Silicon carbide (SiC) devices are a type of semiconductor device that offer several advantages over traditional silicon (Si) devices. SiC has emerged as a critical material for various high-performance electronic applications due to its superior properties such as higher thermal conductivity, wider bandgap, and higher electric field strength. These properties make SiC devices particularly well-suited for high-power and high-temperature applications.
The global SiC Device Wafer Front-End Equipment market size is projected to grow from US$ 3668 million in 2024 to US$ 12340 million in 2030; it is expected to grow at a CAGR of 22.4% from 2024 to 2030.
The 鈥淪iC Device Wafer Front-End Equipment Industry Forecast鈥 looks at past sales and reviews total world SiC Device Wafer Front-End Equipment sales in 2023, providing a comprehensive analysis by region and market sector of projected SiC Device Wafer Front-End Equipment sales for 2024 through 2030. With SiC Device Wafer Front-End Equipment sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world SiC Device Wafer Front-End Equipment industry.
This Insight Report provides a comprehensive analysis of the global SiC Device Wafer Front-End Equipment landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on SiC Device Wafer Front-End Equipment portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥 unique position in an accelerating global SiC Device Wafer Front-End Equipment market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for SiC Device Wafer Front-End Equipment and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global SiC Device Wafer Front-End Equipment.
United States market for SiC Device Wafer Front-End Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for SiC Device Wafer Front-End Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for SiC Device Wafer Front-End Equipment is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key SiC Device Wafer Front-End Equipment players cover Applied Materials, Lam Research, Mattson Technology, Inc., SPTS Technologies, Oxford Instruments, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of SiC Device Wafer Front-End Equipment market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
SiC Epitaxy Equipment
SiC Etch and Clean Equipment
SiC Ion Implanter
SiC Anneal and Oxidation Equipment
SiC Wafer Thinning/CMP Tools
SiC Metrology and Inspection Equipment
Segmentation by Application:
SiC MOSFET Module
SiC MOSFET Discrete
SiC SBD
Others (SiC JFETs & FETs)
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Applied Materials
Lam Research
Mattson Technology, Inc.
SPTS Technologies
Oxford Instruments
Trymax Semiconductor
SCREEN Semiconductor
Tokyo Electron Ltd (TEL)
ULVAC
Panasonic
Axcelis
Ion Beam Services (IBS)
Kokusai Electric
Nissin Ion Equipment USA, Inc
Sumitomo Heavy Industries, Ltd.
PR Hoffman, Inc.
Revasum
Logitech
DISCO
TOKYO SEIMITSU (ACCRETECH)
Okamoto Machine Tool Works, Ltd.
KLA Corporation
Onto Innovation
Semilab
Camtek
Unity Semiconductor SAS
PVA TePla
Lasertec
Veeco
Aixtron
Thermco Systems Limited
ASM International NV
NuFlare Technology, Inc.
Naura
GMC Semitech Co.,Ltd
Kingstone Semiconductor
Hwatsing Technology
Angkun Vision (Beijing) Technology
Shanghai Bangxin Semi Technology
Jingsheng Electromechanical
CETC 48
Key Questions Addressed in this Report
What is the 10-year outlook for the global SiC Device Wafer Front-End Equipment market?
What factors are driving SiC Device Wafer Front-End Equipment market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do SiC Device Wafer Front-End Equipment market opportunities vary by end market size?
How does SiC Device Wafer Front-End Equipment break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global SiC Device Wafer Front-End Equipment Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for SiC Device Wafer Front-End Equipment by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for SiC Device Wafer Front-End Equipment by Country/Region, 2019, 2023 & 2030
2.2 SiC Device Wafer Front-End Equipment Segment by Type
2.2.1 SiC Epitaxy Equipment
2.2.2 SiC Etch and Clean Equipment
2.2.3 SiC Ion Implanter
2.2.4 SiC Anneal and Oxidation Equipment
2.2.5 SiC Wafer Thinning/CMP Tools
2.2.6 SiC Metrology and Inspection Equipment
2.3 SiC Device Wafer Front-End Equipment Sales by Type
2.3.1 Global SiC Device Wafer Front-End Equipment Sales 麻豆原创 Share by Type (2019-2024)
2.3.2 Global SiC Device Wafer Front-End Equipment Revenue and 麻豆原创 Share by Type (2019-2024)
2.3.3 Global SiC Device Wafer Front-End Equipment Sale Price by Type (2019-2024)
2.4 SiC Device Wafer Front-End Equipment Segment by Application
2.4.1 SiC MOSFET Module
2.4.2 SiC MOSFET Discrete
2.4.3 SiC SBD
2.4.4 Others (SiC JFETs & FETs)
2.5 SiC Device Wafer Front-End Equipment Sales by Application
2.5.1 Global SiC Device Wafer Front-End Equipment Sale 麻豆原创 Share by Application (2019-2024)
2.5.2 Global SiC Device Wafer Front-End Equipment Revenue and 麻豆原创 Share by Application (2019-2024)
2.5.3 Global SiC Device Wafer Front-End Equipment Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global SiC Device Wafer Front-End Equipment Breakdown Data by Company
3.1.1 Global SiC Device Wafer Front-End Equipment Annual Sales by Company (2019-2024)
3.1.2 Global SiC Device Wafer Front-End Equipment Sales 麻豆原创 Share by Company (2019-2024)
3.2 Global SiC Device Wafer Front-End Equipment Annual Revenue by Company (2019-2024)
3.2.1 Global SiC Device Wafer Front-End Equipment Revenue by Company (2019-2024)
3.2.2 Global SiC Device Wafer Front-End Equipment Revenue 麻豆原创 Share by Company (2019-2024)
3.3 Global SiC Device Wafer Front-End Equipment Sale Price by Company
3.4 Key Manufacturers SiC Device Wafer Front-End Equipment Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers SiC Device Wafer Front-End Equipment Product Location Distribution
3.4.2 Players SiC Device Wafer Front-End Equipment Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for SiC Device Wafer Front-End Equipment by Geographic Region
4.1 World Historic SiC Device Wafer Front-End Equipment 麻豆原创 Size by Geographic Region (2019-2024)
4.1.1 Global SiC Device Wafer Front-End Equipment Annual Sales by Geographic Region (2019-2024)
4.1.2 Global SiC Device Wafer Front-End Equipment Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic SiC Device Wafer Front-End Equipment 麻豆原创 Size by Country/Region (2019-2024)
4.2.1 Global SiC Device Wafer Front-End Equipment Annual Sales by Country/Region (2019-2024)
4.2.2 Global SiC Device Wafer Front-End Equipment Annual Revenue by Country/Region (2019-2024)
4.3 Americas SiC Device Wafer Front-End Equipment Sales Growth
4.4 APAC SiC Device Wafer Front-End Equipment Sales Growth
4.5 Europe SiC Device Wafer Front-End Equipment Sales Growth
4.6 Middle East & Africa SiC Device Wafer Front-End Equipment Sales Growth
5 Americas
5.1 Americas SiC Device Wafer Front-End Equipment Sales by Country
5.1.1 Americas SiC Device Wafer Front-End Equipment Sales by Country (2019-2024)
5.1.2 Americas SiC Device Wafer Front-End Equipment Revenue by Country (2019-2024)
5.2 Americas SiC Device Wafer Front-End Equipment Sales by Type (2019-2024)
5.3 Americas SiC Device Wafer Front-End Equipment Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC SiC Device Wafer Front-End Equipment Sales by Region
6.1.1 APAC SiC Device Wafer Front-End Equipment Sales by Region (2019-2024)
6.1.2 APAC SiC Device Wafer Front-End Equipment Revenue by Region (2019-2024)
6.2 APAC SiC Device Wafer Front-End Equipment Sales by Type (2019-2024)
6.3 APAC SiC Device Wafer Front-End Equipment Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe SiC Device Wafer Front-End Equipment by Country
7.1.1 Europe SiC Device Wafer Front-End Equipment Sales by Country (2019-2024)
7.1.2 Europe SiC Device Wafer Front-End Equipment Revenue by Country (2019-2024)
7.2 Europe SiC Device Wafer Front-End Equipment Sales by Type (2019-2024)
7.3 Europe SiC Device Wafer Front-End Equipment Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa SiC Device Wafer Front-End Equipment by Country
8.1.1 Middle East & Africa SiC Device Wafer Front-End Equipment Sales by Country (2019-2024)
8.1.2 Middle East & Africa SiC Device Wafer Front-End Equipment Revenue by Country (2019-2024)
8.2 Middle East & Africa SiC Device Wafer Front-End Equipment Sales by Type (2019-2024)
8.3 Middle East & Africa SiC Device Wafer Front-End Equipment Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of SiC Device Wafer Front-End Equipment
10.3 Manufacturing Process Analysis of SiC Device Wafer Front-End Equipment
10.4 Industry Chain Structure of SiC Device Wafer Front-End Equipment
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 SiC Device Wafer Front-End Equipment Distributors
11.3 SiC Device Wafer Front-End Equipment Customer
12 World Forecast Review for SiC Device Wafer Front-End Equipment by Geographic Region
12.1 Global SiC Device Wafer Front-End Equipment 麻豆原创 Size Forecast by Region
12.1.1 Global SiC Device Wafer Front-End Equipment Forecast by Region (2025-2030)
12.1.2 Global SiC Device Wafer Front-End Equipment Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global SiC Device Wafer Front-End Equipment Forecast by Type (2025-2030)
12.7 Global SiC Device Wafer Front-End Equipment Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Applied Materials
13.1.1 Applied Materials Company Information
13.1.2 Applied Materials SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.1.3 Applied Materials SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Applied Materials Main Business Overview
13.1.5 Applied Materials Latest Developments
13.2 Lam Research
13.2.1 Lam Research Company Information
13.2.2 Lam Research SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.2.3 Lam Research SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Lam Research Main Business Overview
13.2.5 Lam Research Latest Developments
13.3 Mattson Technology, Inc.
13.3.1 Mattson Technology, Inc. Company Information
13.3.2 Mattson Technology, Inc. SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.3.3 Mattson Technology, Inc. SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Mattson Technology, Inc. Main Business Overview
13.3.5 Mattson Technology, Inc. Latest Developments
13.4 SPTS Technologies
13.4.1 SPTS Technologies Company Information
13.4.2 SPTS Technologies SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.4.3 SPTS Technologies SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 SPTS Technologies Main Business Overview
13.4.5 SPTS Technologies Latest Developments
13.5 Oxford Instruments
13.5.1 Oxford Instruments Company Information
13.5.2 Oxford Instruments SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.5.3 Oxford Instruments SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Oxford Instruments Main Business Overview
13.5.5 Oxford Instruments Latest Developments
13.6 Trymax Semiconductor
13.6.1 Trymax Semiconductor Company Information
13.6.2 Trymax Semiconductor SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.6.3 Trymax Semiconductor SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Trymax Semiconductor Main Business Overview
13.6.5 Trymax Semiconductor Latest Developments
13.7 SCREEN Semiconductor
13.7.1 SCREEN Semiconductor Company Information
13.7.2 SCREEN Semiconductor SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.7.3 SCREEN Semiconductor SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 SCREEN Semiconductor Main Business Overview
13.7.5 SCREEN Semiconductor Latest Developments
13.8 Tokyo Electron Ltd (TEL)
13.8.1 Tokyo Electron Ltd (TEL) Company Information
13.8.2 Tokyo Electron Ltd (TEL) SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.8.3 Tokyo Electron Ltd (TEL) SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Tokyo Electron Ltd (TEL) Main Business Overview
13.8.5 Tokyo Electron Ltd (TEL) Latest Developments
13.9 ULVAC
13.9.1 ULVAC Company Information
13.9.2 ULVAC SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.9.3 ULVAC SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 ULVAC Main Business Overview
13.9.5 ULVAC Latest Developments
13.10 Panasonic
13.10.1 Panasonic Company Information
13.10.2 Panasonic SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.10.3 Panasonic SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Panasonic Main Business Overview
13.10.5 Panasonic Latest Developments
13.11 Axcelis
13.11.1 Axcelis Company Information
13.11.2 Axcelis SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.11.3 Axcelis SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 Axcelis Main Business Overview
13.11.5 Axcelis Latest Developments
13.12 Ion Beam Services (IBS)
13.12.1 Ion Beam Services (IBS) Company Information
13.12.2 Ion Beam Services (IBS) SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.12.3 Ion Beam Services (IBS) SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 Ion Beam Services (IBS) Main Business Overview
13.12.5 Ion Beam Services (IBS) Latest Developments
13.13 Kokusai Electric
13.13.1 Kokusai Electric Company Information
13.13.2 Kokusai Electric SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.13.3 Kokusai Electric SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.13.4 Kokusai Electric Main Business Overview
13.13.5 Kokusai Electric Latest Developments
13.14 Nissin Ion Equipment USA, Inc
13.14.1 Nissin Ion Equipment USA, Inc Company Information
13.14.2 Nissin Ion Equipment USA, Inc SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.14.3 Nissin Ion Equipment USA, Inc SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.14.4 Nissin Ion Equipment USA, Inc Main Business Overview
13.14.5 Nissin Ion Equipment USA, Inc Latest Developments
13.15 Sumitomo Heavy Industries, Ltd.
13.15.1 Sumitomo Heavy Industries, Ltd. Company Information
13.15.2 Sumitomo Heavy Industries, Ltd. SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.15.3 Sumitomo Heavy Industries, Ltd. SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.15.4 Sumitomo Heavy Industries, Ltd. Main Business Overview
13.15.5 Sumitomo Heavy Industries, Ltd. Latest Developments
13.16 PR Hoffman, Inc.
13.16.1 PR Hoffman, Inc. Company Information
13.16.2 PR Hoffman, Inc. SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.16.3 PR Hoffman, Inc. SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.16.4 PR Hoffman, Inc. Main Business Overview
13.16.5 PR Hoffman, Inc. Latest Developments
13.17 Revasum
13.17.1 Revasum Company Information
13.17.2 Revasum SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.17.3 Revasum SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.17.4 Revasum Main Business Overview
13.17.5 Revasum Latest Developments
13.18 Logitech
13.18.1 Logitech Company Information
13.18.2 Logitech SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.18.3 Logitech SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.18.4 Logitech Main Business Overview
13.18.5 Logitech Latest Developments
13.19 DISCO
13.19.1 DISCO Company Information
13.19.2 DISCO SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.19.3 DISCO SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.19.4 DISCO Main Business Overview
13.19.5 DISCO Latest Developments
13.20 TOKYO SEIMITSU (ACCRETECH)
13.20.1 TOKYO SEIMITSU (ACCRETECH) Company Information
13.20.2 TOKYO SEIMITSU (ACCRETECH) SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.20.3 TOKYO SEIMITSU (ACCRETECH) SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.20.4 TOKYO SEIMITSU (ACCRETECH) Main Business Overview
13.20.5 TOKYO SEIMITSU (ACCRETECH) Latest Developments
13.21 Okamoto Machine Tool Works, Ltd.
13.21.1 Okamoto Machine Tool Works, Ltd. Company Information
13.21.2 Okamoto Machine Tool Works, Ltd. SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.21.3 Okamoto Machine Tool Works, Ltd. SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.21.4 Okamoto Machine Tool Works, Ltd. Main Business Overview
13.21.5 Okamoto Machine Tool Works, Ltd. Latest Developments
13.22 KLA Corporation
13.22.1 KLA Corporation Company Information
13.22.2 KLA Corporation SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.22.3 KLA Corporation SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.22.4 KLA Corporation Main Business Overview
13.22.5 KLA Corporation Latest Developments
13.23 Onto Innovation
13.23.1 Onto Innovation Company Information
13.23.2 Onto Innovation SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.23.3 Onto Innovation SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.23.4 Onto Innovation Main Business Overview
13.23.5 Onto Innovation Latest Developments
13.24 Semilab
13.24.1 Semilab Company Information
13.24.2 Semilab SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.24.3 Semilab SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.24.4 Semilab Main Business Overview
13.24.5 Semilab Latest Developments
13.25 Camtek
13.25.1 Camtek Company Information
13.25.2 Camtek SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.25.3 Camtek SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.25.4 Camtek Main Business Overview
13.25.5 Camtek Latest Developments
13.26 Unity Semiconductor SAS
13.26.1 Unity Semiconductor SAS Company Information
13.26.2 Unity Semiconductor SAS SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.26.3 Unity Semiconductor SAS SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.26.4 Unity Semiconductor SAS Main Business Overview
13.26.5 Unity Semiconductor SAS Latest Developments
13.27 PVA TePla
13.27.1 PVA TePla Company Information
13.27.2 PVA TePla SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.27.3 PVA TePla SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.27.4 PVA TePla Main Business Overview
13.27.5 PVA TePla Latest Developments
13.28 Lasertec
13.28.1 Lasertec Company Information
13.28.2 Lasertec SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.28.3 Lasertec SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.28.4 Lasertec Main Business Overview
13.28.5 Lasertec Latest Developments
13.29 Veeco
13.29.1 Veeco Company Information
13.29.2 Veeco SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.29.3 Veeco SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.29.4 Veeco Main Business Overview
13.29.5 Veeco Latest Developments
13.30 Aixtron
13.30.1 Aixtron Company Information
13.30.2 Aixtron SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.30.3 Aixtron SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.30.4 Aixtron Main Business Overview
13.30.5 Aixtron Latest Developments
13.31 Thermco Systems Limited
13.31.1 Thermco Systems Limited Company Information
13.31.2 Thermco Systems Limited SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.31.3 Thermco Systems Limited SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.31.4 Thermco Systems Limited Main Business Overview
13.31.5 Thermco Systems Limited Latest Developments
13.32 ASM International NV
13.32.1 ASM International NV Company Information
13.32.2 ASM International NV SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.32.3 ASM International NV SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.32.4 ASM International NV Main Business Overview
13.32.5 ASM International NV Latest Developments
13.33 NuFlare Technology, Inc.
13.33.1 NuFlare Technology, Inc. Company Information
13.33.2 NuFlare Technology, Inc. SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.33.3 NuFlare Technology, Inc. SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.33.4 NuFlare Technology, Inc. Main Business Overview
13.33.5 NuFlare Technology, Inc. Latest Developments
13.34 Naura
13.34.1 Naura Company Information
13.34.2 Naura SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.34.3 Naura SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.34.4 Naura Main Business Overview
13.34.5 Naura Latest Developments
13.35 GMC Semitech Co.,Ltd
13.35.1 GMC Semitech Co.,Ltd Company Information
13.35.2 GMC Semitech Co.,Ltd SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.35.3 GMC Semitech Co.,Ltd SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.35.4 GMC Semitech Co.,Ltd Main Business Overview
13.35.5 GMC Semitech Co.,Ltd Latest Developments
13.36 Kingstone Semiconductor
13.36.1 Kingstone Semiconductor Company Information
13.36.2 Kingstone Semiconductor SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.36.3 Kingstone Semiconductor SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.36.4 Kingstone Semiconductor Main Business Overview
13.36.5 Kingstone Semiconductor Latest Developments
13.37 Hwatsing Technology
13.37.1 Hwatsing Technology Company Information
13.37.2 Hwatsing Technology SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.37.3 Hwatsing Technology SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.37.4 Hwatsing Technology Main Business Overview
13.37.5 Hwatsing Technology Latest Developments
13.38 Angkun Vision (Beijing) Technology
13.38.1 Angkun Vision (Beijing) Technology Company Information
13.38.2 Angkun Vision (Beijing) Technology SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.38.3 Angkun Vision (Beijing) Technology SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.38.4 Angkun Vision (Beijing) Technology Main Business Overview
13.38.5 Angkun Vision (Beijing) Technology Latest Developments
13.39 Shanghai Bangxin Semi Technology
13.39.1 Shanghai Bangxin Semi Technology Company Information
13.39.2 Shanghai Bangxin Semi Technology SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.39.3 Shanghai Bangxin Semi Technology SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.39.4 Shanghai Bangxin Semi Technology Main Business Overview
13.39.5 Shanghai Bangxin Semi Technology Latest Developments
13.40 Jingsheng Electromechanical
13.40.1 Jingsheng Electromechanical Company Information
13.40.2 Jingsheng Electromechanical SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.40.3 Jingsheng Electromechanical SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.40.4 Jingsheng Electromechanical Main Business Overview
13.40.5 Jingsheng Electromechanical Latest Developments
13.41 CETC 48
13.41.1 CETC 48 Company Information
13.41.2 CETC 48 SiC Device Wafer Front-End Equipment Product Portfolios and Specifications
13.41.3 CETC 48 SiC Device Wafer Front-End Equipment Sales, Revenue, Price and Gross Margin (2019-2024)
13.41.4 CETC 48 Main Business Overview
13.41.5 CETC 48 Latest Developments
14 Research Findings and Conclusion
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*If Applicable.