Global 2.5D and 3D IC Packaging 麻豆原创 Research Report 2023

Publication ID:

PB504232817

Publication Date:

April 17, 2023

Pages:

103

Publisher:

MRRPB5

Countries:

Global [1]

USD 2,900.00

Semiconductors [2]

Computing & Electronics [3]

Description:

In 2.5D structure, two or more active semiconductor chips are placed side-by-side on a silicon interposer for achieving extremely high die-to-die interconnect density. In 3D structure, active chips are integrated by die stacking for shortest interconnect and smallest package footprint.
The global 2.5D and 3D IC Packaging market was valued at US$ million in 2022 and is anticipated to reach US$ million by 2029, witnessing a CAGR of % during the forecast period 2023-2029. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
North American market for 2.5D and 3D IC Packaging is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
Asia-Pacific market for 2.5D and 3D IC Packaging is estimated to increase from $ million in 2023 to reach $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The global market for 2.5D and 3D IC Packaging in Consumer Electronics is estimated to increase from $ million in 2023 to $ million by 2029, at a CAGR of % during the forecast period of 2023 through 2029.
The key global companies of 2.5D and 3D IC Packaging include ASE Technology, Samsung Electronics, Toshiba, STMicroelectronics, Xilinx, Intel, Micron Technology, TSMC and SK Hynix, etc. In 2022, the world's top three vendors accounted for approximately % of the revenue.
Report Scope
This report aims to provide a comprehensive presentation of the global market for 2.5D and 3D IC Packaging, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding 2.5D and 3D IC Packaging.
The 2.5D and 3D IC Packaging market size, estimations, and forecasts are provided in terms of and revenue ($ millions), considering 2022 as the base year, with history and forecast data for the period from 2018 to 2029. This report segments the global 2.5D and 3D IC Packaging market comprehensively. Regional market sizes, concerning products by type, by application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the 2.5D and 3D IC Packaging companies, new entrants, and industry chain related companies in this market with information on the revenues for the overall market and the sub-segments across the different segments, by company, by type, by application, and by regions.
By Company
ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology
Segment by Type
2.5D
3D TSV
3D Wafer-level Chip-scale Packaging
Segment by Application
Consumer Electronics
Medical Devices
Communications and Telecom
Automotive
Other
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Core Chapters
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by type, application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of 2.5D and 3D IC Packaging companies鈥� competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the key companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Report Overview
1.1 Study Scope
1.2 麻豆原创 Analysis by Type
1.2.1 Global 2.5D and 3D IC Packaging 麻豆原创 Size Growth Rate by Type: 2018 VS 2022 VS 2029
1.2.2 2.5D
1.2.3 3D TSV
1.2.4 3D Wafer-level Chip-scale Packaging
1.3 麻豆原创 by Application
1.3.1 Global 2.5D and 3D IC Packaging 麻豆原创 Growth by Application: 2018 VS 2022 VS 2029
1.3.2 Consumer Electronics
1.3.3 Medical Devices
1.3.4 Communications and Telecom
1.3.5 Automotive
1.3.6 Other
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global 2.5D and 3D IC Packaging 麻豆原创 Perspective (2018-2029)
2.2 2.5D and 3D IC Packaging Growth Trends by Region
2.2.1 Global 2.5D and 3D IC Packaging 麻豆原创 Size by Region: 2018 VS 2022 VS 2029
2.2.2 2.5D and 3D IC Packaging Historic 麻豆原创 Size by Region (2018-2023)
2.2.3 2.5D and 3D IC Packaging Forecasted 麻豆原创 Size by Region (2024-2029)
2.3 2.5D and 3D IC Packaging 麻豆原创 Dynamics
2.3.1 2.5D and 3D IC Packaging Industry Trends
2.3.2 2.5D and 3D IC Packaging 麻豆原创 Drivers
2.3.3 2.5D and 3D IC Packaging 麻豆原创 Challenges
2.3.4 2.5D and 3D IC Packaging 麻豆原创 Restraints
3 Competition Landscape by Key Players
3.1 Global Top 2.5D and 3D IC Packaging Players by Revenue
3.1.1 Global Top 2.5D and 3D IC Packaging Players by Revenue (2018-2023)
3.1.2 Global 2.5D and 3D IC Packaging Revenue 麻豆原创 Share by Players (2018-2023)
3.2 Global 2.5D and 3D IC Packaging 麻豆原创 Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by 2.5D and 3D IC Packaging Revenue
3.4 Global 2.5D and 3D IC Packaging 麻豆原创 Concentration Ratio
3.4.1 Global 2.5D and 3D IC Packaging 麻豆原创 Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by 2.5D and 3D IC Packaging Revenue in 2022
3.5 2.5D and 3D IC Packaging Key Players Head office and Area Served
3.6 Key Players 2.5D and 3D IC Packaging Product Solution and Service
3.7 Date of Enter into 2.5D and 3D IC Packaging 麻豆原创
3.8 Mergers & Acquisitions, Expansion Plans
4 2.5D and 3D IC Packaging Breakdown Data by Type
4.1 Global 2.5D and 3D IC Packaging Historic 麻豆原创 Size by Type (2018-2023)
4.2 Global 2.5D and 3D IC Packaging Forecasted 麻豆原创 Size by Type (2024-2029)
5 2.5D and 3D IC Packaging Breakdown Data by Application
5.1 Global 2.5D and 3D IC Packaging Historic 麻豆原创 Size by Application (2018-2023)
5.2 Global 2.5D and 3D IC Packaging Forecasted 麻豆原创 Size by Application (2024-2029)
6 North America
6.1 North America 2.5D and 3D IC Packaging 麻豆原创 Size (2018-2029)
6.2 North America 2.5D and 3D IC Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
6.3 North America 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2018-2023)
6.4 North America 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2024-2029)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe 2.5D and 3D IC Packaging 麻豆原创 Size (2018-2029)
7.2 Europe 2.5D and 3D IC Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
7.3 Europe 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2018-2023)
7.4 Europe 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2024-2029)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific 2.5D and 3D IC Packaging 麻豆原创 Size (2018-2029)
8.2 Asia-Pacific 2.5D and 3D IC Packaging 麻豆原创 Growth Rate by Region: 2018 VS 2022 VS 2029
8.3 Asia-Pacific 2.5D and 3D IC Packaging 麻豆原创 Size by Region (2018-2023)
8.4 Asia-Pacific 2.5D and 3D IC Packaging 麻豆原创 Size by Region (2024-2029)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America 2.5D and 3D IC Packaging 麻豆原创 Size (2018-2029)
9.2 Latin America 2.5D and 3D IC Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
9.3 Latin America 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2018-2023)
9.4 Latin America 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2024-2029)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa 2.5D and 3D IC Packaging 麻豆原创 Size (2018-2029)
10.2 Middle East & Africa 2.5D and 3D IC Packaging 麻豆原创 Growth Rate by Country: 2018 VS 2022 VS 2029
10.3 Middle East & Africa 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2018-2023)
10.4 Middle East & Africa 2.5D and 3D IC Packaging 麻豆原创 Size by Country (2024-2029)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 ASE Technology
11.1.1 ASE Technology Company Detail
11.1.2 ASE Technology Business Overview
11.1.3 ASE Technology 2.5D and 3D IC Packaging Introduction
11.1.4 ASE Technology Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.1.5 ASE Technology Recent Development
11.2 Samsung Electronics
11.2.1 Samsung Electronics Company Detail
11.2.2 Samsung Electronics Business Overview
11.2.3 Samsung Electronics 2.5D and 3D IC Packaging Introduction
11.2.4 Samsung Electronics Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.2.5 Samsung Electronics Recent Development
11.3 Toshiba
11.3.1 Toshiba Company Detail
11.3.2 Toshiba Business Overview
11.3.3 Toshiba 2.5D and 3D IC Packaging Introduction
11.3.4 Toshiba Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.3.5 Toshiba Recent Development
11.4 STMicroelectronics
11.4.1 STMicroelectronics Company Detail
11.4.2 STMicroelectronics Business Overview
11.4.3 STMicroelectronics 2.5D and 3D IC Packaging Introduction
11.4.4 STMicroelectronics Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.4.5 STMicroelectronics Recent Development
11.5 Xilinx
11.5.1 Xilinx Company Detail
11.5.2 Xilinx Business Overview
11.5.3 Xilinx 2.5D and 3D IC Packaging Introduction
11.5.4 Xilinx Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.5.5 Xilinx Recent Development
11.6 Intel
11.6.1 Intel Company Detail
11.6.2 Intel Business Overview
11.6.3 Intel 2.5D and 3D IC Packaging Introduction
11.6.4 Intel Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.6.5 Intel Recent Development
11.7 Micron Technology
11.7.1 Micron Technology Company Detail
11.7.2 Micron Technology Business Overview
11.7.3 Micron Technology 2.5D and 3D IC Packaging Introduction
11.7.4 Micron Technology Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.7.5 Micron Technology Recent Development
11.8 TSMC
11.8.1 TSMC Company Detail
11.8.2 TSMC Business Overview
11.8.3 TSMC 2.5D and 3D IC Packaging Introduction
11.8.4 TSMC Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.8.5 TSMC Recent Development
11.9 SK Hynix
11.9.1 SK Hynix Company Detail
11.9.2 SK Hynix Business Overview
11.9.3 SK Hynix 2.5D and 3D IC Packaging Introduction
11.9.4 SK Hynix Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.9.5 SK Hynix Recent Development
11.10 Amkor Technology
11.10.1 Amkor Technology Company Detail
11.10.2 Amkor Technology Business Overview
11.10.3 Amkor Technology 2.5D and 3D IC Packaging Introduction
11.10.4 Amkor Technology Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.10.5 Amkor Technology Recent Development
11.11 GlobalFoundries
11.11.1 GlobalFoundries Company Detail
11.11.2 GlobalFoundries Business Overview
11.11.3 GlobalFoundries 2.5D and 3D IC Packaging Introduction
11.11.4 GlobalFoundries Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.11.5 GlobalFoundries Recent Development
11.12 SanDisk (Western Digital)
11.12.1 SanDisk (Western Digital) Company Detail
11.12.2 SanDisk (Western Digital) Business Overview
11.12.3 SanDisk (Western Digital) 2.5D and 3D IC Packaging Introduction
11.12.4 SanDisk (Western Digital) Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.12.5 SanDisk (Western Digital) Recent Development
11.13 Synopsys
11.13.1 Synopsys Company Detail
11.13.2 Synopsys Business Overview
11.13.3 Synopsys 2.5D and 3D IC Packaging Introduction
11.13.4 Synopsys Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.13.5 Synopsys Recent Development
11.14 Invensas
11.14.1 Invensas Company Detail
11.14.2 Invensas Business Overview
11.14.3 Invensas 2.5D and 3D IC Packaging Introduction
11.14.4 Invensas Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.14.5 Invensas Recent Development
11.15 Siliconware Precision Industries
11.15.1 Siliconware Precision Industries Company Detail
11.15.2 Siliconware Precision Industries Business Overview
11.15.3 Siliconware Precision Industries 2.5D and 3D IC Packaging Introduction
11.15.4 Siliconware Precision Industries Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.15.5 Siliconware Precision Industries Recent Development
11.16 Jiangsu Changjiang Electronics
11.16.1 Jiangsu Changjiang Electronics Company Detail
11.16.2 Jiangsu Changjiang Electronics Business Overview
11.16.3 Jiangsu Changjiang Electronics 2.5D and 3D IC Packaging Introduction
11.16.4 Jiangsu Changjiang Electronics Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.16.5 Jiangsu Changjiang Electronics Recent Development
11.17 Powertech Technology
11.17.1 Powertech Technology Company Detail
11.17.2 Powertech Technology Business Overview
11.17.3 Powertech Technology 2.5D and 3D IC Packaging Introduction
11.17.4 Powertech Technology Revenue in 2.5D and 3D IC Packaging Business (2018-2023)
11.17.5 Powertech Technology Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details

Companies Mentioned:

ASE Technology
Samsung Electronics
Toshiba
STMicroelectronics
Xilinx
Intel
Micron Technology
TSMC
SK Hynix
Amkor Technology
GlobalFoundries
SanDisk (Western Digital)
Synopsys
Invensas
Siliconware Precision Industries
Jiangsu Changjiang Electronics
Powertech Technology

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