semiconductor Packaging 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 2.5D Semiconductor Packaging Breakdown Data by Type
4.1 Global 2.5D Semiconductor Packaging Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global 2.5D Semiconductor Packaging Forecasted 麻豆原创 Size by Type (2025-2030)
5 2.5D Semiconductor Packaging Breakdown Data by Application
5.1 Global 2.5D Semiconductor Packaging Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global 2.5D Semiconductor Packaging Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America 2.5D Semiconductor Packaging 麻豆原创 Size (2019-2030)
6.2 North America 2.5D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
6.4 North America 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 2.5D Semiconductor Packaging 麻豆原创 Size (2019-2030)
7.2 Europe 2.5D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
7.4 Europe 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 2.5D Semiconductor Packaging 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific 2.5D Semiconductor Packaging 麻豆原创 Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 2.5D Semiconductor Packaging 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific 2.5D Semiconductor Packaging 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 2.5D Semiconductor Packaging 麻豆原创 Size (2019-2030)
9.2 Latin America 2.5D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
9.4 Latin America 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 2.5D Semiconductor Packaging 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa 2.5D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa 2.5D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Detail
11.1.2 ASE Business Overview
11.1.3 ASE 2.5D Semiconductor Packaging Introduction
11.1.4 ASE Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.1.5 ASE Recent Development
11.2 Intel
11.2.1 Intel Company Detail
11.2.2 Intel Business Overview
11.2.3 Intel 2.5D Semiconductor Packaging Introduction
11.2.4 Intel Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.2.5 Intel Recent Development
11.3 Samsung
11.3.1 Samsung Company Detail
11.3.2 Samsung Business Overview
11.3.3 Samsung 2.5D Semiconductor Packaging Introduction
11.3.4 Samsung Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.3.5 Samsung Recent Development
11.4 Amkor
11.4.1 Amkor Company Detail
11.4.2 Amkor Business Overview
11.4.3 Amkor 2.5D Semiconductor Packaging Introduction
11.4.4 Amkor Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.4.5 Amkor Recent Development
11.5 TSMC
11.5.1 TSMC Company Detail
11.5.2 TSMC Business Overview
11.5.3 TSMC 2.5D Semiconductor Packaging Introduction
11.5.4 TSMC Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.5.5 TSMC Recent Development
11.6 OSATs
11.6.1 OSATs Company Detail
11.6.2 OSATs Business Overview
11.6.3 OSATs 2.5D Semiconductor Packaging Introduction
11.6.4 OSATs Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.6.5 OSATs Recent Development
11.7 JCET
11.7.1 JCET Company Detail
11.7.2 JCET Business Overview
11.7.3 JCET 2.5D Semiconductor Packaging Introduction
11.7.4 JCET Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.7.5 JCET Recent Development
11.8 IBM
11.8.1 IBM Company Detail
11.8.2 IBM Business Overview
11.8.3 IBM 2.5D Semiconductor Packaging Introduction
11.8.4 IBM Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.8.5 IBM Recent Development
11.9 SK Hynix
11.9.1 SK Hynix Company Detail
11.9.2 SK Hynix Business Overview
11.9.3 SK Hynix 2.5D Semiconductor Packaging Introduction
11.9.4 SK Hynix Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.9.5 SK Hynix Recent Development
11.10 GlobalFoundries
11.10.1 GlobalFoundries Company Detail
11.10.2 GlobalFoundries Business Overview
11.10.3 GlobalFoundries 2.5D Semiconductor Packaging Introduction
11.10.4 GlobalFoundries Revenue in 2.5D Semiconductor Packaging Business (2019-2024)
11.10.5 GlobalFoundries Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

ASE
Intel
Samsung
Amkor
TSMC
OSATs
JCET
IBM
SK Hynix
GlobalFoundries

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