Bonding wire is used as an interconnect material for a semiconductor package. It is a thin metal wire to carry electric signals from a semiconductor to an external part. Semiconductors are used in various kinds of stuff that support our daily life from PCs, home appliances, and to automobiles. In general, a semiconductor package is sealed with a mold resin after wire bonding process, thus bonding wire is not seen from outside.Gold, silver, copper, and aluminum are used as a material for bonding wire. Gold had been almost exclusively used for ball bonding process, but the invention of palladium coated copper (PCC) wire (EX wire) has changed the dynamics of bonding wire market in the early 2010s. Now the PCC wire is the most widely used material in the market. In recent years, the use of silver wire is also increasing in various types of package application as an alternative to gold wire. Aluminum wire is mainly used for wedge bonding process mainly for power semiconductors.
The global market for Bonding Wire for Semiconductor Packaging was estimated to be worth US$ million in 2023 and is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.134% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Report Scope
This report aims to provide a comprehensive presentation of the global market for Bonding Wire for Semiconductor Packaging, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Bonding Wire for Semiconductor Packaging by region & country, by Type, and by Application.
The Bonding Wire for Semiconductor Packaging market size, estimations, and forecasts are provided in terms of sales volume (K MT) and sales revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Bonding Wire for Semiconductor Packaging.
麻豆原创 Segmentation
By Company
Heraeus
Tanaka
Nippon Steel
AMETEK
Tatsuta
MKE Electron
Yantai Yesdo Electronic Materials
Ningbo Kangqiang Electronics
Beijing Dabo Nonferrous Metal Solder
Shanghai Wonsung Alloy Materials
Yantai Zhaojin Kanfort Precious Metals Incorporated Company
MATFRON
Jiangsu Jincan Electronic Technology
Niche-Tech
Segment by Type:
Bonding Alloy Wire
Bonded Copper Wire
Bonded Silver Wire
Bonded Aluminum Wire
Others
Segment by Application
Communication
Computer
Consumer Electronics
Automobile
Others
By Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (valve, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Bonding Wire for Semiconductor Packaging manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Bonding Wire for Semiconductor Packaging in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Bonding Wire for Semiconductor Packaging in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 麻豆原创 Overview
1.1 Bonding Wire for Semiconductor Packaging Product Introduction
1.2 Global Bonding Wire for Semiconductor Packaging 麻豆原创 Size Forecast
1.2.1 Global Bonding Wire for Semiconductor Packaging Sales Value (2019-2030)
1.2.2 Global Bonding Wire for Semiconductor Packaging Sales Volume (2019-2030)
1.2.3 Global Bonding Wire for Semiconductor Packaging Sales Price (2019-2030)
1.3 Bonding Wire for Semiconductor Packaging 麻豆原创 Trends & Drivers
1.3.1 Bonding Wire for Semiconductor Packaging Industry Trends
1.3.2 Bonding Wire for Semiconductor Packaging 麻豆原创 Drivers & Opportunity
1.3.3 Bonding Wire for Semiconductor Packaging 麻豆原创 Challenges
1.3.4 Bonding Wire for Semiconductor Packaging 麻豆原创 Restraints
1.4 Assumptions and Limitations
1.5 Study Objectives
1.6 Years Considered
2 Competitive Analysis by Company
2.1 Global Bonding Wire for Semiconductor Packaging Players Revenue Ranking (2023)
2.2 Global Bonding Wire for Semiconductor Packaging Revenue by Company (2019-2024)
2.3 Global Bonding Wire for Semiconductor Packaging Players Sales Volume Ranking (2023)
2.4 Global Bonding Wire for Semiconductor Packaging Sales Volume by Company Players (2019-2024)
2.5 Global Bonding Wire for Semiconductor Packaging Average Price by Company (2019-2024)
2.6 Key Manufacturers Bonding Wire for Semiconductor Packaging Manufacturing Base Distribution and Headquarters
2.7 Key Manufacturers Bonding Wire for Semiconductor Packaging Product Offered
2.8 Key Manufacturers Time to Begin Mass Production of Bonding Wire for Semiconductor Packaging
2.9 Bonding Wire for Semiconductor Packaging 麻豆原创 Competitive Analysis
2.9.1 Bonding Wire for Semiconductor Packaging 麻豆原创 Concentration Rate (2019-2024)
2.9.2 Global 5 and 10 Largest Manufacturers by Bonding Wire for Semiconductor Packaging Revenue in 2023
2.9.3 Global Top Manufacturers by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Bonding Wire for Semiconductor Packaging as of 2023)
2.10 Mergers & Acquisitions, Expansion
3 Segmentation by Type
3.1 Introduction by Type
3.1.1 Bonding Alloy Wire
3.1.2 Bonded Copper Wire
3.1.3 Bonded Silver Wire
3.1.4 Bonded Aluminum Wire
3.1.5 Others
3.2 Global Bonding Wire for Semiconductor Packaging Sales Value by Type
3.2.1 Global Bonding Wire for Semiconductor Packaging Sales Value by Type (2019 VS 2023 VS 2030)
3.2.2 Global Bonding Wire for Semiconductor Packaging Sales Value, by Type (2019-2030)
3.2.3 Global Bonding Wire for Semiconductor Packaging Sales Value, by Type (%) (2019-2030)
3.3 Global Bonding Wire for Semiconductor Packaging Sales Volume by Type
3.3.1 Global Bonding Wire for Semiconductor Packaging Sales Volume by Type (2019 VS 2023 VS 2030)
3.3.2 Global Bonding Wire for Semiconductor Packaging Sales Volume, by Type (2019-2030)
3.3.3 Global Bonding Wire for Semiconductor Packaging Sales Volume, by Type (%) (2019-2030)
3.4 Global Bonding Wire for Semiconductor Packaging Average Price by Type (2019-2030)
4 Segmentation by Application
4.1 Introduction by Application
4.1.1 Communication
4.1.2 Computer
4.1.3 Consumer Electronics
4.1.4 Automobile
4.1.5 Others
4.2 Global Bonding Wire for Semiconductor Packaging Sales Value by Application
4.2.1 Global Bonding Wire for Semiconductor Packaging Sales Value by Application (2019 VS 2023 VS 2030)
4.2.2 Global Bonding Wire for Semiconductor Packaging Sales Value, by Application (2019-2030)
4.2.3 Global Bonding Wire for Semiconductor Packaging Sales Value, by Application (%) (2019-2030)
4.3 Global Bonding Wire for Semiconductor Packaging Sales Volume by Application
4.3.1 Global Bonding Wire for Semiconductor Packaging Sales Volume by Application (2019 VS 2023 VS 2030)
4.3.2 Global Bonding Wire for Semiconductor Packaging Sales Volume, by Application (2019-2030)
4.3.3 Global Bonding Wire for Semiconductor Packaging Sales Volume, by Application (%) (2019-2030)
4.4 Global Bonding Wire for Semiconductor Packaging Average Price by Application (2019-2030)
5 Segmentation by Region
5.1 Global Bonding Wire for Semiconductor Packaging Sales Value by Region
5.1.1 Global Bonding Wire for Semiconductor Packaging Sales Value by Region: 2019 VS 2023 VS 2030
5.1.2 Global Bonding Wire for Semiconductor Packaging Sales Value by Region (2019-2024)
5.1.3 Global Bonding Wire for Semiconductor Packaging Sales Value by Region (2025-2030)
5.1.4 Global Bonding Wire for Semiconductor Packaging Sales Value by Region (%), (2019-2030)
5.2 Global Bonding Wire for Semiconductor Packaging Sales Volume by Region
5.2.1 Global Bonding Wire for Semiconductor Packaging Sales Volume by Region: 2019 VS 2023 VS 2030
5.2.2 Global Bonding Wire for Semiconductor Packaging Sales Volume by Region (2019-2024)
5.2.3 Global Bonding Wire for Semiconductor Packaging Sales Volume by Region (2025-2030)
5.2.4 Global Bonding Wire for Semiconductor Packaging Sales Volume by Region (%), (2019-2030)
5.3 Global Bonding Wire for Semiconductor Packaging Average Price by Region (2019-2030)
5.4 North America
5.4.1 North America Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
5.4.2 North America Bonding Wire for Semiconductor Packaging Sales Value by Country (%), 2023 VS 2030
5.5 Europe
5.5.1 Europe Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
5.5.2 Europe Bonding Wire for Semiconductor Packaging Sales Value by Country (%), 2023 VS 2030
5.6 Asia Pacific
5.6.1 Asia Pacific Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
5.6.2 Asia Pacific Bonding Wire for Semiconductor Packaging Sales Value by Country (%), 2023 VS 2030
5.7 South America
5.7.1 South America Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
5.7.2 South America Bonding Wire for Semiconductor Packaging Sales Value by Country (%), 2023 VS 2030
5.8 Middle East & Africa
5.8.1 Middle East & Africa Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
5.8.2 Middle East & Africa Bonding Wire for Semiconductor Packaging Sales Value by Country (%), 2023 VS 2030
6 Segmentation by Key Countries/Regions
6.1 Key Countries/Regions Bonding Wire for Semiconductor Packaging Sales Value Growth Trends, 2019 VS 2023 VS 2030
6.2 Key Countries/Regions Bonding Wire for Semiconductor Packaging Sales Value
6.2.1 Key Countries/Regions Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.2.2 Key Countries/Regions Bonding Wire for Semiconductor Packaging Sales Volume, 2019-2030
6.3 United States
6.3.1 United States Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.3.2 United States Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.3.3 United States Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
6.4 Europe
6.4.1 Europe Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.4.2 Europe Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.4.3 Europe Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
6.5 China
6.5.1 China Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.5.2 China Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.5.3 China Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
6.6 Japan
6.6.1 Japan Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.6.2 Japan Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.6.3 Japan Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
6.7 South Korea
6.7.1 South Korea Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.7.2 South Korea Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.7.3 South Korea Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
6.8 Southeast Asia
6.8.1 Southeast Asia Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.8.2 Southeast Asia Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.8.3 Southeast Asia Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
6.9 India
6.9.1 India Bonding Wire for Semiconductor Packaging Sales Value, 2019-2030
6.9.2 India Bonding Wire for Semiconductor Packaging Sales Value by Type (%), 2023 VS 2030
6.9.3 India Bonding Wire for Semiconductor Packaging Sales Value by Application, 2023 VS 2030
7 Company Profiles
7.1 Heraeus
7.1.1 Heraeus Company Information
7.1.2 Heraeus Introduction and Business Overview
7.1.3 Heraeus Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.1.4 Heraeus Bonding Wire for Semiconductor Packaging Product Offerings
7.1.5 Heraeus Recent Development
7.2 Tanaka
7.2.1 Tanaka Company Information
7.2.2 Tanaka Introduction and Business Overview
7.2.3 Tanaka Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.2.4 Tanaka Bonding Wire for Semiconductor Packaging Product Offerings
7.2.5 Tanaka Recent Development
7.3 Nippon Steel
7.3.1 Nippon Steel Company Information
7.3.2 Nippon Steel Introduction and Business Overview
7.3.3 Nippon Steel Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.3.4 Nippon Steel Bonding Wire for Semiconductor Packaging Product Offerings
7.3.5 Nippon Steel Recent Development
7.4 AMETEK
7.4.1 AMETEK Company Information
7.4.2 AMETEK Introduction and Business Overview
7.4.3 AMETEK Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.4.4 AMETEK Bonding Wire for Semiconductor Packaging Product Offerings
7.4.5 AMETEK Recent Development
7.5 Tatsuta
7.5.1 Tatsuta Company Information
7.5.2 Tatsuta Introduction and Business Overview
7.5.3 Tatsuta Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.5.4 Tatsuta Bonding Wire for Semiconductor Packaging Product Offerings
7.5.5 Tatsuta Recent Development
7.6 MKE Electron
7.6.1 MKE Electron Company Information
7.6.2 MKE Electron Introduction and Business Overview
7.6.3 MKE Electron Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.6.4 MKE Electron Bonding Wire for Semiconductor Packaging Product Offerings
7.6.5 MKE Electron Recent Development
7.7 Yantai Yesdo Electronic Materials
7.7.1 Yantai Yesdo Electronic Materials Company Information
7.7.2 Yantai Yesdo Electronic Materials Introduction and Business Overview
7.7.3 Yantai Yesdo Electronic Materials Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.7.4 Yantai Yesdo Electronic Materials Bonding Wire for Semiconductor Packaging Product Offerings
7.7.5 Yantai Yesdo Electronic Materials Recent Development
7.8 Ningbo Kangqiang Electronics
7.8.1 Ningbo Kangqiang Electronics Company Information
7.8.2 Ningbo Kangqiang Electronics Introduction and Business Overview
7.8.3 Ningbo Kangqiang Electronics Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.8.4 Ningbo Kangqiang Electronics Bonding Wire for Semiconductor Packaging Product Offerings
7.8.5 Ningbo Kangqiang Electronics Recent Development
7.9 Beijing Dabo Nonferrous Metal Solder
7.9.1 Beijing Dabo Nonferrous Metal Solder Company Information
7.9.2 Beijing Dabo Nonferrous Metal Solder Introduction and Business Overview
7.9.3 Beijing Dabo Nonferrous Metal Solder Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.9.4 Beijing Dabo Nonferrous Metal Solder Bonding Wire for Semiconductor Packaging Product Offerings
7.9.5 Beijing Dabo Nonferrous Metal Solder Recent Development
7.10 Shanghai Wonsung Alloy Materials
7.10.1 Shanghai Wonsung Alloy Materials Company Information
7.10.2 Shanghai Wonsung Alloy Materials Introduction and Business Overview
7.10.3 Shanghai Wonsung Alloy Materials Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.10.4 Shanghai Wonsung Alloy Materials Bonding Wire for Semiconductor Packaging Product Offerings
7.10.5 Shanghai Wonsung Alloy Materials Recent Development
7.11 Yantai Zhaojin Kanfort Precious Metals Incorporated Company
7.11.1 Yantai Zhaojin Kanfort Precious Metals Incorporated Company Company Information
7.11.2 Yantai Zhaojin Kanfort Precious Metals Incorporated Company Introduction and Business Overview
7.11.3 Yantai Zhaojin Kanfort Precious Metals Incorporated Company Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.11.4 Yantai Zhaojin Kanfort Precious Metals Incorporated Company Bonding Wire for Semiconductor Packaging Product Offerings
7.11.5 Yantai Zhaojin Kanfort Precious Metals Incorporated Company Recent Development
7.12 MATFRON
7.12.1 MATFRON Company Information
7.12.2 MATFRON Introduction and Business Overview
7.12.3 MATFRON Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.12.4 MATFRON Bonding Wire for Semiconductor Packaging Product Offerings
7.12.5 MATFRON Recent Development
7.13 Jiangsu Jincan Electronic Technology
7.13.1 Jiangsu Jincan Electronic Technology Company Information
7.13.2 Jiangsu Jincan Electronic Technology Introduction and Business Overview
7.13.3 Jiangsu Jincan Electronic Technology Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.13.4 Jiangsu Jincan Electronic Technology Bonding Wire for Semiconductor Packaging Product Offerings
7.13.5 Jiangsu Jincan Electronic Technology Recent Development
7.14 Niche-Tech
7.14.1 Niche-Tech Company Information
7.14.2 Niche-Tech Introduction and Business Overview
7.14.3 Niche-Tech Bonding Wire for Semiconductor Packaging Sales, Revenue and Gross Margin (2019-2024)
7.14.4 Niche-Tech Bonding Wire for Semiconductor Packaging Product Offerings
7.14.5 Niche-Tech Recent Development
8 Industry Chain Analysis
8.1 Bonding Wire for Semiconductor Packaging Industrial Chain
8.2 Bonding Wire for Semiconductor Packaging Upstream Analysis
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.2.3 Manufacturing Cost Structure
8.3 Midstream Analysis
8.4 Downstream Analysis (Customers Analysis)
8.5 Sales Model and Sales Channels
8.5.1 Bonding Wire for Semiconductor Packaging Sales Model
8.5.2 Sales Channel
8.5.3 Bonding Wire for Semiconductor Packaging Distributors
9 Research Findings and Conclusion
10 Appendix
10.1 Research Methodology
10.1.1 Methodology/Research Approach
10.1.2 Data Source
10.2 Author Details
10.3 Disclaimer
Heraeus
Tanaka
Nippon Steel
AMETEK
Tatsuta
MKE Electron
Yantai Yesdo Electronic Materials
Ningbo Kangqiang Electronics
Beijing Dabo Nonferrous Metal Solder
Shanghai Wonsung Alloy Materials
Yantai Zhaojin Kanfort Precious Metals Incorporated Company
MATFRON
Jiangsu Jincan Electronic Technology
Niche-Tech
听
听
*If Applicable.
