Embedded Die Packaging Technology - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB509247641

Publication Date:

September 10, 2024

Pages:

105

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

IT Services [2]

Computing & Electronics [3]

Description:

The global market for Embedded Die Packaging Technology was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Embedded Die Packaging Technology, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Embedded Die Packaging Technology by region & country, by Type, and by Application.
The Embedded Die Packaging Technology market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Embedded Die Packaging Technology.
麻豆原创 Segmentation
By Company
AT & S
General Electric
Amkor Technology
Taiwan Semiconductor Manufacturing Company
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS
Segment by Type:
Embedded Die in Rigid Board
Embedded Die in Flexible Board
Segment by Application
Consumer Electronics
IT & Telecommunications
Automotive
Healthcare
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Embedded Die Packaging Technology manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Embedded Die Packaging Technology in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Embedded Die Packaging Technology in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 麻豆原创 Overview
1.1 Embedded Die Packaging Technology Product Introduction
1.2 Global Embedded Die Packaging Technology 麻豆原创 Size Forecast
1.3 Embedded Die Packaging Technology 麻豆原创 Trends & Drivers
1.3.1 Embedded Die Packaging Technology Industry Trends
1.3.2 Embedded Die Packaging Technology 麻豆原创 Drivers & Opportunity
1.3.3 Embedded Die Packaging Technology 麻豆原创 Challenges
1.3.4 Embedded Die Packaging Technology 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Embedded Die Packaging Technology Players Revenue Ranking (2023)
2.2 Global Embedded Die Packaging Technology Revenue by Company (2019-2024)
2.3 Key Companies Embedded Die Packaging Technology Manufacturing Base Distribution and Headquarters
2.4 Key Companies Embedded Die Packaging Technology Product Offered
2.5 Key Companies Time to Begin Mass Production of Embedded Die Packaging Technology
2.6 Embedded Die Packaging Technology 麻豆原创 Competitive Analysis
2.6.1 Embedded Die Packaging Technology 麻豆原创 Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Embedded Die Packaging Technology Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Embedded Die Packaging Technology as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Embedded Die in Rigid Board
3.1.2 Embedded Die in Flexible Board
3.2 Global Embedded Die Packaging Technology Sales Value by Type
3.2.1 Global Embedded Die Packaging Technology Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Embedded Die Packaging Technology Sales Value, by Type (2019-2030)
3.2.3 Global Embedded Die Packaging Technology Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 IT & Telecommunications
4.1.3 Automotive
4.1.4 Healthcare
4.1.5 Others
4.2 Global Embedded Die Packaging Technology Sales Value by Application
4.2.1 Global Embedded Die Packaging Technology Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Embedded Die Packaging Technology Sales Value, by Application (2019-2030)
4.2.3 Global Embedded Die Packaging Technology Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Embedded Die Packaging Technology Sales Value by Region
5.1.1 Global Embedded Die Packaging Technology Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Embedded Die Packaging Technology Sales Value by Region (2019-2024)
5.1.3 Global Embedded Die Packaging Technology Sales Value by Region (2025-2030)
5.1.4 Global Embedded Die Packaging Technology Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Embedded Die Packaging Technology Sales Value, 2019-2030
5.2.2 North America Embedded Die Packaging Technology Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Embedded Die Packaging Technology Sales Value, 2019-2030
5.3.2 Europe Embedded Die Packaging Technology Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Embedded Die Packaging Technology Sales Value, 2019-2030
5.4.2 Asia Pacific Embedded Die Packaging Technology Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Embedded Die Packaging Technology Sales Value, 2019-2030
5.5.2 South America Embedded Die Packaging Technology Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Embedded Die Packaging Technology Sales Value, 2019-2030
5.6.2 Middle East & Africa Embedded Die Packaging Technology Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Embedded Die Packaging Technology Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Embedded Die Packaging Technology Sales Value
6.3 United States
6.3.1 United States Embedded Die Packaging Technology Sales Value, 2019-2030
6.3.2 United States Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Embedded Die Packaging Technology Sales Value, 2019-2030
6.4.2 Europe Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Embedded Die Packaging Technology Sales Value, 2019-2030
6.5.2 China Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.5.3 China Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Embedded Die Packaging Technology Sales Value, 2019-2030
6.6.2 Japan Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Embedded Die Packaging Technology Sales Value, 2019-2030
6.7.2 South Korea Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Embedded Die Packaging Technology Sales Value, 2019-2030
6.8.2 Southeast Asia Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Embedded Die Packaging Technology Sales Value, 2019-2030
6.9.2 India Embedded Die Packaging Technology Sales Value by Type (%), 2023 VS 2030
6.9.3 India Embedded Die Packaging Technology Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 AT & S
7.1.1 AT & S Profile
7.1.2 AT & S Main Business
7.1.3 AT & S Embedded Die Packaging Technology Products, Services and Solutions
7.1.4 AT & S Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.1.5 AT & S Recent Developments
7.2 General Electric
7.2.1 General Electric Profile
7.2.2 General Electric Main Business
7.2.3 General Electric Embedded Die Packaging Technology Products, Services and Solutions
7.2.4 General Electric Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.2.5 General Electric Recent Developments
7.3 Amkor Technology
7.3.1 Amkor Technology Profile
7.3.2 Amkor Technology Main Business
7.3.3 Amkor Technology Embedded Die Packaging Technology Products, Services and Solutions
7.3.4 Amkor Technology Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.3.5 Taiwan Semiconductor Manufacturing Company Recent Developments
7.4 Taiwan Semiconductor Manufacturing Company
7.4.1 Taiwan Semiconductor Manufacturing Company Profile
7.4.2 Taiwan Semiconductor Manufacturing Company Main Business
7.4.3 Taiwan Semiconductor Manufacturing Company Embedded Die Packaging Technology Products, Services and Solutions
7.4.4 Taiwan Semiconductor Manufacturing Company Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.4.5 Taiwan Semiconductor Manufacturing Company Recent Developments
7.5 TDK-Epcos
7.5.1 TDK-Epcos Profile
7.5.2 TDK-Epcos Main Business
7.5.3 TDK-Epcos Embedded Die Packaging Technology Products, Services and Solutions
7.5.4 TDK-Epcos Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.5.5 TDK-Epcos Recent Developments
7.6 Schweizer
7.6.1 Schweizer Profile
7.6.2 Schweizer Main Business
7.6.3 Schweizer Embedded Die Packaging Technology Products, Services and Solutions
7.6.4 Schweizer Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.6.5 Schweizer Recent Developments
7.7 Fujikura
7.7.1 Fujikura Profile
7.7.2 Fujikura Main Business
7.7.3 Fujikura Embedded Die Packaging Technology Products, Services and Solutions
7.7.4 Fujikura Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.7.5 Fujikura Recent Developments
7.8 Microchip Technology
7.8.1 Microchip Technology Profile
7.8.2 Microchip Technology Main Business
7.8.3 Microchip Technology Embedded Die Packaging Technology Products, Services and Solutions
7.8.4 Microchip Technology Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.8.5 Microchip Technology Recent Developments
7.9 Infineon
7.9.1 Infineon Profile
7.9.2 Infineon Main Business
7.9.3 Infineon Embedded Die Packaging Technology Products, Services and Solutions
7.9.4 Infineon Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.9.5 Infineon Recent Developments
7.10 Toshiba Corporation
7.10.1 Toshiba Corporation Profile
7.10.2 Toshiba Corporation Main Business
7.10.3 Toshiba Corporation Embedded Die Packaging Technology Products, Services and Solutions
7.10.4 Toshiba Corporation Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.10.5 Toshiba Corporation Recent Developments
7.11 Fujitsu Limited
7.11.1 Fujitsu Limited Profile
7.11.2 Fujitsu Limited Main Business
7.11.3 Fujitsu Limited Embedded Die Packaging Technology Products, Services and Solutions
7.11.4 Fujitsu Limited Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.11.5 Fujitsu Limited Recent Developments
7.12 STMICROELECTRONICS
7.12.1 STMICROELECTRONICS Profile
7.12.2 STMICROELECTRONICS Main Business
7.12.3 STMICROELECTRONICS Embedded Die Packaging Technology Products, Services and Solutions
7.12.4 STMICROELECTRONICS Embedded Die Packaging Technology Revenue (US$ Million) & (2019-2024)
7.12.5 STMICROELECTRONICS Recent Developments
8 Industry Chain Analysis
8.1 Embedded Die Packaging Technology Industrial Chain
8.2 Embedded Die Packaging Technology Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Embedded Die Packaging Technology Sales Model
8.5.2 Sales Channel
8.5.3 Embedded Die Packaging Technology Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

AT & S
General Electric
Amkor Technology
Taiwan Semiconductor Manufacturing Company
TDK-Epcos
Schweizer
Fujikura
Microchip Technology
Infineon
Toshiba Corporation
Fujitsu Limited
STMICROELECTRONICS

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