Global Hybrid Bonding Technology 麻豆原创 Growth (Status and Outlook) 2025-2031

Publication ID:

LPI04253597

Publication Date:

April 28, 2025

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

IT Services [2]

Software [3]

Computing & Electronics [4]

Description:

The global Hybrid Bonding Technology market size is predicted to grow from US$ 197 million in 2025 to US$ 773 million in 2031; it is expected to grow at a CAGR of 25.6% from 2025 to 2031.
Hybrid bonding is a permanent bond that combines a dielectric bond (SiOx) with embedded metal (Cu) to form interconnections. Compared to TSVs, hybrid bonding will enable further increase in performance and reduce power consumption further. The technology is increasingly being utilized in various semiconductor devices such as sensors, memory, and logic to enable increased I/O density, improved electrical and mechanical performance, and reduced size and cost.
As electronic devices become smaller yet more powerful, there is a growing demand for advanced packaging solutions that enable high-density interconnections. Hybrid bonding facilitates 3D integration, providing a path to achieve higher functionality in compact designs.
The 鈥淗ybrid Bonding Technology Industry Forecast鈥� looks at past sales and reviews total world Hybrid Bonding Technology sales in 2024, providing a comprehensive analysis by region and market sector of projected Hybrid Bonding Technology sales for 2025 through 2031. With Hybrid Bonding Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hybrid Bonding Technology industry.
This Insight Report provides a comprehensive analysis of the global Hybrid Bonding Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Hybrid Bonding Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Hybrid Bonding Technology market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hybrid Bonding Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hybrid Bonding Technology.
This report presents a comprehensive overview, market shares, and growth opportunities of Hybrid Bonding Technology market by product type, application, key players and key regions and countries.
Segmentation by Type:
Wafer-to-wafer Hybrid Bonding
Die-to-wafer Hybrid Bonding
Segmentation by Application:
CMOS Image Sensor (CIS)
NAND
DRAM
High Bandwidth Memory (HBM)
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
EV Group (EVG)
Applied Materials
Adeia
SUSS MicroTec
Intel
Huawei

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Hybrid Bonding Technology 麻豆原创 Size (2020-2031)
2.1.2 Hybrid Bonding Technology 麻豆原创 Size CAGR by Region (2020 VS 2024 VS 2031)
2.1.3 World Current & Future Analysis for Hybrid Bonding Technology by Country/Region (2020, 2024 & 2031)
2.2 Hybrid Bonding Technology Segment by Type
2.2.1 Cu-Cu
2.2.2 Cu-SiO2
2.2.3 Others
2.3 Hybrid Bonding Technology 麻豆原创 Size by Type
2.3.1 Hybrid Bonding Technology 麻豆原创 Size CAGR by Type (2020 VS 2024 VS 2031)
2.3.2 Global Hybrid Bonding Technology 麻豆原创 Size 麻豆原创 Share by Type (2020-2025)
2.4 Hybrid Bonding Technology Segment by Application
2.4.1 Sensors
2.4.2 Memory
2.4.3 Logic
2.4.4 Others
2.5 Hybrid Bonding Technology 麻豆原创 Size by Application
2.5.1 Hybrid Bonding Technology 麻豆原创 Size CAGR by Application (2020 VS 2024 VS 2031)
2.5.2 Global Hybrid Bonding Technology 麻豆原创 Size 麻豆原创 Share by Application (2020-2025)
3 Hybrid Bonding Technology 麻豆原创 Size by Player
3.1 Hybrid Bonding Technology 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Hybrid Bonding Technology Revenue by Player (2020-2025)
3.1.2 Global Hybrid Bonding Technology Revenue 麻豆原创 Share by Player (2020-2025)
3.2 Global Hybrid Bonding Technology Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Hybrid Bonding Technology by Region
4.1 Hybrid Bonding Technology 麻豆原创 Size by Region (2020-2025)
4.2 Global Hybrid Bonding Technology Annual Revenue by Country/Region (2020-2025)
4.3 Americas Hybrid Bonding Technology 麻豆原创 Size Growth (2020-2025)
4.4 APAC Hybrid Bonding Technology 麻豆原创 Size Growth (2020-2025)
4.5 Europe Hybrid Bonding Technology 麻豆原创 Size Growth (2020-2025)
4.6 Middle East & Africa Hybrid Bonding Technology 麻豆原创 Size Growth (2020-2025)
5 Americas
5.1 Americas Hybrid Bonding Technology 麻豆原创 Size by Country (2020-2025)
5.2 Americas Hybrid Bonding Technology 麻豆原创 Size by Type (2020-2025)
5.3 Americas Hybrid Bonding Technology 麻豆原创 Size by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Hybrid Bonding Technology 麻豆原创 Size by Region (2020-2025)
6.2 APAC Hybrid Bonding Technology 麻豆原创 Size by Type (2020-2025)
6.3 APAC Hybrid Bonding Technology 麻豆原创 Size by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Hybrid Bonding Technology 麻豆原创 Size by Country (2020-2025)
7.2 Europe Hybrid Bonding Technology 麻豆原创 Size by Type (2020-2025)
7.3 Europe Hybrid Bonding Technology 麻豆原创 Size by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Hybrid Bonding Technology by Region (2020-2025)
8.2 Middle East & Africa Hybrid Bonding Technology 麻豆原创 Size by Type (2020-2025)
8.3 Middle East & Africa Hybrid Bonding Technology 麻豆原创 Size by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Hybrid Bonding Technology 麻豆原创 Forecast
10.1 Global Hybrid Bonding Technology Forecast by Region (2026-2031)
10.1.1 Global Hybrid Bonding Technology Forecast by Region (2026-2031)
10.1.2 Americas Hybrid Bonding Technology Forecast
10.1.3 APAC Hybrid Bonding Technology Forecast
10.1.4 Europe Hybrid Bonding Technology Forecast
10.1.5 Middle East & Africa Hybrid Bonding Technology Forecast
10.2 Americas Hybrid Bonding Technology Forecast by Country (2026-2031)
10.2.1 United States 麻豆原创 Hybrid Bonding Technology Forecast
10.2.2 Canada 麻豆原创 Hybrid Bonding Technology Forecast
10.2.3 Mexico 麻豆原创 Hybrid Bonding Technology Forecast
10.2.4 Brazil 麻豆原创 Hybrid Bonding Technology Forecast
10.3 APAC Hybrid Bonding Technology Forecast by Region (2026-2031)
10.3.1 China Hybrid Bonding Technology 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Hybrid Bonding Technology Forecast
10.3.3 Korea 麻豆原创 Hybrid Bonding Technology Forecast
10.3.4 Southeast Asia 麻豆原创 Hybrid Bonding Technology Forecast
10.3.5 India 麻豆原创 Hybrid Bonding Technology Forecast
10.3.6 Australia 麻豆原创 Hybrid Bonding Technology Forecast
10.4 Europe Hybrid Bonding Technology Forecast by Country (2026-2031)
10.4.1 Germany 麻豆原创 Hybrid Bonding Technology Forecast
10.4.2 France 麻豆原创 Hybrid Bonding Technology Forecast
10.4.3 UK 麻豆原创 Hybrid Bonding Technology Forecast
10.4.4 Italy 麻豆原创 Hybrid Bonding Technology Forecast
10.4.5 Russia 麻豆原创 Hybrid Bonding Technology Forecast
10.5 Middle East & Africa Hybrid Bonding Technology Forecast by Region (2026-2031)
10.5.1 Egypt 麻豆原创 Hybrid Bonding Technology Forecast
10.5.2 South Africa 麻豆原创 Hybrid Bonding Technology Forecast
10.5.3 Israel 麻豆原创 Hybrid Bonding Technology Forecast
10.5.4 Turkey 麻豆原创 Hybrid Bonding Technology Forecast
10.6 Global Hybrid Bonding Technology Forecast by Type (2026-2031)
10.7 Global Hybrid Bonding Technology Forecast by Application (2026-2031)
10.7.1 GCC Countries 麻豆原创 Hybrid Bonding Technology Forecast
11 Key Players Analysis
11.1 EV Group
11.1.1 EV Group Company Information
11.1.2 EV Group Hybrid Bonding Technology Product Offered
11.1.3 EV Group Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.1.4 EV Group Main Business Overview
11.1.5 EV Group Latest Developments
11.2 Intel
11.2.1 Intel Company Information
11.2.2 Intel Hybrid Bonding Technology Product Offered
11.2.3 Intel Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.2.4 Intel Main Business Overview
11.2.5 Intel Latest Developments
11.3 SkyWater
11.3.1 SkyWater Company Information
11.3.2 SkyWater Hybrid Bonding Technology Product Offered
11.3.3 SkyWater Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.3.4 SkyWater Main Business Overview
11.3.5 SkyWater Latest Developments
11.4 Applied Materials
11.4.1 Applied Materials Company Information
11.4.2 Applied Materials Hybrid Bonding Technology Product Offered
11.4.3 Applied Materials Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.4.4 Applied Materials Main Business Overview
11.4.5 Applied Materials Latest Developments
11.5 SUSS
11.5.1 SUSS Company Information
11.5.2 SUSS Hybrid Bonding Technology Product Offered
11.5.3 SUSS Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.5.4 SUSS Main Business Overview
11.5.5 SUSS Latest Developments
11.6 Xperi and LAPIS
11.6.1 Xperi and LAPIS Company Information
11.6.2 Xperi and LAPIS Hybrid Bonding Technology Product Offered
11.6.3 Xperi and LAPIS Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.6.4 Xperi and LAPIS Main Business Overview
11.6.5 Xperi and LAPIS Latest Developments
11.7 Huawei
11.7.1 Huawei Company Information
11.7.2 Huawei Hybrid Bonding Technology Product Offered
11.7.3 Huawei Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.7.4 Huawei Main Business Overview
11.7.5 Huawei Latest Developments
12 Research Findings and Conclusion

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.