Electronic Potting and Encapsulating - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB509244317

Publication Date:

September 20, 2024

Pages:

102

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

Semiconductors [2]

Computing & Electronics [3]

Description:

Electronic Potting and Encapsulation delivers a thicker and more robust solution versus conformal coating to protect electronic assemblies from harsher environments to keep them functioning properly for longer lengths of time, and/or to keep them protected from security threats. Electronic Potting and Encapsulation also create a barrier against moisture, dust, fungus and corrosion. These processes also enhance circuit reliability by eliminating leakage from high voltage circuits.
The global market for Electronic Potting and Encapsulating was estimated to be worth US$ 1803.6 million in 2023 and is forecast to a readjusted size of US$ 3404 million by 2030 with a CAGR of 9.3% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Electronic Potting and Encapsulating, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Electronic Potting and Encapsulating by region & country, by Type, and by Application.
The Electronic Potting and Encapsulating market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Electronic Potting and Encapsulating.
麻豆原创 Segmentation
By Company
Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions
Segment by Type:
Epoxy
Silicones
Polyurethane
Ohers
Segment by Application
Consumer Electronics
Automotive
Medical
Telecommunications
Others
By Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
U.A.E
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Electronic Potting and Encapsulating manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Electronic Potting and Encapsulating in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Electronic Potting and Encapsulating in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

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Table Of Contents:

1 麻豆原创 Overview
1.1 Electronic Potting and Encapsulating Product Introduction
1.2 Global Electronic Potting and Encapsulating 麻豆原创 Size Forecast
1.3 Electronic Potting and Encapsulating 麻豆原创 Trends & Drivers
1.3.1 Electronic Potting and Encapsulating Industry Trends
1.3.2 Electronic Potting and Encapsulating 麻豆原创 Drivers & Opportunity
1.3.3 Electronic Potting and Encapsulating 麻豆原创 Challenges
1.3.4 Electronic Potting and Encapsulating 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Electronic Potting and Encapsulating Players Revenue Ranking (2023)
2.2 Global Electronic Potting and Encapsulating Revenue by Company (2019-2024)
2.3 Key Companies Electronic Potting and Encapsulating Manufacturing Base Distribution and Headquarters
2.4 Key Companies Electronic Potting and Encapsulating Product Offered
2.5 Key Companies Time to Begin Mass Production of Electronic Potting and Encapsulating
2.6 Electronic Potting and Encapsulating 麻豆原创 Competitive Analysis
2.6.1 Electronic Potting and Encapsulating 麻豆原创 Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Electronic Potting and Encapsulating Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Electronic Potting and Encapsulating as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Epoxy
3.1.2 Silicones
3.1.3 Polyurethane
3.1.4 Ohers
3.2 Global Electronic Potting and Encapsulating Sales Value by Type
3.2.1 Global Electronic Potting and Encapsulating Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Electronic Potting and Encapsulating Sales Value, by Type (2019-2030)
3.2.3 Global Electronic Potting and Encapsulating Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Automotive
4.1.3 Medical
4.1.4 Telecommunications
4.1.5 Others
4.2 Global Electronic Potting and Encapsulating Sales Value by Application
4.2.1 Global Electronic Potting and Encapsulating Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Electronic Potting and Encapsulating Sales Value, by Application (2019-2030)
4.2.3 Global Electronic Potting and Encapsulating Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Electronic Potting and Encapsulating Sales Value by Region
5.1.1 Global Electronic Potting and Encapsulating Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Electronic Potting and Encapsulating Sales Value by Region (2019-2024)
5.1.3 Global Electronic Potting and Encapsulating Sales Value by Region (2025-2030)
5.1.4 Global Electronic Potting and Encapsulating Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Electronic Potting and Encapsulating Sales Value, 2019-2030
5.2.2 North America Electronic Potting and Encapsulating Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Electronic Potting and Encapsulating Sales Value, 2019-2030
5.3.2 Europe Electronic Potting and Encapsulating Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Electronic Potting and Encapsulating Sales Value, 2019-2030
5.4.2 Asia Pacific Electronic Potting and Encapsulating Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Electronic Potting and Encapsulating Sales Value, 2019-2030
5.5.2 South America Electronic Potting and Encapsulating Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Electronic Potting and Encapsulating Sales Value, 2019-2030
5.6.2 Middle East & Africa Electronic Potting and Encapsulating Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Electronic Potting and Encapsulating Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Electronic Potting and Encapsulating Sales Value
6.3 United States
6.3.1 United States Electronic Potting and Encapsulating Sales Value, 2019-2030
6.3.2 United States Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Electronic Potting and Encapsulating Sales Value, 2019-2030
6.4.2 Europe Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Electronic Potting and Encapsulating Sales Value, 2019-2030
6.5.2 China Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.5.3 China Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Electronic Potting and Encapsulating Sales Value, 2019-2030
6.6.2 Japan Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Electronic Potting and Encapsulating Sales Value, 2019-2030
6.7.2 South Korea Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Electronic Potting and Encapsulating Sales Value, 2019-2030
6.8.2 Southeast Asia Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Electronic Potting and Encapsulating Sales Value, 2019-2030
6.9.2 India Electronic Potting and Encapsulating Sales Value by Type (%), 2023 VS 2030
6.9.3 India Electronic Potting and Encapsulating Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Henkel
7.1.1 Henkel Profile
7.1.2 Henkel Main Business
7.1.3 Henkel Electronic Potting and Encapsulating Products, Services and Solutions
7.1.4 Henkel Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.1.5 Henkel Recent Developments
7.2 Dow Corning
7.2.1 Dow Corning Profile
7.2.2 Dow Corning Main Business
7.2.3 Dow Corning Electronic Potting and Encapsulating Products, Services and Solutions
7.2.4 Dow Corning Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.2.5 Dow Corning Recent Developments
7.3 Hitachi Chemical
7.3.1 Hitachi Chemical Profile
7.3.2 Hitachi Chemical Main Business
7.3.3 Hitachi Chemical Electronic Potting and Encapsulating Products, Services and Solutions
7.3.4 Hitachi Chemical Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.3.5 LORD Corporation Recent Developments
7.4 LORD Corporation
7.4.1 LORD Corporation Profile
7.4.2 LORD Corporation Main Business
7.4.3 LORD Corporation Electronic Potting and Encapsulating Products, Services and Solutions
7.4.4 LORD Corporation Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.4.5 LORD Corporation Recent Developments
7.5 Huntsman Corporation
7.5.1 Huntsman Corporation Profile
7.5.2 Huntsman Corporation Main Business
7.5.3 Huntsman Corporation Electronic Potting and Encapsulating Products, Services and Solutions
7.5.4 Huntsman Corporation Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.5.5 Huntsman Corporation Recent Developments
7.6 ITW Engineered Polymers
7.6.1 ITW Engineered Polymers Profile
7.6.2 ITW Engineered Polymers Main Business
7.6.3 ITW Engineered Polymers Electronic Potting and Encapsulating Products, Services and Solutions
7.6.4 ITW Engineered Polymers Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.6.5 ITW Engineered Polymers Recent Developments
7.7 3M
7.7.1 3M Profile
7.7.2 3M Main Business
7.7.3 3M Electronic Potting and Encapsulating Products, Services and Solutions
7.7.4 3M Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.7.5 3M Recent Developments
7.8 H.B. Fuller
7.8.1 H.B. Fuller Profile
7.8.2 H.B. Fuller Main Business
7.8.3 H.B. Fuller Electronic Potting and Encapsulating Products, Services and Solutions
7.8.4 H.B. Fuller Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.8.5 H.B. Fuller Recent Developments
7.9 John C. Dolph
7.9.1 John C. Dolph Profile
7.9.2 John C. Dolph Main Business
7.9.3 John C. Dolph Electronic Potting and Encapsulating Products, Services and Solutions
7.9.4 John C. Dolph Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.9.5 John C. Dolph Recent Developments
7.10 Master Bond
7.10.1 Master Bond Profile
7.10.2 Master Bond Main Business
7.10.3 Master Bond Electronic Potting and Encapsulating Products, Services and Solutions
7.10.4 Master Bond Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.10.5 Master Bond Recent Developments
7.11 ACC Silicones
7.11.1 ACC Silicones Profile
7.11.2 ACC Silicones Main Business
7.11.3 ACC Silicones Electronic Potting and Encapsulating Products, Services and Solutions
7.11.4 ACC Silicones Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.11.5 ACC Silicones Recent Developments
7.12 Epic Resins
7.12.1 Epic Resins Profile
7.12.2 Epic Resins Main Business
7.12.3 Epic Resins Electronic Potting and Encapsulating Products, Services and Solutions
7.12.4 Epic Resins Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.12.5 Epic Resins Recent Developments
7.13 Plasma Ruggedized Solutions
7.13.1 Plasma Ruggedized Solutions Profile
7.13.2 Plasma Ruggedized Solutions Main Business
7.13.3 Plasma Ruggedized Solutions Electronic Potting and Encapsulating Products, Services and Solutions
7.13.4 Plasma Ruggedized Solutions Electronic Potting and Encapsulating Revenue (US$ Million) & (2019-2024)
7.13.5 Plasma Ruggedized Solutions Recent Developments
8 Industry Chain Analysis
8.1 Electronic Potting and Encapsulating Industrial Chain
8.2 Electronic Potting and Encapsulating Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Electronic Potting and Encapsulating Sales Model
8.5.2 Sales Channel
8.5.3 Electronic Potting and Encapsulating Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

Henkel
Dow Corning
Hitachi Chemical
LORD Corporation
Huntsman Corporation
ITW Engineered Polymers
3M
H.B. Fuller
John C. Dolph
Master Bond
ACC Silicones
Epic Resins
Plasma Ruggedized Solutions

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