Global Hybrid Bonding Technology 麻豆原创 Growth (Status and Outlook) 2024-2030

Publication ID:

LPI03250531

Publication Date:

March 18, 2025

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

IT Services [2]

Software [3]

Computing & Electronics [4]

Description:

The global Hybrid Bonding Technology market size is predicted to grow from US$ 161 million in 2024 to US$ 632 million in 2030; it is expected to grow at a CAGR of 25.6% from 2024 to 2030.
Hybrid bonding is a permanent bond that combines a dielectric bond (SiOx) with embedded metal (Cu) to form interconnections. Compared to TSVs, hybrid bonding will enable further increase in performance and reduce power consumption further. The technology is increasingly being utilized in various semiconductor devices such as sensors, memory, and logic to enable increased I/O density, improved electrical and mechanical performance, and reduced size and cost.
As electronic devices become smaller yet more powerful, there is a growing demand for advanced packaging solutions that enable high-density interconnections. Hybrid bonding facilitates 3D integration, providing a path to achieve higher functionality in compact designs.
The 鈥淗ybrid Bonding Technology Industry Forecast鈥� looks at past sales and reviews total world Hybrid Bonding Technology sales in 2023, providing a comprehensive analysis by region and market sector of projected Hybrid Bonding Technology sales for 2024 through 2030. With Hybrid Bonding Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Hybrid Bonding Technology industry.
This Insight Report provides a comprehensive analysis of the global Hybrid Bonding Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Hybrid Bonding Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Hybrid Bonding Technology market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Hybrid Bonding Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Hybrid Bonding Technology.
This report presents a comprehensive overview, market shares, and growth opportunities of Hybrid Bonding Technology market by product type, application, key players and key regions and countries.
Segmentation by Type:
Wafer-to-wafer Hybrid Bonding
Die-to-wafer Hybrid Bonding
Segmentation by Application:
CMOS Image Sensor (CIS)
NAND
DRAM
High Bandwidth Memory (HBM)
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
EV Group (EVG)
Applied Materials
Adeia
SUSS MicroTec
Intel
Huawei

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Hybrid Bonding Technology 麻豆原创 Size 2019-2030
2.1.2 Hybrid Bonding Technology 麻豆原创 Size CAGR by Region (2019 VS 2023 VS 2030)
2.1.3 World Current & Future Analysis for Hybrid Bonding Technology by Country/Region, 2019, 2023 & 2030
2.2 Hybrid Bonding Technology Segment by Type
2.2.1 Wafer-to-wafer Hybrid Bonding
2.2.2 Die-to-wafer Hybrid Bonding
2.3 Hybrid Bonding Technology 麻豆原创 Size by Type
2.3.1 Hybrid Bonding Technology 麻豆原创 Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Hybrid Bonding Technology 麻豆原创 Size 麻豆原创 Share by Type (2019-2024)
2.4 Hybrid Bonding Technology Segment by Application
2.4.1 CMOS Image Sensor (CIS)
2.4.2 NAND
2.4.3 DRAM
2.4.4 High Bandwidth Memory (HBM)
2.4.5 Others
2.5 Hybrid Bonding Technology 麻豆原创 Size by Application
2.5.1 Hybrid Bonding Technology 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Hybrid Bonding Technology 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 Hybrid Bonding Technology 麻豆原创 Size by Player
3.1 Hybrid Bonding Technology 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Hybrid Bonding Technology Revenue by Player (2019-2024)
3.1.2 Global Hybrid Bonding Technology Revenue 麻豆原创 Share by Player (2019-2024)
3.2 Global Hybrid Bonding Technology Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Hybrid Bonding Technology by Region
4.1 Hybrid Bonding Technology 麻豆原创 Size by Region (2019-2024)
4.2 Global Hybrid Bonding Technology Annual Revenue by Country/Region (2019-2024)
4.3 Americas Hybrid Bonding Technology 麻豆原创 Size Growth (2019-2024)
4.4 APAC Hybrid Bonding Technology 麻豆原创 Size Growth (2019-2024)
4.5 Europe Hybrid Bonding Technology 麻豆原创 Size Growth (2019-2024)
4.6 Middle East & Africa Hybrid Bonding Technology 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas Hybrid Bonding Technology 麻豆原创 Size by Country (2019-2024)
5.2 Americas Hybrid Bonding Technology 麻豆原创 Size by Type (2019-2024)
5.3 Americas Hybrid Bonding Technology 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Hybrid Bonding Technology 麻豆原创 Size by Region (2019-2024)
6.2 APAC Hybrid Bonding Technology 麻豆原创 Size by Type (2019-2024)
6.3 APAC Hybrid Bonding Technology 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Hybrid Bonding Technology 麻豆原创 Size by Country (2019-2024)
7.2 Europe Hybrid Bonding Technology 麻豆原创 Size by Type (2019-2024)
7.3 Europe Hybrid Bonding Technology 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Hybrid Bonding Technology by Region (2019-2024)
8.2 Middle East & Africa Hybrid Bonding Technology 麻豆原创 Size by Type (2019-2024)
8.3 Middle East & Africa Hybrid Bonding Technology 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Hybrid Bonding Technology 麻豆原创 Forecast
10.1 Global Hybrid Bonding Technology Forecast by Region (2025-2030)
10.1.1 Global Hybrid Bonding Technology Forecast by Region (2025-2030)
10.1.2 Americas Hybrid Bonding Technology Forecast
10.1.3 APAC Hybrid Bonding Technology Forecast
10.1.4 Europe Hybrid Bonding Technology Forecast
10.1.5 Middle East & Africa Hybrid Bonding Technology Forecast
10.2 Americas Hybrid Bonding Technology Forecast by Country (2025-2030)
10.2.1 United States 麻豆原创 Hybrid Bonding Technology Forecast
10.2.2 Canada 麻豆原创 Hybrid Bonding Technology Forecast
10.2.3 Mexico 麻豆原创 Hybrid Bonding Technology Forecast
10.2.4 Brazil 麻豆原创 Hybrid Bonding Technology Forecast
10.3 APAC Hybrid Bonding Technology Forecast by Region (2025-2030)
10.3.1 China Hybrid Bonding Technology 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Hybrid Bonding Technology Forecast
10.3.3 Korea 麻豆原创 Hybrid Bonding Technology Forecast
10.3.4 Southeast Asia 麻豆原创 Hybrid Bonding Technology Forecast
10.3.5 India 麻豆原创 Hybrid Bonding Technology Forecast
10.3.6 Australia 麻豆原创 Hybrid Bonding Technology Forecast
10.4 Europe Hybrid Bonding Technology Forecast by Country (2025-2030)
10.4.1 Germany 麻豆原创 Hybrid Bonding Technology Forecast
10.4.2 France 麻豆原创 Hybrid Bonding Technology Forecast
10.4.3 UK 麻豆原创 Hybrid Bonding Technology Forecast
10.4.4 Italy 麻豆原创 Hybrid Bonding Technology Forecast
10.4.5 Russia 麻豆原创 Hybrid Bonding Technology Forecast
10.5 Middle East & Africa Hybrid Bonding Technology Forecast by Region (2025-2030)
10.5.1 Egypt 麻豆原创 Hybrid Bonding Technology Forecast
10.5.2 South Africa 麻豆原创 Hybrid Bonding Technology Forecast
10.5.3 Israel 麻豆原创 Hybrid Bonding Technology Forecast
10.5.4 Turkey 麻豆原创 Hybrid Bonding Technology Forecast
10.6 Global Hybrid Bonding Technology Forecast by Type (2025-2030)
10.7 Global Hybrid Bonding Technology Forecast by Application (2025-2030)
10.7.1 GCC Countries 麻豆原创 Hybrid Bonding Technology Forecast
11 Key Players Analysis
11.1 EV Group (EVG)
11.1.1 EV Group (EVG) Company Information
11.1.2 EV Group (EVG) Hybrid Bonding Technology Product Offered
11.1.3 EV Group (EVG) Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 EV Group (EVG) Main Business Overview
11.1.5 EV Group (EVG) Latest Developments
11.2 Applied Materials
11.2.1 Applied Materials Company Information
11.2.2 Applied Materials Hybrid Bonding Technology Product Offered
11.2.3 Applied Materials Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 Applied Materials Main Business Overview
11.2.5 Applied Materials Latest Developments
11.3 Adeia
11.3.1 Adeia Company Information
11.3.2 Adeia Hybrid Bonding Technology Product Offered
11.3.3 Adeia Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 Adeia Main Business Overview
11.3.5 Adeia Latest Developments
11.4 SUSS MicroTec
11.4.1 SUSS MicroTec Company Information
11.4.2 SUSS MicroTec Hybrid Bonding Technology Product Offered
11.4.3 SUSS MicroTec Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 SUSS MicroTec Main Business Overview
11.4.5 SUSS MicroTec Latest Developments
11.5 Intel
11.5.1 Intel Company Information
11.5.2 Intel Hybrid Bonding Technology Product Offered
11.5.3 Intel Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 Intel Main Business Overview
11.5.5 Intel Latest Developments
11.6 Huawei
11.6.1 Huawei Company Information
11.6.2 Huawei Hybrid Bonding Technology Product Offered
11.6.3 Huawei Hybrid Bonding Technology Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 Huawei Main Business Overview
11.6.5 Huawei Latest Developments
12 Research Findings and Conclusion

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