Global High Bandwidth Memory (HBM) for AI Chipsets 麻豆原创 Growth 2024-2030

Publication ID:

LPI08245373

Publication Date:

August 8, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

High-Bandwidth Memory (HBM) chips are advanced types of memory designed to offer significantly higher bandwidth compared to traditional DRAM (Dynamic Random-Access Memory) technologies. Developed collaboratively by AMD and Hynix and now standardized by JEDEC, HBM chips are particularly important in applications requiring large amounts of data to be transferred quickly, such as graphics processing units (GPUs), high-performance computing (HPC), artificial intelligence (AI), and data centers.
The global High Bandwidth Memory (HBM) for AI Chipsets market size is projected to grow from US$ 3733 million in 2024 to US$ 92510 million in 2030; it is expected to grow at a CAGR of 70.7% from 2024 to 2030.
The 鈥淗igh Bandwidth Memory (HBM) for AI Chipsets Industry Forecast鈥� looks at past sales and reviews total world High Bandwidth Memory (HBM) for AI Chipsets sales in 2023, providing a comprehensive analysis by region and market sector of projected High Bandwidth Memory (HBM) for AI Chipsets sales for 2024 through 2030. With High Bandwidth Memory (HBM) for AI Chipsets sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world High Bandwidth Memory (HBM) for AI Chipsets industry.
This Insight Report provides a comprehensive analysis of the global High Bandwidth Memory (HBM) for AI Chipsets landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on High Bandwidth Memory (HBM) for AI Chipsets portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global High Bandwidth Memory (HBM) for AI Chipsets market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for High Bandwidth Memory (HBM) for AI Chipsets and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global High Bandwidth Memory (HBM) for AI Chipsets.
United States market for High Bandwidth Memory (HBM) for AI Chipsets is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for High Bandwidth Memory (HBM) for AI Chipsets is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for High Bandwidth Memory (HBM) for AI Chipsets is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key High Bandwidth Memory (HBM) for AI Chipsets players cover SK Hynix, Samsung, Micron Technology, CXMT, Wuhan Xinxin, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of High Bandwidth Memory (HBM) for AI Chipsets market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
HBM2
HBM2E
HBM3
HBM3E
Others
Segmentation by Application:
Servers
Networking Products
Consumer Products
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
SK Hynix
Samsung
Micron Technology
CXMT
Wuhan Xinxin
Key Questions Addressed in this Report
What is the 10-year outlook for the global High Bandwidth Memory (HBM) for AI Chipsets market?
What factors are driving High Bandwidth Memory (HBM) for AI Chipsets market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do High Bandwidth Memory (HBM) for AI Chipsets market opportunities vary by end market size?
How does High Bandwidth Memory (HBM) for AI Chipsets break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for High Bandwidth Memory (HBM) for AI Chipsets by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for High Bandwidth Memory (HBM) for AI Chipsets by Country/Region, 2019, 2023 & 2030
2.2 High Bandwidth Memory (HBM) for AI Chipsets Segment by Type
2.2.1 HBM2
2.2.2 HBM2E
2.2.3 HBM3
2.2.4 HBM3E
2.2.5 Others
2.3 High Bandwidth Memory (HBM) for AI Chipsets Sales by Type
2.3.1 Global High Bandwidth Memory (HBM) for AI Chipsets Sales 麻豆原创 Share by Type (2019-2024)
2.3.2 Global High Bandwidth Memory (HBM) for AI Chipsets Revenue and 麻豆原创 Share by Type (2019-2024)
2.3.3 Global High Bandwidth Memory (HBM) for AI Chipsets Sale Price by Type (2019-2024)
2.4 High Bandwidth Memory (HBM) for AI Chipsets Segment by Application
2.4.1 Servers
2.4.2 Networking Products
2.4.3 Consumer Products
2.4.4 Others
2.5 High Bandwidth Memory (HBM) for AI Chipsets Sales by Application
2.5.1 Global High Bandwidth Memory (HBM) for AI Chipsets Sale 麻豆原创 Share by Application (2019-2024)
2.5.2 Global High Bandwidth Memory (HBM) for AI Chipsets Revenue and 麻豆原创 Share by Application (2019-2024)
2.5.3 Global High Bandwidth Memory (HBM) for AI Chipsets Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global High Bandwidth Memory (HBM) for AI Chipsets Breakdown Data by Company
3.1.1 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Sales by Company (2019-2024)
3.1.2 Global High Bandwidth Memory (HBM) for AI Chipsets Sales 麻豆原创 Share by Company (2019-2024)
3.2 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Revenue by Company (2019-2024)
3.2.1 Global High Bandwidth Memory (HBM) for AI Chipsets Revenue by Company (2019-2024)
3.2.2 Global High Bandwidth Memory (HBM) for AI Chipsets Revenue 麻豆原创 Share by Company (2019-2024)
3.3 Global High Bandwidth Memory (HBM) for AI Chipsets Sale Price by Company
3.4 Key Manufacturers High Bandwidth Memory (HBM) for AI Chipsets Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers High Bandwidth Memory (HBM) for AI Chipsets Product Location Distribution
3.4.2 Players High Bandwidth Memory (HBM) for AI Chipsets Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for High Bandwidth Memory (HBM) for AI Chipsets by Geographic Region
4.1 World Historic High Bandwidth Memory (HBM) for AI Chipsets 麻豆原创 Size by Geographic Region (2019-2024)
4.1.1 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Sales by Geographic Region (2019-2024)
4.1.2 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic High Bandwidth Memory (HBM) for AI Chipsets 麻豆原创 Size by Country/Region (2019-2024)
4.2.1 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Sales by Country/Region (2019-2024)
4.2.2 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Revenue by Country/Region (2019-2024)
4.3 Americas High Bandwidth Memory (HBM) for AI Chipsets Sales Growth
4.4 APAC High Bandwidth Memory (HBM) for AI Chipsets Sales Growth
4.5 Europe High Bandwidth Memory (HBM) for AI Chipsets Sales Growth
4.6 Middle East & Africa High Bandwidth Memory (HBM) for AI Chipsets Sales Growth
5 Americas
5.1 Americas High Bandwidth Memory (HBM) for AI Chipsets Sales by Country
5.1.1 Americas High Bandwidth Memory (HBM) for AI Chipsets Sales by Country (2019-2024)
5.1.2 Americas High Bandwidth Memory (HBM) for AI Chipsets Revenue by Country (2019-2024)
5.2 Americas High Bandwidth Memory (HBM) for AI Chipsets Sales by Type (2019-2024)
5.3 Americas High Bandwidth Memory (HBM) for AI Chipsets Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC High Bandwidth Memory (HBM) for AI Chipsets Sales by Region
6.1.1 APAC High Bandwidth Memory (HBM) for AI Chipsets Sales by Region (2019-2024)
6.1.2 APAC High Bandwidth Memory (HBM) for AI Chipsets Revenue by Region (2019-2024)
6.2 APAC High Bandwidth Memory (HBM) for AI Chipsets Sales by Type (2019-2024)
6.3 APAC High Bandwidth Memory (HBM) for AI Chipsets Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe High Bandwidth Memory (HBM) for AI Chipsets by Country
7.1.1 Europe High Bandwidth Memory (HBM) for AI Chipsets Sales by Country (2019-2024)
7.1.2 Europe High Bandwidth Memory (HBM) for AI Chipsets Revenue by Country (2019-2024)
7.2 Europe High Bandwidth Memory (HBM) for AI Chipsets Sales by Type (2019-2024)
7.3 Europe High Bandwidth Memory (HBM) for AI Chipsets Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa High Bandwidth Memory (HBM) for AI Chipsets by Country
8.1.1 Middle East & Africa High Bandwidth Memory (HBM) for AI Chipsets Sales by Country (2019-2024)
8.1.2 Middle East & Africa High Bandwidth Memory (HBM) for AI Chipsets Revenue by Country (2019-2024)
8.2 Middle East & Africa High Bandwidth Memory (HBM) for AI Chipsets Sales by Type (2019-2024)
8.3 Middle East & Africa High Bandwidth Memory (HBM) for AI Chipsets Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of High Bandwidth Memory (HBM) for AI Chipsets
10.3 Manufacturing Process Analysis of High Bandwidth Memory (HBM) for AI Chipsets
10.4 Industry Chain Structure of High Bandwidth Memory (HBM) for AI Chipsets
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 High Bandwidth Memory (HBM) for AI Chipsets Distributors
11.3 High Bandwidth Memory (HBM) for AI Chipsets Customer
12 World Forecast Review for High Bandwidth Memory (HBM) for AI Chipsets by Geographic Region
12.1 Global High Bandwidth Memory (HBM) for AI Chipsets 麻豆原创 Size Forecast by Region
12.1.1 Global High Bandwidth Memory (HBM) for AI Chipsets Forecast by Region (2025-2030)
12.1.2 Global High Bandwidth Memory (HBM) for AI Chipsets Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global High Bandwidth Memory (HBM) for AI Chipsets Forecast by Type (2025-2030)
12.7 Global High Bandwidth Memory (HBM) for AI Chipsets Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 SK Hynix
13.1.1 SK Hynix Company Information
13.1.2 SK Hynix High Bandwidth Memory (HBM) for AI Chipsets Product Portfolios and Specifications
13.1.3 SK Hynix High Bandwidth Memory (HBM) for AI Chipsets Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 SK Hynix Main Business Overview
13.1.5 SK Hynix Latest Developments
13.2 Samsung
13.2.1 Samsung Company Information
13.2.2 Samsung High Bandwidth Memory (HBM) for AI Chipsets Product Portfolios and Specifications
13.2.3 Samsung High Bandwidth Memory (HBM) for AI Chipsets Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Samsung Main Business Overview
13.2.5 Samsung Latest Developments
13.3 Micron Technology
13.3.1 Micron Technology Company Information
13.3.2 Micron Technology High Bandwidth Memory (HBM) for AI Chipsets Product Portfolios and Specifications
13.3.3 Micron Technology High Bandwidth Memory (HBM) for AI Chipsets Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Micron Technology Main Business Overview
13.3.5 Micron Technology Latest Developments
13.4 CXMT
13.4.1 CXMT Company Information
13.4.2 CXMT High Bandwidth Memory (HBM) for AI Chipsets Product Portfolios and Specifications
13.4.3 CXMT High Bandwidth Memory (HBM) for AI Chipsets Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 CXMT Main Business Overview
13.4.5 CXMT Latest Developments
13.5 Wuhan Xinxin
13.5.1 Wuhan Xinxin Company Information
13.5.2 Wuhan Xinxin High Bandwidth Memory (HBM) for AI Chipsets Product Portfolios and Specifications
13.5.3 Wuhan Xinxin High Bandwidth Memory (HBM) for AI Chipsets Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Wuhan Xinxin Main Business Overview
13.5.5 Wuhan Xinxin Latest Developments
14 Research Findings and Conclusion

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