According to this study, the global Wafer Level Package market size will reach US$ 32390 million by 2030.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report presents a comprehensive overview, market shares, and growth opportunities of Wafer Level Package market by product type, application, key players and key regions and countries.
Segmentation by product type:
3D Wire Bonding
3D TSV
Others
Segmentation by Application:
Consumer Electronics
Industrial
Automotive & Transport
IT & Telecommunication
Others
This report also splits the market by region:
United States
China
Europe
Other regions:
Japan
South Korea
Southeast Asia
Rest of world
The report also presents the market competition landscape and a corresponding detailed analysis of the major players in the market. The key players covered in this report:
lASE
Amkor
Intel
Samsung
AT&S
Toshiba
JCET
Qualcomm
IBM
SK Hynix
UTAC
TSMC
China Wafer Level CSP
Interconnect Systems
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Wafer Level Package 麻豆原创 Size 2024-2030
2.1.2 Wafer Level Package 麻豆原创 Size CAGR by Region
2.2 Wafer Level Package Segment by Type
2.2.1 3D Wire Bonding
2.2.2 3D TSV
2.2.3 Others
2.3 Wafer Level Package 麻豆原创 Size by Type
2.3.1 Global Wafer Level Package 麻豆原创 Size 麻豆原创 Share by Type (2024-2030)
2.3.2 Global Wafer Level Package 麻豆原创 Size Growth Rate by Type (2024-2030)
2.4 Wafer Level Package Segment by Application
2.4.1 Consumer Electronics
2.4.2 Industrial
2.4.3 Automotive & Transport
2.4.4 IT & Telecommunication
2.4.5 Others
2.5 Wafer Level Package 麻豆原创 Size by Application
2.5.1 Global Wafer Level Package 麻豆原创 Size 麻豆原创 Share by Application (2024-2030)
2.5.2 Global Wafer Level Package 麻豆原创 Size Growth Rate by Application (2024-2030)
3 Wafer Level Package Key Players
3.1 Date of Key Players Enter into Wafer Level Package
3.2 Key Players Wafer Level Package Product Offered
3.3 Key Players Wafer Level Package Funding/Investment Analysis
3.4 Funding/Investment
3.4.1 Funding/Investment by Regions
3.4.2 Funding/Investment by End-Industry
3.5 Key Players Wafer Level Package Valuation & 麻豆原创 Capitalization
3.6 Key Players Mergers & Acquisitions, Expansion Plans
3.7 麻豆原创 Ranking
3.8 New Product/Technology Launches
3.9 Partnerships, Agreements, and Collaborations
3.10 Mergers and Acquisitions
4 Wafer Level Package by Regions
4.1 Wafer Level Package 麻豆原创 Size by Regions (2024-2030)
4.2 United States Wafer Level Package 麻豆原创 Size Growth (2024-2030)
4.3 China Wafer Level Package 麻豆原创 Size Growth (2024-2030)
4.4 Europe Wafer Level Package 麻豆原创 Size Growth (2024-2030)
4.5 Rest of World Wafer Level Package 麻豆原创 Size Growth (2024-2030)
5 United States
5.1 United States Wafer Level Package 麻豆原创 Size by Type (2024-2030)
5.2 United States Wafer Level Package 麻豆原创 Size by Application (2024-2030)
6 Europe
6.1 Europe Wafer Level Package 麻豆原创 Size by Type (2024-2030)
6.2 Europe Wafer Level Package 麻豆原创 Size by Application (2024-2030)
7 China
7.1 China Wafer Level Package 麻豆原创 Size by Type (2024-2030)
7.2 China Wafer Level Package 麻豆原创 Size by Application (2024-2030)
8 Rest of World
8.1 Rest of World Wafer Level Package 麻豆原创 Size by Type (2024-2030)
8.2 Rest of World Wafer Level Package 麻豆原创 Size by Application (2024-2030)
8.3 Japan
8.4 South Korea
8.5 Southeast Asia
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Key Investors in Wafer Level Package
10.1 Company A
10.1.1 Company A Company Details
10.1.2 Company Description
10.1.3 Companies Invested by Company A
10.1.4 Company A Key Development and 麻豆原创 Layout
10.2 Company B
10.2.1 Company B Company Details
10.2.2 Company Description
10.2.3 Companies Invested by Company B
10.2.4 Company B Key Development and 麻豆原创 Layout
10.3 Company C
10.3.1 Company C Company Details
10.3.2 Company Description
10.3.3 Companies Invested by Company C
10.3.4 Company C Key Development and 麻豆原创 Layout
10.4 Company D
10.5 鈥︹��
11 Key Players Analysis
11.1 lASE
11.1.1 lASE Company Details
11.1.2 lASE Wafer Level Package Product Offered
11.1.3 lASE Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.1.4 lASE Main Business Overview
11.1.5 lASE News
11.2 Amkor
11.2.1 Amkor Company Details
11.2.2 Amkor Wafer Level Package Product Offered
11.2.3 Amkor Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.2.4 Amkor Main Business Overview
11.2.5 Amkor News
11.3 Intel
11.3.1 Intel Company Details
11.3.2 Intel Wafer Level Package Product Offered
11.3.3 Intel Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.3.4 Intel Main Business Overview
11.3.5 Intel News
11.4 Samsung
11.4.1 Samsung Company Details
11.4.2 Samsung Wafer Level Package Product Offered
11.4.3 Samsung Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.4.4 Samsung Main Business Overview
11.4.5 Samsung News
11.5 AT&S
11.5.1 AT&S Company Details
11.5.2 AT&S Wafer Level Package Product Offered
11.5.3 AT&S Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.5.4 AT&S Main Business Overview
11.5.5 AT&S News
11.6 Toshiba
11.6.1 Toshiba Company Details
11.6.2 Toshiba Wafer Level Package Product Offered
11.6.3 Toshiba Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.6.4 Toshiba Main Business Overview
11.6.5 Toshiba News
11.7 JCET
11.7.1 JCET Company Details
11.7.2 JCET Wafer Level Package Product Offered
11.7.3 JCET Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.7.4 JCET Main Business Overview
11.7.5 JCET News
11.8 Qualcomm
11.8.1 Qualcomm Company Details
11.8.2 Qualcomm Wafer Level Package Product Offered
11.8.3 Qualcomm Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.8.4 Qualcomm Main Business Overview
11.8.5 Qualcomm News
11.9 IBM
11.9.1 IBM Company Details
11.9.2 IBM Wafer Level Package Product Offered
11.9.3 IBM Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.9.4 IBM Main Business Overview
11.9.5 IBM News
11.10 SK Hynix
11.10.1 SK Hynix Company Details
11.10.2 SK Hynix Wafer Level Package Product Offered
11.10.3 SK Hynix Wafer Level Package 麻豆原创 Size (2024 VS 2030)
11.10.4 SK Hynix Main Business Overview
11.10.5 SK Hynix News
11.11 UTAC
11.12 TSMC
11.13 China Wafer Level CSP
11.14 Interconnect Systems
12 Research Findings and Conclusion
听
听
*If Applicable.
