
A pin grid array (PGA) is a type of integrated circuit packaging. In a PGA, the package is square or rectangular, and the pins are arranged in a regular array on the underside of the package. The pins are commonly spaced 2.54 mm (0.1") apart, and may or may not cover the entire underside of the package.
The global PGA Packaging market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The 鈥淧GA Packaging Industry Forecast鈥 looks at past sales and reviews total world PGA Packaging sales in 2023, providing a comprehensive analysis by region and market sector of projected PGA Packaging sales for 2024 through 2030. With PGA Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world PGA Packaging industry.
This Insight Report provides a comprehensive analysis of the global PGA Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on PGA Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥 unique position in an accelerating global PGA Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for PGA Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global PGA Packaging.
United States market for PGA Packaging is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for PGA Packaging is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for PGA Packaging is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key PGA Packaging players cover Texas Instruments, Evergreen SemiConductor Materials, Aries Electronics, Advanced Micro Devices, NXP, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of PGA Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Ceramic PGA
Plastic PGA
Segmentation by Application:
Consumer Electronics Products
Automotive
Optoelectronic Components
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Texas Instruments
Evergreen SemiConductor Materials
Aries Electronics
Advanced Micro Devices
NXP
Kyocera
Cadence
Dong Rong Electronics Co Ltd
Shenzhen city and Hing Electronics Co., Ltd.
Shenzhen Antenk Electronics Co,Ltd
VIA
Key Questions Addressed in this Report
What is the 10-year outlook for the global PGA Packaging market?
What factors are driving PGA Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do PGA Packaging market opportunities vary by end market size?
How does PGA Packaging break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global PGA Packaging Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for PGA Packaging by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for PGA Packaging by Country/Region, 2019, 2023 & 2030
2.2 PGA Packaging Segment by Type
2.2.1 Ceramic PGA
2.2.2 Plastic PGA
2.3 PGA Packaging Sales by Type
2.3.1 Global PGA Packaging Sales 麻豆原创 Share by Type (2019-2024)
2.3.2 Global PGA Packaging Revenue and 麻豆原创 Share by Type (2019-2024)
2.3.3 Global PGA Packaging Sale Price by Type (2019-2024)
2.4 PGA Packaging Segment by Application
2.4.1 Consumer Electronics Products
2.4.2 Automotive
2.4.3 Optoelectronic Components
2.4.4 Others
2.5 PGA Packaging Sales by Application
2.5.1 Global PGA Packaging Sale 麻豆原创 Share by Application (2019-2024)
2.5.2 Global PGA Packaging Revenue and 麻豆原创 Share by Application (2019-2024)
2.5.3 Global PGA Packaging Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global PGA Packaging Breakdown Data by Company
3.1.1 Global PGA Packaging Annual Sales by Company (2019-2024)
3.1.2 Global PGA Packaging Sales 麻豆原创 Share by Company (2019-2024)
3.2 Global PGA Packaging Annual Revenue by Company (2019-2024)
3.2.1 Global PGA Packaging Revenue by Company (2019-2024)
3.2.2 Global PGA Packaging Revenue 麻豆原创 Share by Company (2019-2024)
3.3 Global PGA Packaging Sale Price by Company
3.4 Key Manufacturers PGA Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers PGA Packaging Product Location Distribution
3.4.2 Players PGA Packaging Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for PGA Packaging by Geographic Region
4.1 World Historic PGA Packaging 麻豆原创 Size by Geographic Region (2019-2024)
4.1.1 Global PGA Packaging Annual Sales by Geographic Region (2019-2024)
4.1.2 Global PGA Packaging Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic PGA Packaging 麻豆原创 Size by Country/Region (2019-2024)
4.2.1 Global PGA Packaging Annual Sales by Country/Region (2019-2024)
4.2.2 Global PGA Packaging Annual Revenue by Country/Region (2019-2024)
4.3 Americas PGA Packaging Sales Growth
4.4 APAC PGA Packaging Sales Growth
4.5 Europe PGA Packaging Sales Growth
4.6 Middle East & Africa PGA Packaging Sales Growth
5 Americas
5.1 Americas PGA Packaging Sales by Country
5.1.1 Americas PGA Packaging Sales by Country (2019-2024)
5.1.2 Americas PGA Packaging Revenue by Country (2019-2024)
5.2 Americas PGA Packaging Sales by Type (2019-2024)
5.3 Americas PGA Packaging Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC PGA Packaging Sales by Region
6.1.1 APAC PGA Packaging Sales by Region (2019-2024)
6.1.2 APAC PGA Packaging Revenue by Region (2019-2024)
6.2 APAC PGA Packaging Sales by Type (2019-2024)
6.3 APAC PGA Packaging Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe PGA Packaging by Country
7.1.1 Europe PGA Packaging Sales by Country (2019-2024)
7.1.2 Europe PGA Packaging Revenue by Country (2019-2024)
7.2 Europe PGA Packaging Sales by Type (2019-2024)
7.3 Europe PGA Packaging Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa PGA Packaging by Country
8.1.1 Middle East & Africa PGA Packaging Sales by Country (2019-2024)
8.1.2 Middle East & Africa PGA Packaging Revenue by Country (2019-2024)
8.2 Middle East & Africa PGA Packaging Sales by Type (2019-2024)
8.3 Middle East & Africa PGA Packaging Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of PGA Packaging
10.3 Manufacturing Process Analysis of PGA Packaging
10.4 Industry Chain Structure of PGA Packaging
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 PGA Packaging Distributors
11.3 PGA Packaging Customer
12 World Forecast Review for PGA Packaging by Geographic Region
12.1 Global PGA Packaging 麻豆原创 Size Forecast by Region
12.1.1 Global PGA Packaging Forecast by Region (2025-2030)
12.1.2 Global PGA Packaging Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global PGA Packaging Forecast by Type (2025-2030)
12.7 Global PGA Packaging Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Texas Instruments
13.1.1 Texas Instruments Company Information
13.1.2 Texas Instruments PGA Packaging Product Portfolios and Specifications
13.1.3 Texas Instruments PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Texas Instruments Main Business Overview
13.1.5 Texas Instruments Latest Developments
13.2 Evergreen SemiConductor Materials
13.2.1 Evergreen SemiConductor Materials Company Information
13.2.2 Evergreen SemiConductor Materials PGA Packaging Product Portfolios and Specifications
13.2.3 Evergreen SemiConductor Materials PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Evergreen SemiConductor Materials Main Business Overview
13.2.5 Evergreen SemiConductor Materials Latest Developments
13.3 Aries Electronics
13.3.1 Aries Electronics Company Information
13.3.2 Aries Electronics PGA Packaging Product Portfolios and Specifications
13.3.3 Aries Electronics PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Aries Electronics Main Business Overview
13.3.5 Aries Electronics Latest Developments
13.4 Advanced Micro Devices
13.4.1 Advanced Micro Devices Company Information
13.4.2 Advanced Micro Devices PGA Packaging Product Portfolios and Specifications
13.4.3 Advanced Micro Devices PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Advanced Micro Devices Main Business Overview
13.4.5 Advanced Micro Devices Latest Developments
13.5 NXP
13.5.1 NXP Company Information
13.5.2 NXP PGA Packaging Product Portfolios and Specifications
13.5.3 NXP PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 NXP Main Business Overview
13.5.5 NXP Latest Developments
13.6 Kyocera
13.6.1 Kyocera Company Information
13.6.2 Kyocera PGA Packaging Product Portfolios and Specifications
13.6.3 Kyocera PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Kyocera Main Business Overview
13.6.5 Kyocera Latest Developments
13.7 Cadence
13.7.1 Cadence Company Information
13.7.2 Cadence PGA Packaging Product Portfolios and Specifications
13.7.3 Cadence PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Cadence Main Business Overview
13.7.5 Cadence Latest Developments
13.8 Dong Rong Electronics Co Ltd
13.8.1 Dong Rong Electronics Co Ltd Company Information
13.8.2 Dong Rong Electronics Co Ltd PGA Packaging Product Portfolios and Specifications
13.8.3 Dong Rong Electronics Co Ltd PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Dong Rong Electronics Co Ltd Main Business Overview
13.8.5 Dong Rong Electronics Co Ltd Latest Developments
13.9 Shenzhen city and Hing Electronics Co., Ltd.
13.9.1 Shenzhen city and Hing Electronics Co., Ltd. Company Information
13.9.2 Shenzhen city and Hing Electronics Co., Ltd. PGA Packaging Product Portfolios and Specifications
13.9.3 Shenzhen city and Hing Electronics Co., Ltd. PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Shenzhen city and Hing Electronics Co., Ltd. Main Business Overview
13.9.5 Shenzhen city and Hing Electronics Co., Ltd. Latest Developments
13.10 Shenzhen Antenk Electronics Co,Ltd
13.10.1 Shenzhen Antenk Electronics Co,Ltd Company Information
13.10.2 Shenzhen Antenk Electronics Co,Ltd PGA Packaging Product Portfolios and Specifications
13.10.3 Shenzhen Antenk Electronics Co,Ltd PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Shenzhen Antenk Electronics Co,Ltd Main Business Overview
13.10.5 Shenzhen Antenk Electronics Co,Ltd Latest Developments
13.11 VIA
13.11.1 VIA Company Information
13.11.2 VIA PGA Packaging Product Portfolios and Specifications
13.11.3 VIA PGA Packaging Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 VIA Main Business Overview
13.11.5 VIA Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
