A DIP socket is an electronic accessory used to mount dual in-line package (DIP) components on printed circuit boards (PCBs). These sockets are either square or rectangular in shape and feature two rows of pins on the underside of the socket connected to corresponding push-in mountings on the upper side. The pins are placed through holes in the PCB and soldered onto the tracks etched into the board surface. The component is then pushed into the socket mounting points, securing a good electrical connection between it and the board circuit. The DIP socket is typically used to facilitate easy, non-destructive replacement of DIP components, and are available in single unit form or in strips, which can be cut to size as required.
The global market for Dual in-Line Package (DIP) Socket was estimated to be worth US$ 924 million in 2023 and is forecast to a readjusted size of US$ 1489.5 million by 2030 with a CAGR of 7.1% during the forecast period 2024-2030
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Dual in-Line Package (DIP) Socket, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Dual in-Line Package (DIP) Socket by region & country, by Type, and by Application.
The Dual in-Line Package (DIP) Socket market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Dual in-Line Package (DIP) Socket.
麻豆原创 Segmentation
By Company
TE Connectivity
3M
Aries Electronics
Preci-dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics
Segment by Type:
Open-Frame Styles
Closed-Frame Styles
Segment by Application
Consumer Electronics
Automotive
Defense
Medical
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Dual in-Line Package (DIP) Socket manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Dual in-Line Package (DIP) Socket in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Dual in-Line Package (DIP) Socket in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
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1 麻豆原创 Overview
1.1 Dual in-Line Package (DIP) Socket Product Introduction
1.2 Global Dual in-Line Package (DIP) Socket 麻豆原创 Size Forecast
1.2.1 Global Dual in-Line Package (DIP) Socket Sales Value (2019-2030)
1.2.2 Global Dual in-Line Package (DIP) Socket Sales Volume (2019-2030)
1.2.3 Global Dual in-Line Package (DIP) Socket Sales Price (2019-2030)
1.3 Dual in-Line Package (DIP) Socket 麻豆原创 Trends & Drivers
1.3.1 Dual in-Line Package (DIP) Socket Industry Trends
1.3.2 Dual in-Line Package (DIP) Socket 麻豆原创 Drivers & Opportunity
1.3.3 Dual in-Line Package (DIP) Socket 麻豆原创 Challenges
1.3.4 Dual in-Line Package (DIP) Socket 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Dual in-Line Package (DIP) Socket Players Revenue Ranking (2023)
2.2 Global Dual in-Line Package (DIP) Socket Revenue by Company (2019-2024)
2.3 Global Dual in-Line Package (DIP) Socket Players Sales Volume Ranking (2023)
2.4 Global Dual in-Line Package (DIP) Socket Sales Volume by Company Players (2019-2024)
2.5 Global Dual in-Line Package (DIP) Socket Average Price by Company (2019-2024)
2.6 Key Manufacturers Dual in-Line Package (DIP) Socket Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Dual in-Line Package (DIP) Socket Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Dual in-Line Package (DIP) Socket
2.9 Dual in-Line Package (DIP) Socket 麻豆原创 Competitive Analysis
2.9.1 Dual in-Line Package (DIP) Socket 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Dual in-Line Package (DIP) Socket Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Dual in-Line Package (DIP) Socket as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Open-Frame Styles
3.1.2 Closed-Frame Styles
3.2 Global Dual in-Line Package (DIP) Socket Sales Value by Type
3.2.1 Global Dual in-Line Package (DIP) Socket Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Dual in-Line Package (DIP) Socket Sales Value, by Type (2019-2030)
3.2.3 Global Dual in-Line Package (DIP) Socket Sales Value, by Type (%) (2019-2030)
3.3 Global Dual in-Line Package (DIP) Socket Sales Volume by Type
3.3.1 Global Dual in-Line Package (DIP) Socket Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Dual in-Line Package (DIP) Socket Sales Volume, by Type (2019-2030)
3.3.3 Global Dual in-Line Package (DIP) Socket Sales Volume, by Type (%) (2019-2030)
3.4 Global Dual in-Line Package (DIP) Socket Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Consumer Electronics
4.1.2 Automotive
4.1.3 Defense
4.1.4 Medical
4.1.5 Other
4.2 Global Dual in-Line Package (DIP) Socket Sales Value by Application
4.2.1 Global Dual in-Line Package (DIP) Socket Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Dual in-Line Package (DIP) Socket Sales Value, by Application (2019-2030)
4.2.3 Global Dual in-Line Package (DIP) Socket Sales Value, by Application (%) (2019-2030)
4.3 Global Dual in-Line Package (DIP) Socket Sales Volume by Application
4.3.1 Global Dual in-Line Package (DIP) Socket Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Dual in-Line Package (DIP) Socket Sales Volume, by Application (2019-2030)
4.3.3 Global Dual in-Line Package (DIP) Socket Sales Volume, by Application (%) (2019-2030)
4.4 Global Dual in-Line Package (DIP) Socket Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Dual in-Line Package (DIP) Socket Sales Value by Region
5.1.1 Global Dual in-Line Package (DIP) Socket Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Dual in-Line Package (DIP) Socket Sales Value by Region (2019-2024)
5.1.3 Global Dual in-Line Package (DIP) Socket Sales Value by Region (2025-2030)
5.1.4 Global Dual in-Line Package (DIP) Socket Sales Value by Region (%), (2019-2030)
5.2 Global Dual in-Line Package (DIP) Socket Sales Volume by Region
5.2.1 Global Dual in-Line Package (DIP) Socket Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Dual in-Line Package (DIP) Socket Sales Volume by Region (2019-2024)
5.2.3 Global Dual in-Line Package (DIP) Socket Sales Volume by Region (2025-2030)
5.2.4 Global Dual in-Line Package (DIP) Socket Sales Volume by Region (%), (2019-2030)
5.3 Global Dual in-Line Package (DIP) Socket Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
5.4.2 North America Dual in-Line Package (DIP) Socket Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
5.5.2 Europe Dual in-Line Package (DIP) Socket Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
5.6.2 Asia Pacific Dual in-Line Package (DIP) Socket Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
5.7.2 South America Dual in-Line Package (DIP) Socket Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
5.8.2 Middle East & Africa Dual in-Line Package (DIP) Socket Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Dual in-Line Package (DIP) Socket Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Dual in-Line Package (DIP) Socket Sales Value
6.2.1 Key Countries/Regions Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.2.2 Key Countries/Regions Dual in-Line Package (DIP) Socket Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.3.2 United States Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.4.2 Europe Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.5.2 China Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.5.3 China Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.6.2 Japan Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.7.2 South Korea Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.8.2 Southeast Asia Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Dual in-Line Package (DIP) Socket Sales Value, 2019-2030
6.9.2 India Dual in-Line Package (DIP) Socket Sales Value by Type (%), 2023 VS 2030
6.9.3 India Dual in-Line Package (DIP) Socket Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 TE Connectivity
7.1.1 TE Connectivity Company Information
7.1.2 TE Connectivity Introduction and Business Overview
7.1.3 TE Connectivity Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.1.4 TE Connectivity Dual in-Line Package (DIP) Socket Product Offerings
7.1.5 TE Connectivity Recent Development
7.2 3M
7.2.1 3M Company Information
7.2.2 3M Introduction and Business Overview
7.2.3 3M Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.2.4 3M Dual in-Line Package (DIP) Socket Product Offerings
7.2.5 3M Recent Development
7.3 Aries Electronics
7.3.1 Aries Electronics Company Information
7.3.2 Aries Electronics Introduction and Business Overview
7.3.3 Aries Electronics Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Aries Electronics Dual in-Line Package (DIP) Socket Product Offerings
7.3.5 Aries Electronics Recent Development
7.4 Preci-dip
7.4.1 Preci-dip Company Information
7.4.2 Preci-dip Introduction and Business Overview
7.4.3 Preci-dip Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.4.4 Preci-dip Dual in-Line Package (DIP) Socket Product Offerings
7.4.5 Preci-dip Recent Development
7.5 Mill-Max
7.5.1 Mill-Max Company Information
7.5.2 Mill-Max Introduction and Business Overview
7.5.3 Mill-Max Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Mill-Max Dual in-Line Package (DIP) Socket Product Offerings
7.5.5 Mill-Max Recent Development
7.6 Amphenol
7.6.1 Amphenol Company Information
7.6.2 Amphenol Introduction and Business Overview
7.6.3 Amphenol Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.6.4 Amphenol Dual in-Line Package (DIP) Socket Product Offerings
7.6.5 Amphenol Recent Development
7.7 Harwin
7.7.1 Harwin Company Information
7.7.2 Harwin Introduction and Business Overview
7.7.3 Harwin Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Harwin Dual in-Line Package (DIP) Socket Product Offerings
7.7.5 Harwin Recent Development
7.8 Molex
7.8.1 Molex Company Information
7.8.2 Molex Introduction and Business Overview
7.8.3 Molex Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Molex Dual in-Line Package (DIP) Socket Product Offerings
7.8.5 Molex Recent Development
7.9 Samtec
7.9.1 Samtec Company Information
7.9.2 Samtec Introduction and Business Overview
7.9.3 Samtec Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Samtec Dual in-Line Package (DIP) Socket Product Offerings
7.9.5 Samtec Recent Development
7.10 Omron
7.10.1 Omron Company Information
7.10.2 Omron Introduction and Business Overview
7.10.3 Omron Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Omron Dual in-Line Package (DIP) Socket Product Offerings
7.10.5 Omron Recent Development
7.11 Yamaichi Electronics
7.11.1 Yamaichi Electronics Company Information
7.11.2 Yamaichi Electronics Introduction and Business Overview
7.11.3 Yamaichi Electronics Dual in-Line Package (DIP) Socket Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Yamaichi Electronics Dual in-Line Package (DIP) Socket Product Offerings
7.11.5 Yamaichi Electronics Recent Development
8 Industry Chain Analysis
8.1 Dual in-Line Package (DIP) Socket Industrial Chain
8.2 Dual in-Line Package (DIP) Socket Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Dual in-Line Package (DIP) Socket Sales Model
8.5.2 Sales Channel
8.5.3 Dual in-Line Package (DIP) Socket Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
TE Connectivity
3M
Aries Electronics
Preci-dip
Mill-Max
Amphenol
Harwin
Molex
Samtec
Omron
Yamaichi Electronics
听
听
*If Applicable.