Global UBM Plating Service 麻豆原创 Growth (Status and Outlook) 2024-2030

Publication ID:

LPI07241648

Publication Date:

July 30, 2024

Pages:

119

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

Flip chip bonding is increasingly taking over conventional wire bonding for bonding of microchips, as semiconductor packaging technology advances toward smaller sizes and higher density. Under Bump Metallurgy (UBM) formation to bond metal pads to solder is considered to be essential in flip chip bonding. "UBM" stands for Under Bump Metallurgy (also described as Under Bump Metal or Under Barrier Metal) and is applied to provide solderability to electrodes of semiconductor wafers. UBM is formed by plating wafers or other methods (then UBM is sometimes called as "top metal plating").
The global UBM Plating Service market size is projected to grow from US$ 236 million in 2024 to US$ 338 million in 2030; it is expected to grow at a CAGR of 6.2% from 2024 to 2030.
The 鈥淯BM Plating Service Industry Forecast鈥� looks at past sales and reviews total world UBM Plating Service sales in 2022, providing a comprehensive analysis by region and market sector of projected UBM Plating Service sales for 2023 through 2029. With UBM Plating Service sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world UBM Plating Service industry.
This Insight Report provides a comprehensive analysis of the global UBM Plating Service landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on UBM Plating Service portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global UBM Plating Service market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for UBM Plating Service and breaks down the forecast by Wafer Size, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global UBM Plating Service.
United States market for UBM Plating Service is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for UBM Plating Service is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for UBM Plating Service is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key UBM Plating Service players cover JX Advanced Metals Corporation, MacDermid Alpha Electronics Solutions, RENA, NINGBO CHIPEX SEMICONDUCTOR, TETOS Co., LTD, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of UBM Plating Service market by product type, application, key players and key regions and countries.
Segmentation by Wafer Size:
12 Inch Wafer
8 Inch Wafer
Others
Segmentation by Application:
Logic
Memory
Power Semiconductors
MEMS
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Segmentation by Wafer Size:
12 Inch Wafer
8 Inch Wafer
Others
Segmentation by Application:
Logic
Memory
Power Semiconductors
MEMS
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
JX Advanced Metals Corporation
MacDermid Alpha Electronics Solutions
RENA
NINGBO CHIPEX SEMICONDUCTOR
TETOS Co., LTD
JCET Group
AEMtec GmbH
Epson (SEP Plating Division)
Maxell, Ltd
PacTech
Uyemura
Advafab
Fraunhofer ISIT
AEMtec

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global UBM Plating Service 麻豆原创 Size 2019-2030
2.1.2 UBM Plating Service 麻豆原创 Size CAGR by Region (2019 VS 2023 VS 2030)
2.1.3 World Current & Future Analysis for UBM Plating Service by Country/Region, 2019, 2023 & 2030
2.2 UBM Plating Service Segment by Wafer Size
2.2.1 12 Inch Wafer
2.2.2 8 Inch Wafer
2.2.3 Others
2.3 UBM Plating Service 麻豆原创 Size by Wafer Size
2.3.1 UBM Plating Service 麻豆原创 Size CAGR by Wafer Size (2019 VS 2023 VS 2030)
2.3.2 Global UBM Plating Service 麻豆原创 Size 麻豆原创 Share by Wafer Size (2019-2024)
2.4 UBM Plating Service Segment by Application
2.4.1 Logic
2.4.2 Memory
2.4.3 Power Semiconductors
2.4.4 MEMS
2.4.5 Others
2.5 UBM Plating Service 麻豆原创 Size by Application
2.5.1 UBM Plating Service 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global UBM Plating Service 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 UBM Plating Service 麻豆原创 Size by Player
3.1 UBM Plating Service 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global UBM Plating Service Revenue by Player (2019-2024)
3.1.2 Global UBM Plating Service Revenue 麻豆原创 Share by Player (2019-2024)
3.2 Global UBM Plating Service Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 UBM Plating Service by Region
4.1 UBM Plating Service 麻豆原创 Size by Region (2019-2024)
4.2 Global UBM Plating Service Annual Revenue by Country/Region (2019-2024)
4.3 Americas UBM Plating Service 麻豆原创 Size Growth (2019-2024)
4.4 APAC UBM Plating Service 麻豆原创 Size Growth (2019-2024)
4.5 Europe UBM Plating Service 麻豆原创 Size Growth (2019-2024)
4.6 Middle East & Africa UBM Plating Service 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas UBM Plating Service 麻豆原创 Size by Country (2019-2024)
5.2 Americas UBM Plating Service 麻豆原创 Size by Wafer Size (2019-2024)
5.3 Americas UBM Plating Service 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC UBM Plating Service 麻豆原创 Size by Region (2019-2024)
6.2 APAC UBM Plating Service 麻豆原创 Size by Wafer Size (2019-2024)
6.3 APAC UBM Plating Service 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe UBM Plating Service 麻豆原创 Size by Country (2019-2024)
7.2 Europe UBM Plating Service 麻豆原创 Size by Wafer Size (2019-2024)
7.3 Europe UBM Plating Service 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa UBM Plating Service by Region (2019-2024)
8.2 Middle East & Africa UBM Plating Service 麻豆原创 Size by Wafer Size (2019-2024)
8.3 Middle East & Africa UBM Plating Service 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global UBM Plating Service 麻豆原创 Forecast
10.1 Global UBM Plating Service Forecast by Region (2025-2030)
10.1.1 Global UBM Plating Service Forecast by Region (2025-2030)
10.1.2 Americas UBM Plating Service Forecast
10.1.3 APAC UBM Plating Service Forecast
10.1.4 Europe UBM Plating Service Forecast
10.1.5 Middle East & Africa UBM Plating Service Forecast
10.2 Americas UBM Plating Service Forecast by Country (2025-2030)
10.2.1 United States 麻豆原创 UBM Plating Service Forecast
10.2.2 Canada 麻豆原创 UBM Plating Service Forecast
10.2.3 Mexico 麻豆原创 UBM Plating Service Forecast
10.2.4 Brazil 麻豆原创 UBM Plating Service Forecast
10.3 APAC UBM Plating Service Forecast by Region (2025-2030)
10.3.1 China UBM Plating Service 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 UBM Plating Service Forecast
10.3.3 Korea 麻豆原创 UBM Plating Service Forecast
10.3.4 Southeast Asia 麻豆原创 UBM Plating Service Forecast
10.3.5 India 麻豆原创 UBM Plating Service Forecast
10.3.6 Australia 麻豆原创 UBM Plating Service Forecast
10.4 Europe UBM Plating Service Forecast by Country (2025-2030)
10.4.1 Germany 麻豆原创 UBM Plating Service Forecast
10.4.2 France 麻豆原创 UBM Plating Service Forecast
10.4.3 UK 麻豆原创 UBM Plating Service Forecast
10.4.4 Italy 麻豆原创 UBM Plating Service Forecast
10.4.5 Russia 麻豆原创 UBM Plating Service Forecast
10.5 Middle East & Africa UBM Plating Service Forecast by Region (2025-2030)
10.5.1 Egypt 麻豆原创 UBM Plating Service Forecast
10.5.2 South Africa 麻豆原创 UBM Plating Service Forecast
10.5.3 Israel 麻豆原创 UBM Plating Service Forecast
10.5.4 Turkey 麻豆原创 UBM Plating Service Forecast
10.6 Global UBM Plating Service Forecast by Wafer Size (2025-2030)
10.7 Global UBM Plating Service Forecast by Application (2025-2030)
10.7.1 GCC Countries 麻豆原创 UBM Plating Service Forecast
11 Key Players Analysis
11.1 JX Advanced Metals Corporation
11.1.1 JX Advanced Metals Corporation Company Information
11.1.2 JX Advanced Metals Corporation UBM Plating Service Product Offered
11.1.3 JX Advanced Metals Corporation UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 JX Advanced Metals Corporation Main Business Overview
11.1.5 JX Advanced Metals Corporation Latest Developments
11.2 MacDermid Alpha Electronics Solutions
11.2.1 MacDermid Alpha Electronics Solutions Company Information
11.2.2 MacDermid Alpha Electronics Solutions UBM Plating Service Product Offered
11.2.3 MacDermid Alpha Electronics Solutions UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 MacDermid Alpha Electronics Solutions Main Business Overview
11.2.5 MacDermid Alpha Electronics Solutions Latest Developments
11.3 RENA
11.3.1 RENA Company Information
11.3.2 RENA UBM Plating Service Product Offered
11.3.3 RENA UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 RENA Main Business Overview
11.3.5 RENA Latest Developments
11.4 NINGBO CHIPEX SEMICONDUCTOR
11.4.1 NINGBO CHIPEX SEMICONDUCTOR Company Information
11.4.2 NINGBO CHIPEX SEMICONDUCTOR UBM Plating Service Product Offered
11.4.3 NINGBO CHIPEX SEMICONDUCTOR UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 NINGBO CHIPEX SEMICONDUCTOR Main Business Overview
11.4.5 NINGBO CHIPEX SEMICONDUCTOR Latest Developments
11.5 TETOS Co., LTD
11.5.1 TETOS Co., LTD Company Information
11.5.2 TETOS Co., LTD UBM Plating Service Product Offered
11.5.3 TETOS Co., LTD UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 TETOS Co., LTD Main Business Overview
11.5.5 TETOS Co., LTD Latest Developments
11.6 JCET Group
11.6.1 JCET Group Company Information
11.6.2 JCET Group UBM Plating Service Product Offered
11.6.3 JCET Group UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 JCET Group Main Business Overview
11.6.5 JCET Group Latest Developments
11.7 AEMtec GmbH
11.7.1 AEMtec GmbH Company Information
11.7.2 AEMtec GmbH UBM Plating Service Product Offered
11.7.3 AEMtec GmbH UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.7.4 AEMtec GmbH Main Business Overview
11.7.5 AEMtec GmbH Latest Developments
11.8 Epson (SEP Plating Division)
11.8.1 Epson (SEP Plating Division) Company Information
11.8.2 Epson (SEP Plating Division) UBM Plating Service Product Offered
11.8.3 Epson (SEP Plating Division) UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.8.4 Epson (SEP Plating Division) Main Business Overview
11.8.5 Epson (SEP Plating Division) Latest Developments
11.9 Maxell, Ltd
11.9.1 Maxell, Ltd Company Information
11.9.2 Maxell, Ltd UBM Plating Service Product Offered
11.9.3 Maxell, Ltd UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.9.4 Maxell, Ltd Main Business Overview
11.9.5 Maxell, Ltd Latest Developments
11.10 PacTech
11.10.1 PacTech Company Information
11.10.2 PacTech UBM Plating Service Product Offered
11.10.3 PacTech UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.10.4 PacTech Main Business Overview
11.10.5 PacTech Latest Developments
11.11 Uyemura
11.11.1 Uyemura Company Information
11.11.2 Uyemura UBM Plating Service Product Offered
11.11.3 Uyemura UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.11.4 Uyemura Main Business Overview
11.11.5 Uyemura Latest Developments
11.12 Advafab
11.12.1 Advafab Company Information
11.12.2 Advafab UBM Plating Service Product Offered
11.12.3 Advafab UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.12.4 Advafab Main Business Overview
11.12.5 Advafab Latest Developments
11.13 Fraunhofer ISIT
11.13.1 Fraunhofer ISIT Company Information
11.13.2 Fraunhofer ISIT UBM Plating Service Product Offered
11.13.3 Fraunhofer ISIT UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.13.4 Fraunhofer ISIT Main Business Overview
11.13.5 Fraunhofer ISIT Latest Developments
11.14 AEMtec
11.14.1 AEMtec Company Information
11.14.2 AEMtec UBM Plating Service Product Offered
11.14.3 AEMtec UBM Plating Service Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.14.4 AEMtec Main Business Overview
11.14.5 AEMtec Latest Developments
12 Research Findings and Conclusion

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