The global Semiconductor Packaging Materials market size was valued at US$ 26280 million in 2023. With growing demand in downstream market, the Semiconductor Packaging Materials is forecast to a readjusted size of US$ 63700 million by 2030 with a CAGR of 13.5% during review period.
The research report highlights the growth potential of the global Semiconductor Packaging Materials market. Semiconductor Packaging Materials are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of Semiconductor Packaging Materials. 麻豆原创 players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the Semiconductor Packaging Materials market.
Global Semiconductor Packaging Materials includes Kyocera, Shinko, and Ibiden, etc. Global top three companies hold a share over 22%.
Key Features:
The report on Semiconductor Packaging Materials market reflects various aspects and provide valuable insights into the industry.
麻豆原创 Size and Growth: The research report provide an overview of the current size and growth of the Semiconductor Packaging Materials market. It may include historical data, market segmentation by Type (e.g., Packaging Substrate, Lead Frame), and regional breakdowns.
麻豆原创 Drivers and Challenges: The report can identify and analyse the factors driving the growth of the Semiconductor Packaging Materials market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the Semiconductor Packaging Materials market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the Semiconductor Packaging Materials industry. This include advancements in Semiconductor Packaging Materials technology, Semiconductor Packaging Materials new entrants, Semiconductor Packaging Materials new investment, and other innovations that are shaping the future of Semiconductor Packaging Materials.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the Semiconductor Packaging Materials market. It includes factors influencing customer ' purchasing decisions, preferences for Semiconductor Packaging Materials product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the Semiconductor Packaging Materials market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting Semiconductor Packaging Materials market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the Semiconductor Packaging Materials market.
麻豆原创 Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the Semiconductor Packaging Materials industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the Semiconductor Packaging Materials market.
麻豆原创 Segmentation:
Semiconductor Packaging Materials market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
Packaging Substrate
Lead Frame
Bonding Wire
Encapsulating Resin
Ceramic Packaging Material
Chip Bonding Material
Segmentation by application
Consume Electrons
Automobiles
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Kyocera
Shinko
Ibiden
LG Innotek
Unimicron Technology
ZhenDing Tech
Semco
KINSUS INTERCONNECT TECHNOLOGY
Nan Ya PCB
Nippon Micrometal Corporation
Simmtech
Mitsui High-tec, Inc.
HAESUNG
Shin-Etsu
Heraeus
AAMI
Henkel
Shennan Circuits
Kangqiang Electronics
LG Chem
NGK/NTK
MK Electron
Toppan Printing Co., Ltd.
Tanaka
MARUWA
Momentive
SCHOTT
Element Solutions
Hitachi Chemical
Fastprint
Hongchang Electronic
Sumitomo
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Semiconductor Packaging Materials 麻豆原创 Size 2019-2030
2.1.2 Semiconductor Packaging Materials 麻豆原创 Size CAGR by Region 2019 VS 2023 VS 2030
2.2 Semiconductor Packaging Materials Segment by Type
2.2.1 Packaging Substrate
2.2.2 Lead Frame
2.2.3 Bonding Wire
2.2.4 Encapsulating Resin
2.2.5 Ceramic Packaging Material
2.2.6 Chip Bonding Material
2.3 Semiconductor Packaging Materials 麻豆原创 Size by Type
2.3.1 Semiconductor Packaging Materials 麻豆原创 Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Semiconductor Packaging Materials 麻豆原创 Size 麻豆原创 Share by Type (2019-2024)
2.4 Semiconductor Packaging Materials Segment by Application
2.4.1 Consume Electrons
2.4.2 Automobiles
2.4.3 Others
2.5 Semiconductor Packaging Materials 麻豆原创 Size by Application
2.5.1 Semiconductor Packaging Materials 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Semiconductor Packaging Materials 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 Semiconductor Packaging Materials 麻豆原创 Size by Player
3.1 Semiconductor Packaging Materials 麻豆原创 Size 麻豆原创 Share by Players
3.1.1 Global Semiconductor Packaging Materials Revenue by Players (2019-2024)
3.1.2 Global Semiconductor Packaging Materials Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global Semiconductor Packaging Materials Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Semiconductor Packaging Materials by Regions
4.1 Semiconductor Packaging Materials 麻豆原创 Size by Regions (2019-2024)
4.2 Americas Semiconductor Packaging Materials 麻豆原创 Size Growth (2019-2024)
4.3 APAC Semiconductor Packaging Materials 麻豆原创 Size Growth (2019-2024)
4.4 Europe Semiconductor Packaging Materials 麻豆原创 Size Growth (2019-2024)
4.5 Middle East & Africa Semiconductor Packaging Materials 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas Semiconductor Packaging Materials 麻豆原创 Size by Country (2019-2024)
5.2 Americas Semiconductor Packaging Materials 麻豆原创 Size by Type (2019-2024)
5.3 Americas Semiconductor Packaging Materials 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Semiconductor Packaging Materials 麻豆原创 Size by Region (2019-2024)
6.2 APAC Semiconductor Packaging Materials 麻豆原创 Size by Type (2019-2024)
6.3 APAC Semiconductor Packaging Materials 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Semiconductor Packaging Materials by Country (2019-2024)
7.2 Europe Semiconductor Packaging Materials 麻豆原创 Size by Type (2019-2024)
7.3 Europe Semiconductor Packaging Materials 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Semiconductor Packaging Materials by Region (2019-2024)
8.2 Middle East & Africa Semiconductor Packaging Materials 麻豆原创 Size by Type (2019-2024)
8.3 Middle East & Africa Semiconductor Packaging Materials 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Semiconductor Packaging Materials 麻豆原创 Forecast
10.1 Global Semiconductor Packaging Materials Forecast by Regions (2025-2030)
10.1.1 Global Semiconductor Packaging Materials Forecast by Regions (2025-2030)
10.1.2 Americas Semiconductor Packaging Materials Forecast
10.1.3 APAC Semiconductor Packaging Materials Forecast
10.1.4 Europe Semiconductor Packaging Materials Forecast
10.1.5 Middle East & Africa Semiconductor Packaging Materials Forecast
10.2 Americas Semiconductor Packaging Materials Forecast by Country (2025-2030)
10.2.1 United States Semiconductor Packaging Materials 麻豆原创 Forecast
10.2.2 Canada Semiconductor Packaging Materials 麻豆原创 Forecast
10.2.3 Mexico Semiconductor Packaging Materials 麻豆原创 Forecast
10.2.4 Brazil Semiconductor Packaging Materials 麻豆原创 Forecast
10.3 APAC Semiconductor Packaging Materials Forecast by Region (2025-2030)
10.3.1 China Semiconductor Packaging Materials 麻豆原创 Forecast
10.3.2 Japan Semiconductor Packaging Materials 麻豆原创 Forecast
10.3.3 Korea Semiconductor Packaging Materials 麻豆原创 Forecast
10.3.4 Southeast Asia Semiconductor Packaging Materials 麻豆原创 Forecast
10.3.5 India Semiconductor Packaging Materials 麻豆原创 Forecast
10.3.6 Australia Semiconductor Packaging Materials 麻豆原创 Forecast
10.4 Europe Semiconductor Packaging Materials Forecast by Country (2025-2030)
10.4.1 Germany Semiconductor Packaging Materials 麻豆原创 Forecast
10.4.2 France Semiconductor Packaging Materials 麻豆原创 Forecast
10.4.3 UK Semiconductor Packaging Materials 麻豆原创 Forecast
10.4.4 Italy Semiconductor Packaging Materials 麻豆原创 Forecast
10.4.5 Russia Semiconductor Packaging Materials 麻豆原创 Forecast
10.5 Middle East & Africa Semiconductor Packaging Materials Forecast by Region (2025-2030)
10.5.1 Egypt Semiconductor Packaging Materials 麻豆原创 Forecast
10.5.2 South Africa Semiconductor Packaging Materials 麻豆原创 Forecast
10.5.3 Israel Semiconductor Packaging Materials 麻豆原创 Forecast
10.5.4 Turkey Semiconductor Packaging Materials 麻豆原创 Forecast
10.5.5 GCC Countries Semiconductor Packaging Materials 麻豆原创 Forecast
10.6 Global Semiconductor Packaging Materials Forecast by Type (2025-2030)
10.7 Global Semiconductor Packaging Materials Forecast by Application (2025-2030)
11 Key Players Analysis
11.1 Kyocera
11.1.1 Kyocera Company Information
11.1.2 Kyocera Semiconductor Packaging Materials Product Offered
11.1.3 Kyocera Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 Kyocera Main Business Overview
11.1.5 Kyocera Latest Developments
11.2 Shinko
11.2.1 Shinko Company Information
11.2.2 Shinko Semiconductor Packaging Materials Product Offered
11.2.3 Shinko Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 Shinko Main Business Overview
11.2.5 Shinko Latest Developments
11.3 Ibiden
11.3.1 Ibiden Company Information
11.3.2 Ibiden Semiconductor Packaging Materials Product Offered
11.3.3 Ibiden Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 Ibiden Main Business Overview
11.3.5 Ibiden Latest Developments
11.4 LG Innotek
11.4.1 LG Innotek Company Information
11.4.2 LG Innotek Semiconductor Packaging Materials Product Offered
11.4.3 LG Innotek Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 LG Innotek Main Business Overview
11.4.5 LG Innotek Latest Developments
11.5 Unimicron Technology
11.5.1 Unimicron Technology Company Information
11.5.2 Unimicron Technology Semiconductor Packaging Materials Product Offered
11.5.3 Unimicron Technology Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 Unimicron Technology Main Business Overview
11.5.5 Unimicron Technology Latest Developments
11.6 ZhenDing Tech
11.6.1 ZhenDing Tech Company Information
11.6.2 ZhenDing Tech Semiconductor Packaging Materials Product Offered
11.6.3 ZhenDing Tech Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 ZhenDing Tech Main Business Overview
11.6.5 ZhenDing Tech Latest Developments
11.7 Semco
11.7.1 Semco Company Information
11.7.2 Semco Semiconductor Packaging Materials Product Offered
11.7.3 Semco Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.7.4 Semco Main Business Overview
11.7.5 Semco Latest Developments
11.8 KINSUS INTERCONNECT TECHNOLOGY
11.8.1 KINSUS INTERCONNECT TECHNOLOGY Company Information
11.8.2 KINSUS INTERCONNECT TECHNOLOGY Semiconductor Packaging Materials Product Offered
11.8.3 KINSUS INTERCONNECT TECHNOLOGY Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.8.4 KINSUS INTERCONNECT TECHNOLOGY Main Business Overview
11.8.5 KINSUS INTERCONNECT TECHNOLOGY Latest Developments
11.9 Nan Ya PCB
11.9.1 Nan Ya PCB Company Information
11.9.2 Nan Ya PCB Semiconductor Packaging Materials Product Offered
11.9.3 Nan Ya PCB Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.9.4 Nan Ya PCB Main Business Overview
11.9.5 Nan Ya PCB Latest Developments
11.10 Nippon Micrometal Corporation
11.10.1 Nippon Micrometal Corporation Company Information
11.10.2 Nippon Micrometal Corporation Semiconductor Packaging Materials Product Offered
11.10.3 Nippon Micrometal Corporation Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.10.4 Nippon Micrometal Corporation Main Business Overview
11.10.5 Nippon Micrometal Corporation Latest Developments
11.11 Simmtech
11.11.1 Simmtech Company Information
11.11.2 Simmtech Semiconductor Packaging Materials Product Offered
11.11.3 Simmtech Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.11.4 Simmtech Main Business Overview
11.11.5 Simmtech Latest Developments
11.12 Mitsui High-tec, Inc.
11.12.1 Mitsui High-tec, Inc. Company Information
11.12.2 Mitsui High-tec, Inc. Semiconductor Packaging Materials Product Offered
11.12.3 Mitsui High-tec, Inc. Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.12.4 Mitsui High-tec, Inc. Main Business Overview
11.12.5 Mitsui High-tec, Inc. Latest Developments
11.13 HAESUNG
11.13.1 HAESUNG Company Information
11.13.2 HAESUNG Semiconductor Packaging Materials Product Offered
11.13.3 HAESUNG Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.13.4 HAESUNG Main Business Overview
11.13.5 HAESUNG Latest Developments
11.14 Shin-Etsu
11.14.1 Shin-Etsu Company Information
11.14.2 Shin-Etsu Semiconductor Packaging Materials Product Offered
11.14.3 Shin-Etsu Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.14.4 Shin-Etsu Main Business Overview
11.14.5 Shin-Etsu Latest Developments
11.15 Heraeus
11.15.1 Heraeus Company Information
11.15.2 Heraeus Semiconductor Packaging Materials Product Offered
11.15.3 Heraeus Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.15.4 Heraeus Main Business Overview
11.15.5 Heraeus Latest Developments
11.16 AAMI
11.16.1 AAMI Company Information
11.16.2 AAMI Semiconductor Packaging Materials Product Offered
11.16.3 AAMI Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.16.4 AAMI Main Business Overview
11.16.5 AAMI Latest Developments
11.17 Henkel
11.17.1 Henkel Company Information
11.17.2 Henkel Semiconductor Packaging Materials Product Offered
11.17.3 Henkel Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.17.4 Henkel Main Business Overview
11.17.5 Henkel Latest Developments
11.18 Shennan Circuits
11.18.1 Shennan Circuits Company Information
11.18.2 Shennan Circuits Semiconductor Packaging Materials Product Offered
11.18.3 Shennan Circuits Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.18.4 Shennan Circuits Main Business Overview
11.18.5 Shennan Circuits Latest Developments
11.19 Kangqiang Electronics
11.19.1 Kangqiang Electronics Company Information
11.19.2 Kangqiang Electronics Semiconductor Packaging Materials Product Offered
11.19.3 Kangqiang Electronics Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.19.4 Kangqiang Electronics Main Business Overview
11.19.5 Kangqiang Electronics Latest Developments
11.20 LG Chem
11.20.1 LG Chem Company Information
11.20.2 LG Chem Semiconductor Packaging Materials Product Offered
11.20.3 LG Chem Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.20.4 LG Chem Main Business Overview
11.20.5 LG Chem Latest Developments
11.21 NGK/NTK
11.21.1 NGK/NTK Company Information
11.21.2 NGK/NTK Semiconductor Packaging Materials Product Offered
11.21.3 NGK/NTK Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.21.4 NGK/NTK Main Business Overview
11.21.5 NGK/NTK Latest Developments
11.22 MK Electron
11.22.1 MK Electron Company Information
11.22.2 MK Electron Semiconductor Packaging Materials Product Offered
11.22.3 MK Electron Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.22.4 MK Electron Main Business Overview
11.22.5 MK Electron Latest Developments
11.23 Toppan Printing Co., Ltd.
11.23.1 Toppan Printing Co., Ltd. Company Information
11.23.2 Toppan Printing Co., Ltd. Semiconductor Packaging Materials Product Offered
11.23.3 Toppan Printing Co., Ltd. Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.23.4 Toppan Printing Co., Ltd. Main Business Overview
11.23.5 Toppan Printing Co., Ltd. Latest Developments
11.24 Tanaka
11.24.1 Tanaka Company Information
11.24.2 Tanaka Semiconductor Packaging Materials Product Offered
11.24.3 Tanaka Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.24.4 Tanaka Main Business Overview
11.24.5 Tanaka Latest Developments
11.25 MARUWA
11.25.1 MARUWA Company Information
11.25.2 MARUWA Semiconductor Packaging Materials Product Offered
11.25.3 MARUWA Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.25.4 MARUWA Main Business Overview
11.25.5 MARUWA Latest Developments
11.26 Momentive
11.26.1 Momentive Company Information
11.26.2 Momentive Semiconductor Packaging Materials Product Offered
11.26.3 Momentive Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.26.4 Momentive Main Business Overview
11.26.5 Momentive Latest Developments
11.27 SCHOTT
11.27.1 SCHOTT Company Information
11.27.2 SCHOTT Semiconductor Packaging Materials Product Offered
11.27.3 SCHOTT Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.27.4 SCHOTT Main Business Overview
11.27.5 SCHOTT Latest Developments
11.28 Element Solutions
11.28.1 Element Solutions Company Information
11.28.2 Element Solutions Semiconductor Packaging Materials Product Offered
11.28.3 Element Solutions Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.28.4 Element Solutions Main Business Overview
11.28.5 Element Solutions Latest Developments
11.29 Hitachi Chemical
11.29.1 Hitachi Chemical Company Information
11.29.2 Hitachi Chemical Semiconductor Packaging Materials Product Offered
11.29.3 Hitachi Chemical Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.29.4 Hitachi Chemical Main Business Overview
11.29.5 Hitachi Chemical Latest Developments
11.30 Fastprint
11.30.1 Fastprint Company Information
11.30.2 Fastprint Semiconductor Packaging Materials Product Offered
11.30.3 Fastprint Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.30.4 Fastprint Main Business Overview
11.30.5 Fastprint Latest Developments
11.31 Hongchang Electronic
11.31.1 Hongchang Electronic Company Information
11.31.2 Hongchang Electronic Semiconductor Packaging Materials Product Offered
11.31.3 Hongchang Electronic Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.31.4 Hongchang Electronic Main Business Overview
11.31.5 Hongchang Electronic Latest Developments
11.32 Sumitomo
11.32.1 Sumitomo Company Information
11.32.2 Sumitomo Semiconductor Packaging Materials Product Offered
11.32.3 Sumitomo Semiconductor Packaging Materials Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.32.4 Sumitomo Main Business Overview
11.32.5 Sumitomo Latest Developments
12 Research Findings and Conclusion
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*If Applicable.
