Global Through-Silicon Vias (TSVs) 麻豆原创 Growth (Status and Outlook) 2024-2030

Publication ID:

LPI03250396

Publication Date:

March 18, 2025

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global Through-Silicon Vias (TSVs) market size is predicted to grow from US$ 3434 million in 2024 to US$ 7960 million in 2030; it is expected to grow at a CAGR of 15.0% from 2024 to 2030.
Silicon through-hole Technology (TSV) is a kind of circuit interconnection technology. It realizes interconnection between chips by making vertical conduction between chips and between wafers and between wafers. Different from the previous IC packaging bonding and dot coating stacking technology, TSV can maximize the chip stacking density in three-dimensional direction, reduce the chip size, increase the transistor density of the chip, improve the electrical interconnection performance between layers, improve the chip operation speed, and reduce the power consumption, design difficulty and cost of the chip.
At the regional level, Through-Silicon Vias (TSVs) products are mainly sold in North America, Europe and China, among which China accounts for about 25% of the global market. Currently, major global suppliers include ASE Technology Holding, Amkor Technology, Taiwan Semiconductor Manufacturing Company Limited, Intel Corporation, GLOBALFOUNDRIES, JCET Group, Samsung, Tianshui Huatian Technology, etc. These major enterprises account for more than 80% of the total share.
The global Through-Silicon Vias (TSVs) market is poised for significant growth due to the rising demand for high-performance, compact, and energy-efficient electronic devices. TSV technology is a critical enabler of 3D integrated circuits (ICs) and advanced packaging solutions, making it essential for applications like artificial intelligence (AI), 5G, automotive electronics, and high-performance computing (HPC).
麻豆原创 Growth Drivers
Demand for 3D Integration:
TSVs enable vertical stacking of chips, reducing the interconnect length and enhancing performance, making them indispensable for 3D ICs and heterogeneous integration.
Applications in logic-memory integration, MEMS, and CMOS image sensors are key contributors.
Proliferation of AI and 5G:
TSVs are critical for high-bandwidth memory (HBM), used in AI accelerators and 5G base stations.
These technologies require higher data transfer rates, lower latency, and reduced power consumption, driving TSV adoption.
Miniaturization and High-Density Packaging:
The trend towards smaller, lighter, and more functional devices necessitates the use of TSVs for high-density interconnects.
Growth in Automotive Electronics:
The demand for advanced driver-assistance systems (ADAS), autonomous driving, and in-vehicle sensors is spurring the adoption of TSV-enabled components.
Expansion in Data Centers and HPC:
High-performance TSV-based packaging solutions are essential for the increasing processing power demands in cloud computing and data centers.
The 鈥淭hrough-Silicon Vias (TSVs) Industry Forecast鈥� looks at past sales and reviews total world Through-Silicon Vias (TSVs) sales in 2023, providing a comprehensive analysis by region and market sector of projected Through-Silicon Vias (TSVs) sales for 2024 through 2030. With Through-Silicon Vias (TSVs) sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Through-Silicon Vias (TSVs) industry.
This Insight Report provides a comprehensive analysis of the global Through-Silicon Vias (TSVs) landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Through-Silicon Vias (TSVs) portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Through-Silicon Vias (TSVs) market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Through-Silicon Vias (TSVs) and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Through-Silicon Vias (TSVs).
This report presents a comprehensive overview, market shares, and growth opportunities of Through-Silicon Vias (TSVs) market by product type, application, key players and key regions and countries.
Segmentation by Type:
2.5D TSV
3D TSV
Segmentation by Application:
Mobile and Consumer Electronics
Communication Equipment
Automotive Electronics
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Technology Holding
Amkor Technology
TSMC
Intel
GlobalFoundries
JCET Group
Samsung
HT-tech

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Through-Silicon Vias (TSVs) 麻豆原创 Size 2019-2030
2.1.2 Through-Silicon Vias (TSVs) 麻豆原创 Size CAGR by Region (2019 VS 2023 VS 2030)
2.1.3 World Current & Future Analysis for Through-Silicon Vias (TSVs) by Country/Region, 2019, 2023 & 2030
2.2 Through-Silicon Vias (TSVs) Segment by Type
2.2.1 2.5D TSV
2.2.2 3D TSV
2.3 Through-Silicon Vias (TSVs) 麻豆原创 Size by Type
2.3.1 Through-Silicon Vias (TSVs) 麻豆原创 Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Through-Silicon Vias (TSVs) 麻豆原创 Size 麻豆原创 Share by Type (2019-2024)
2.4 Through-Silicon Vias (TSVs) Segment by Application
2.4.1 Mobile and Consumer Electronics
2.4.2 Communication Equipment
2.4.3 Automotive Electronics
2.4.4 Other
2.5 Through-Silicon Vias (TSVs) 麻豆原创 Size by Application
2.5.1 Through-Silicon Vias (TSVs) 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Through-Silicon Vias (TSVs) 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 Through-Silicon Vias (TSVs) 麻豆原创 Size by Player
3.1 Through-Silicon Vias (TSVs) 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Through-Silicon Vias (TSVs) Revenue by Player (2019-2024)
3.1.2 Global Through-Silicon Vias (TSVs) Revenue 麻豆原创 Share by Player (2019-2024)
3.2 Global Through-Silicon Vias (TSVs) Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Through-Silicon Vias (TSVs) by Region
4.1 Through-Silicon Vias (TSVs) 麻豆原创 Size by Region (2019-2024)
4.2 Global Through-Silicon Vias (TSVs) Annual Revenue by Country/Region (2019-2024)
4.3 Americas Through-Silicon Vias (TSVs) 麻豆原创 Size Growth (2019-2024)
4.4 APAC Through-Silicon Vias (TSVs) 麻豆原创 Size Growth (2019-2024)
4.5 Europe Through-Silicon Vias (TSVs) 麻豆原创 Size Growth (2019-2024)
4.6 Middle East & Africa Through-Silicon Vias (TSVs) 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas Through-Silicon Vias (TSVs) 麻豆原创 Size by Country (2019-2024)
5.2 Americas Through-Silicon Vias (TSVs) 麻豆原创 Size by Type (2019-2024)
5.3 Americas Through-Silicon Vias (TSVs) 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Through-Silicon Vias (TSVs) 麻豆原创 Size by Region (2019-2024)
6.2 APAC Through-Silicon Vias (TSVs) 麻豆原创 Size by Type (2019-2024)
6.3 APAC Through-Silicon Vias (TSVs) 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Through-Silicon Vias (TSVs) 麻豆原创 Size by Country (2019-2024)
7.2 Europe Through-Silicon Vias (TSVs) 麻豆原创 Size by Type (2019-2024)
7.3 Europe Through-Silicon Vias (TSVs) 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Through-Silicon Vias (TSVs) by Region (2019-2024)
8.2 Middle East & Africa Through-Silicon Vias (TSVs) 麻豆原创 Size by Type (2019-2024)
8.3 Middle East & Africa Through-Silicon Vias (TSVs) 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Through-Silicon Vias (TSVs) 麻豆原创 Forecast
10.1 Global Through-Silicon Vias (TSVs) Forecast by Region (2025-2030)
10.1.1 Global Through-Silicon Vias (TSVs) Forecast by Region (2025-2030)
10.1.2 Americas Through-Silicon Vias (TSVs) Forecast
10.1.3 APAC Through-Silicon Vias (TSVs) Forecast
10.1.4 Europe Through-Silicon Vias (TSVs) Forecast
10.1.5 Middle East & Africa Through-Silicon Vias (TSVs) Forecast
10.2 Americas Through-Silicon Vias (TSVs) Forecast by Country (2025-2030)
10.2.1 United States 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.2.2 Canada 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.2.3 Mexico 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.2.4 Brazil 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.3 APAC Through-Silicon Vias (TSVs) Forecast by Region (2025-2030)
10.3.1 China Through-Silicon Vias (TSVs) 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.3.3 Korea 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.3.4 Southeast Asia 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.3.5 India 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.3.6 Australia 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.4 Europe Through-Silicon Vias (TSVs) Forecast by Country (2025-2030)
10.4.1 Germany 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.4.2 France 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.4.3 UK 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.4.4 Italy 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.4.5 Russia 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.5 Middle East & Africa Through-Silicon Vias (TSVs) Forecast by Region (2025-2030)
10.5.1 Egypt 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.5.2 South Africa 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.5.3 Israel 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.5.4 Turkey 麻豆原创 Through-Silicon Vias (TSVs) Forecast
10.6 Global Through-Silicon Vias (TSVs) Forecast by Type (2025-2030)
10.7 Global Through-Silicon Vias (TSVs) Forecast by Application (2025-2030)
10.7.1 GCC Countries 麻豆原创 Through-Silicon Vias (TSVs) Forecast
11 Key Players Analysis
11.1 ASE Technology Holding
11.1.1 ASE Technology Holding Company Information
11.1.2 ASE Technology Holding Through-Silicon Vias (TSVs) Product Offered
11.1.3 ASE Technology Holding Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 ASE Technology Holding Main Business Overview
11.1.5 ASE Technology Holding Latest Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Information
11.2.2 Amkor Technology Through-Silicon Vias (TSVs) Product Offered
11.2.3 Amkor Technology Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 Amkor Technology Main Business Overview
11.2.5 Amkor Technology Latest Developments
11.3 TSMC
11.3.1 TSMC Company Information
11.3.2 TSMC Through-Silicon Vias (TSVs) Product Offered
11.3.3 TSMC Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 TSMC Main Business Overview
11.3.5 TSMC Latest Developments
11.4 Intel
11.4.1 Intel Company Information
11.4.2 Intel Through-Silicon Vias (TSVs) Product Offered
11.4.3 Intel Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 Intel Main Business Overview
11.4.5 Intel Latest Developments
11.5 GlobalFoundries
11.5.1 GlobalFoundries Company Information
11.5.2 GlobalFoundries Through-Silicon Vias (TSVs) Product Offered
11.5.3 GlobalFoundries Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 GlobalFoundries Main Business Overview
11.5.5 GlobalFoundries Latest Developments
11.6 JCET Group
11.6.1 JCET Group Company Information
11.6.2 JCET Group Through-Silicon Vias (TSVs) Product Offered
11.6.3 JCET Group Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 JCET Group Main Business Overview
11.6.5 JCET Group Latest Developments
11.7 Samsung
11.7.1 Samsung Company Information
11.7.2 Samsung Through-Silicon Vias (TSVs) Product Offered
11.7.3 Samsung Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.7.4 Samsung Main Business Overview
11.7.5 Samsung Latest Developments
11.8 HT-tech
11.8.1 HT-tech Company Information
11.8.2 HT-tech Through-Silicon Vias (TSVs) Product Offered
11.8.3 HT-tech Through-Silicon Vias (TSVs) Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.8.4 HT-tech Main Business Overview
11.8.5 HT-tech Latest Developments
12 Research Findings and Conclusion

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