Chip Packaging & Testing - Global 麻豆原创 Share and Ranking, Overall Sales and Demand Forecast 2024-2030

Publication ID:

PB511246391

Publication Date:

November 15, 2024

Pages:

159

Publisher:

MRRPB5

Countries:

Global [1]

USD 3,950.00

IT Services [2]

Computing & Electronics [3]

Description:

The global market for Chip Packaging & Testing was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Chip Packaging & Testing, focusing on the total sales revenue, key companies market share and ranking, together with an analysis of Chip Packaging & Testing by region & country, by Type, and by Application.
The Chip Packaging & Testing market size, estimations, and forecasts are provided in terms of sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Chip Packaging & Testing.
麻豆原创 Segmentation
By Company
ASE Technology Holding
Amkor Technology
JCET Group
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
King Yuan ELECTRONICS
ChipMOS TECHNOLOGIES
Chipbond Technology
Sino Ic Technology
Leadyo IC Testing
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
UTAC
Hana Micron
OSE
NEPES
Unisem
Signetics
Carsem
Teradyne
Segment by Type:
Packaging
Testing
Segment by Application
Telecommunications
Automotive
Aerospace and Defense
Medical Devices
Consumer Electronics
Other
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size. This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Chip Packaging & Testing manufacturers competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Revenue of Chip Packaging & Testing in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Revenue of Chip Packaging & Testing in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product revenue, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 麻豆原创 Overview
1.1 Chip Packaging & Testing Product Introduction
1.2 Global Chip Packaging & Testing 麻豆原创 Size Forecast
1.3 Chip Packaging & Testing 麻豆原创 Trends & Drivers
1.3.1 Chip Packaging & Testing Industry Trends
1.3.2 Chip Packaging & Testing 麻豆原创 Drivers & Opportunity
1.3.3 Chip Packaging & Testing 麻豆原创 Challenges
1.3.4 Chip Packaging & Testing 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Chip Packaging & Testing Players Revenue Ranking (2023)
2.2 Global Chip Packaging & Testing Revenue by Company (2019-2024)
2.3 Key Companies Chip Packaging & Testing Manufacturing Base Distribution and Headquarters
2.4 Key Companies Chip Packaging & Testing Product Offered
2.5 Key Companies Time to Begin Mass Production of Chip Packaging & Testing
2.6 Chip Packaging & Testing 麻豆原创 Competitive Analysis
2.6.1 Chip Packaging & Testing 麻豆原创 Concentration Rate (2019-2024)
2.6.2 Global 5 and 10 Largest Companies by Chip Packaging & Testing Revenue in 2023
2.6.3 Global Top Companies by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Chip Packaging & Testing as of 2023)
2.7 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Packaging
3.1.2 Testing
3.2 Global Chip Packaging & Testing Sales Value by Type
3.2.1 Global Chip Packaging & Testing Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Chip Packaging & Testing Sales Value, by Type (2019-2030)
3.2.3 Global Chip Packaging & Testing Sales Value, by Type (%) (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Telecommunications
4.1.2 Automotive
4.1.3 Aerospace and Defense
4.1.4 Medical Devices
4.1.5 Consumer Electronics
4.1.6 Other
4.2 Global Chip Packaging & Testing Sales Value by Application
4.2.1 Global Chip Packaging & Testing Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Chip Packaging & Testing Sales Value, by Application (2019-2030)
4.2.3 Global Chip Packaging & Testing Sales Value, by Application (%) (2019-2030)
5 Segmentation by Region
5.1 Global Chip Packaging & Testing Sales Value by Region
5.1.1 Global Chip Packaging & Testing Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Chip Packaging & Testing Sales Value by Region (2019-2024)
5.1.3 Global Chip Packaging & Testing Sales Value by Region (2025-2030)
5.1.4 Global Chip Packaging & Testing Sales Value by Region (%), (2019-2030)
5.2 North America
5.2.1 North America Chip Packaging & Testing Sales Value, 2019-2030
5.2.2 North America Chip Packaging & Testing Sales Value by Country (%), 2023 VS 2030
5.3 Europe
5.3.1 Europe Chip Packaging & Testing Sales Value, 2019-2030
5.3.2 Europe Chip Packaging & Testing Sales Value by Country (%), 2023 VS 2030
5.4 Asia Pacific
5.4.1 Asia Pacific Chip Packaging & Testing Sales Value, 2019-2030
5.4.2 Asia Pacific Chip Packaging & Testing Sales Value by Country (%), 2023 VS 2030
5.5 South America
5.5.1 South America Chip Packaging & Testing Sales Value, 2019-2030
5.5.2 South America Chip Packaging & Testing Sales Value by Country (%), 2023 VS 2030
5.6 Middle East & Africa
5.6.1 Middle East & Africa Chip Packaging & Testing Sales Value, 2019-2030
5.6.2 Middle East & Africa Chip Packaging & Testing Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Chip Packaging & Testing Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Chip Packaging & Testing Sales Value
6.3 United States
6.3.1 United States Chip Packaging & Testing Sales Value, 2019-2030
6.3.2 United States Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Chip Packaging & Testing Sales Value, 2019-2030
6.4.2 Europe Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Chip Packaging & Testing Sales Value, 2019-2030
6.5.2 China Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.5.3 China Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Chip Packaging & Testing Sales Value, 2019-2030
6.6.2 Japan Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Chip Packaging & Testing Sales Value, 2019-2030
6.7.2 South Korea Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Chip Packaging & Testing Sales Value, 2019-2030
6.8.2 Southeast Asia Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Chip Packaging & Testing Sales Value, 2019-2030
6.9.2 India Chip Packaging & Testing Sales Value by Type (%), 2023 VS 2030
6.9.3 India Chip Packaging & Testing Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 ASE Technology Holding
7.1.1 ASE Technology Holding Profile
7.1.2 ASE Technology Holding Main Business
7.1.3 ASE Technology Holding Chip Packaging & Testing Products, Services and Solutions
7.1.4 ASE Technology Holding Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.1.5 ASE Technology Holding Recent Developments
7.2 Amkor Technology
7.2.1 Amkor Technology Profile
7.2.2 Amkor Technology Main Business
7.2.3 Amkor Technology Chip Packaging & Testing Products, Services and Solutions
7.2.4 Amkor Technology Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.2.5 Amkor Technology Recent Developments
7.3 JCET Group
7.3.1 JCET Group Profile
7.3.2 JCET Group Main Business
7.3.3 JCET Group Chip Packaging & Testing Products, Services and Solutions
7.3.4 JCET Group Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.3.5 Siliconware Precision Industries Recent Developments
7.4 Siliconware Precision Industries
7.4.1 Siliconware Precision Industries Profile
7.4.2 Siliconware Precision Industries Main Business
7.4.3 Siliconware Precision Industries Chip Packaging & Testing Products, Services and Solutions
7.4.4 Siliconware Precision Industries Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.4.5 Siliconware Precision Industries Recent Developments
7.5 Powertech Technology
7.5.1 Powertech Technology Profile
7.5.2 Powertech Technology Main Business
7.5.3 Powertech Technology Chip Packaging & Testing Products, Services and Solutions
7.5.4 Powertech Technology Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.5.5 Powertech Technology Recent Developments
7.6 Tongfu Microelectronics
7.6.1 Tongfu Microelectronics Profile
7.6.2 Tongfu Microelectronics Main Business
7.6.3 Tongfu Microelectronics Chip Packaging & Testing Products, Services and Solutions
7.6.4 Tongfu Microelectronics Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.6.5 Tongfu Microelectronics Recent Developments
7.7 Tianshui Huatian Technology
7.7.1 Tianshui Huatian Technology Profile
7.7.2 Tianshui Huatian Technology Main Business
7.7.3 Tianshui Huatian Technology Chip Packaging & Testing Products, Services and Solutions
7.7.4 Tianshui Huatian Technology Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.7.5 Tianshui Huatian Technology Recent Developments
7.8 King Yuan ELECTRONICS
7.8.1 King Yuan ELECTRONICS Profile
7.8.2 King Yuan ELECTRONICS Main Business
7.8.3 King Yuan ELECTRONICS Chip Packaging & Testing Products, Services and Solutions
7.8.4 King Yuan ELECTRONICS Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.8.5 King Yuan ELECTRONICS Recent Developments
7.9 ChipMOS TECHNOLOGIES
7.9.1 ChipMOS TECHNOLOGIES Profile
7.9.2 ChipMOS TECHNOLOGIES Main Business
7.9.3 ChipMOS TECHNOLOGIES Chip Packaging & Testing Products, Services and Solutions
7.9.4 ChipMOS TECHNOLOGIES Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.9.5 ChipMOS TECHNOLOGIES Recent Developments
7.10 Chipbond Technology
7.10.1 Chipbond Technology Profile
7.10.2 Chipbond Technology Main Business
7.10.3 Chipbond Technology Chip Packaging & Testing Products, Services and Solutions
7.10.4 Chipbond Technology Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.10.5 Chipbond Technology Recent Developments
7.11 Sino Ic Technology
7.11.1 Sino Ic Technology Profile
7.11.2 Sino Ic Technology Main Business
7.11.3 Sino Ic Technology Chip Packaging & Testing Products, Services and Solutions
7.11.4 Sino Ic Technology Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.11.5 Sino Ic Technology Recent Developments
7.12 Leadyo IC Testing
7.12.1 Leadyo IC Testing Profile
7.12.2 Leadyo IC Testing Main Business
7.12.3 Leadyo IC Testing Chip Packaging & Testing Products, Services and Solutions
7.12.4 Leadyo IC Testing Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.12.5 Leadyo IC Testing Recent Developments
7.13 Applied Materials
7.13.1 Applied Materials Profile
7.13.2 Applied Materials Main Business
7.13.3 Applied Materials Chip Packaging & Testing Products, Services and Solutions
7.13.4 Applied Materials Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.13.5 Applied Materials Recent Developments
7.14 ASM Pacific Technology
7.14.1 ASM Pacific Technology Profile
7.14.2 ASM Pacific Technology Main Business
7.14.3 ASM Pacific Technology Chip Packaging & Testing Products, Services and Solutions
7.14.4 ASM Pacific Technology Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.14.5 ASM Pacific Technology Recent Developments
7.15 Kulicke & Soffa Industries
7.15.1 Kulicke & Soffa Industries Profile
7.15.2 Kulicke & Soffa Industries Main Business
7.15.3 Kulicke & Soffa Industries Chip Packaging & Testing Products, Services and Solutions
7.15.4 Kulicke & Soffa Industries Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.15.5 Kulicke & Soffa Industries Recent Developments
7.16 TEL
7.16.1 TEL Profile
7.16.2 TEL Main Business
7.16.3 TEL Chip Packaging & Testing Products, Services and Solutions
7.16.4 TEL Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.16.5 TEL Recent Developments
7.17 Tokyo Seimitsu
7.17.1 Tokyo Seimitsu Profile
7.17.2 Tokyo Seimitsu Main Business
7.17.3 Tokyo Seimitsu Chip Packaging & Testing Products, Services and Solutions
7.17.4 Tokyo Seimitsu Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.17.5 Tokyo Seimitsu Recent Developments
7.18 UTAC
7.18.1 UTAC Profile
7.18.2 UTAC Main Business
7.18.3 UTAC Chip Packaging & Testing Products, Services and Solutions
7.18.4 UTAC Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.18.5 UTAC Recent Developments
7.19 Hana Micron
7.19.1 Hana Micron Profile
7.19.2 Hana Micron Main Business
7.19.3 Hana Micron Chip Packaging & Testing Products, Services and Solutions
7.19.4 Hana Micron Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.19.5 Hana Micron Recent Developments
7.20 OSE
7.20.1 OSE Profile
7.20.2 OSE Main Business
7.20.3 OSE Chip Packaging & Testing Products, Services and Solutions
7.20.4 OSE Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.20.5 OSE Recent Developments
7.21 NEPES
7.21.1 NEPES Profile
7.21.2 NEPES Main Business
7.21.3 NEPES Chip Packaging & Testing Products, Services and Solutions
7.21.4 NEPES Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.21.5 NEPES Recent Developments
7.22 Unisem
7.22.1 Unisem Profile
7.22.2 Unisem Main Business
7.22.3 Unisem Chip Packaging & Testing Products, Services and Solutions
7.22.4 Unisem Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.22.5 Unisem Recent Developments
7.23 Signetics
7.23.1 Signetics Profile
7.23.2 Signetics Main Business
7.23.3 Signetics Chip Packaging & Testing Products, Services and Solutions
7.23.4 Signetics Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.23.5 Signetics Recent Developments
7.24 Carsem
7.24.1 Carsem Profile
7.24.2 Carsem Main Business
7.24.3 Carsem Chip Packaging & Testing Products, Services and Solutions
7.24.4 Carsem Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.24.5 Carsem Recent Developments
7.25 Teradyne
7.25.1 Teradyne Profile
7.25.2 Teradyne Main Business
7.25.3 Teradyne Chip Packaging & Testing Products, Services and Solutions
7.25.4 Teradyne Chip Packaging & Testing Revenue (US$ Million) & (2019-2024)
7.25.5 Teradyne Recent Developments
8 Industry Chain Analysis
8.1 Chip Packaging & Testing Industrial Chain
8.2 Chip Packaging & Testing Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Chip Packaging & Testing Sales Model
8.5.2 Sales Channel
8.5.3 Chip Packaging & Testing Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer

Companies Mentioned:

ASE Technology Holding
Amkor Technology
JCET Group
Siliconware Precision Industries
Powertech Technology
Tongfu Microelectronics
Tianshui Huatian Technology
King Yuan ELECTRONICS
ChipMOS TECHNOLOGIES
Chipbond Technology
Sino Ic Technology
Leadyo IC Testing
Applied Materials
ASM Pacific Technology
Kulicke & Soffa Industries
TEL
Tokyo Seimitsu
UTAC
Hana Micron
OSE
NEPES
Unisem
Signetics
Carsem
Teradyne

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.