The global 2.5D and 3D Semiconductor Packaging market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D Semiconductor Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D Semiconductor Packaging.
Report Scope
The 2.5D and 3D Semiconductor Packaging market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global 2.5D and 3D Semiconductor Packaging market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 2.5D and 3D Semiconductor Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
麻豆原创 Segmentation
By Company
ASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems
SPIL
Powertech
Taiwan Semiconductor Manufacturing
GlobalFoundries
Tezzaron
Segment by Type
3D Wire Bonding
3D TSV
3D Fan Out
2.5D
Segment by Application
Consumer Electronics
Industrial
Automotive and Transport
IT and Telecommunication
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 2.5D and 3D Semiconductor Packaging companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
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1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 3D Wire Bonding
1.2.3 3D TSV
1.2.4 3D Fan Out
1.2.5 2.5D
1.3 麻豆原创 by Application
1.3.1 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Consumer Electronics
1.3.3 Industrial
1.3.4 Automotive and Transport
1.3.5 IT and Telecommunication
1.3.6 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Perspective (2019-2030)
2.2 2.5D and 3D Semiconductor Packaging Growth Trends by Region
2.2.1 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
2.2.2 2.5D and 3D Semiconductor Packaging Historic 麻豆原创 Size by Region (2019-2024)
2.2.3 2.5D and 3D Semiconductor Packaging Forecasted 麻豆原创 Size by Region (2025-2030)
2.3 2.5D and 3D Semiconductor Packaging 麻豆原创 Dynamics
2.3.1 2.5D and 3D Semiconductor Packaging Industry Trends
2.3.2 2.5D and 3D Semiconductor Packaging 麻豆原创 Drivers
2.3.3 2.5D and 3D Semiconductor Packaging 麻豆原创 Challenges
2.3.4 2.5D and 3D Semiconductor Packaging 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top 2.5D and 3D Semiconductor Packaging Players by Revenue
3.1.1 Global Top 2.5D and 3D Semiconductor Packaging Players by Revenue (2019-2024)
3.1.2 Global 2.5D and 3D Semiconductor Packaging Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 2.5D and 3D Semiconductor Packaging Revenue
3.4 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Concentration Ratio
3.4.1 Global 2.5D and 3D Semiconductor Packaging 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 2.5D and 3D Semiconductor Packaging Revenue in 2023
3.5 2.5D and 3D Semiconductor Packaging Key Players Head office and Area Served
3.6 Key Players 2.5D and 3D Semiconductor Packaging Product Solution and Service
3.7 Date of Enter into 2.5D and 3D Semiconductor Packaging 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 2.5D and 3D Semiconductor Packaging Breakdown Data by Type
4.1 Global 2.5D and 3D Semiconductor Packaging Historic 麻豆原创 Size by Type (2019-2024)
4.2 Global 2.5D and 3D Semiconductor Packaging Forecasted 麻豆原创 Size by Type (2025-2030)
5 2.5D and 3D Semiconductor Packaging Breakdown Data by Application
5.1 Global 2.5D and 3D Semiconductor Packaging Historic 麻豆原创 Size by Application (2019-2024)
5.2 Global 2.5D and 3D Semiconductor Packaging Forecasted 麻豆原创 Size by Application (2025-2030)
6 North America
6.1 North America 2.5D and 3D Semiconductor Packaging 麻豆原创 Size (2019-2030)
6.2 North America 2.5D and 3D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
6.4 North America 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 2.5D and 3D Semiconductor Packaging 麻豆原创 Size (2019-2030)
7.2 Europe 2.5D and 3D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
7.4 Europe 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 2.5D and 3D Semiconductor Packaging 麻豆原创 Size (2019-2030)
8.2 Asia-Pacific 2.5D and 3D Semiconductor Packaging 麻豆原创 Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Region (2019-2024)
8.4 Asia-Pacific 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 2.5D and 3D Semiconductor Packaging 麻豆原创 Size (2019-2030)
9.2 Latin America 2.5D and 3D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
9.4 Latin America 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 2.5D and 3D Semiconductor Packaging 麻豆原创 Size (2019-2030)
10.2 Middle East & Africa 2.5D and 3D Semiconductor Packaging 麻豆原创 Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2019-2024)
10.4 Middle East & Africa 2.5D and 3D Semiconductor Packaging 麻豆原创 Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE
11.1.1 ASE Company Detail
11.1.2 ASE Business Overview
11.1.3 ASE 2.5D and 3D Semiconductor Packaging Introduction
11.1.4 ASE Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.1.5 ASE Recent Development
11.2 Amkor
11.2.1 Amkor Company Detail
11.2.2 Amkor Business Overview
11.2.3 Amkor 2.5D and 3D Semiconductor Packaging Introduction
11.2.4 Amkor Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.2.5 Amkor Recent Development
11.3 Intel
11.3.1 Intel Company Detail
11.3.2 Intel Business Overview
11.3.3 Intel 2.5D and 3D Semiconductor Packaging Introduction
11.3.4 Intel Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.3.5 Intel Recent Development
11.4 Samsung
11.4.1 Samsung Company Detail
11.4.2 Samsung Business Overview
11.4.3 Samsung 2.5D and 3D Semiconductor Packaging Introduction
11.4.4 Samsung Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.4.5 Samsung Recent Development
11.5 AT&S
11.5.1 AT&S Company Detail
11.5.2 AT&S Business Overview
11.5.3 AT&S 2.5D and 3D Semiconductor Packaging Introduction
11.5.4 AT&S Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.5.5 AT&S Recent Development
11.6 Toshiba
11.6.1 Toshiba Company Detail
11.6.2 Toshiba Business Overview
11.6.3 Toshiba 2.5D and 3D Semiconductor Packaging Introduction
11.6.4 Toshiba Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.6.5 Toshiba Recent Development
11.7 JCET
11.7.1 JCET Company Detail
11.7.2 JCET Business Overview
11.7.3 JCET 2.5D and 3D Semiconductor Packaging Introduction
11.7.4 JCET Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.7.5 JCET Recent Development
11.8 Qualcomm
11.8.1 Qualcomm Company Detail
11.8.2 Qualcomm Business Overview
11.8.3 Qualcomm 2.5D and 3D Semiconductor Packaging Introduction
11.8.4 Qualcomm Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.8.5 Qualcomm Recent Development
11.9 IBM
11.9.1 IBM Company Detail
11.9.2 IBM Business Overview
11.9.3 IBM 2.5D and 3D Semiconductor Packaging Introduction
11.9.4 IBM Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.9.5 IBM Recent Development
11.10 SK Hynix
11.10.1 SK Hynix Company Detail
11.10.2 SK Hynix Business Overview
11.10.3 SK Hynix 2.5D and 3D Semiconductor Packaging Introduction
11.10.4 SK Hynix Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.10.5 SK Hynix Recent Development
11.11 UTAC
11.11.1 UTAC Company Detail
11.11.2 UTAC Business Overview
11.11.3 UTAC 2.5D and 3D Semiconductor Packaging Introduction
11.11.4 UTAC Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.11.5 UTAC Recent Development
11.12 TSMC
11.12.1 TSMC Company Detail
11.12.2 TSMC Business Overview
11.12.3 TSMC 2.5D and 3D Semiconductor Packaging Introduction
11.12.4 TSMC Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.12.5 TSMC Recent Development
11.13 China Wafer Level CSP
11.13.1 China Wafer Level CSP Company Detail
11.13.2 China Wafer Level CSP Business Overview
11.13.3 China Wafer Level CSP 2.5D and 3D Semiconductor Packaging Introduction
11.13.4 China Wafer Level CSP Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.13.5 China Wafer Level CSP Recent Development
11.14 Interconnect Systems
11.14.1 Interconnect Systems Company Detail
11.14.2 Interconnect Systems Business Overview
11.14.3 Interconnect Systems 2.5D and 3D Semiconductor Packaging Introduction
11.14.4 Interconnect Systems Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.14.5 Interconnect Systems Recent Development
11.15 SPIL
11.15.1 SPIL Company Detail
11.15.2 SPIL Business Overview
11.15.3 SPIL 2.5D and 3D Semiconductor Packaging Introduction
11.15.4 SPIL Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.15.5 SPIL Recent Development
11.16 Powertech
11.16.1 Powertech Company Detail
11.16.2 Powertech Business Overview
11.16.3 Powertech 2.5D and 3D Semiconductor Packaging Introduction
11.16.4 Powertech Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.16.5 Powertech Recent Development
11.17 Taiwan Semiconductor Manufacturing
11.17.1 Taiwan Semiconductor Manufacturing Company Detail
11.17.2 Taiwan Semiconductor Manufacturing Business Overview
11.17.3 Taiwan Semiconductor Manufacturing 2.5D and 3D Semiconductor Packaging Introduction
11.17.4 Taiwan Semiconductor Manufacturing Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.17.5 Taiwan Semiconductor Manufacturing Recent Development
11.18 GlobalFoundries
11.18.1 GlobalFoundries Company Detail
11.18.2 GlobalFoundries Business Overview
11.18.3 GlobalFoundries 2.5D and 3D Semiconductor Packaging Introduction
11.18.4 GlobalFoundries Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.18.5 GlobalFoundries Recent Development
11.19 Tezzaron
11.19.1 Tezzaron Company Detail
11.19.2 Tezzaron Business Overview
11.19.3 Tezzaron 2.5D and 3D Semiconductor Packaging Introduction
11.19.4 Tezzaron Revenue in 2.5D and 3D Semiconductor Packaging Business (2019-2024)
11.19.5 Tezzaron Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
ASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems
SPIL
Powertech
Taiwan Semiconductor Manufacturing
GlobalFoundries
Tezzaron
听
听
*If Applicable.
