The global Glass Core Substrates for Semiconductor Packaging market size is predicted to grow from US$ 238 million in 2025 to US$ 591 million in 2031; it is expected to grow at a CAGR of 16.3% from 2025 to 2031.
A glass substrate for semiconductor packaging refers to a specially designed glass material used as a base or platform for constructing and assembling electronic components, particularly semiconductors. It provides a stable and inert surface for mounting and connecting delicate semiconductor devices, such as integrated circuits (ICs), microprocessors, and memory chips. Glass substrates used in semiconductor packaging are engineered to possess specific characteristics that make them suitable for this application. These characteristics include high thermal conductivity, low coefficient of thermal expansion (CTE), electrical insulation properties, chemical resistance, and excellent dimensional stability. The glass substrate serves as a foundation for placing and interconnecting chips, allowing for the creation of complex electronic circuits. Additionally, it can provide protection against moisture, dust, and mechanical stress, enhancing the durability and reliability of the semiconductors. Compared to currently used organic substrates, glass substrates offer better thermal and mechanical stability and ultra-low flatness. These properties promote the increase in chip surface area and the number of chiplets on a single package. A dynamic that allows, in short, to improve the design rules necessary for artificial intelligence products and future data centers by an order of magnitude.
Global key players of Glass Substrate for Semiconductor Packaging include AGC, Schott, Corning, Hoya, Ohara, etc. The top five players hold a share about 90%. Asia-Pacific is the largest market, and has a share about 80%, followed by North America and Europe with share 16% and 3%, separately. In terms of product type, Coefficient of Thermal Expansion (CTE), above 5 ppm/掳C is the largest segment, occupied for a share of 65%. In terms of application, Wafer Level Packaging has a share about 60 percent.
The 鈥淕lass Core Substrates for Semiconductor Packaging Industry Forecast鈥� looks at past sales and reviews total world Glass Core Substrates for Semiconductor Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Glass Core Substrates for Semiconductor Packaging sales for 2025 through 2031. With Glass Core Substrates for Semiconductor Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Glass Core Substrates for Semiconductor Packaging industry.
This Insight Report provides a comprehensive analysis of the global Glass Core Substrates for Semiconductor Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Glass Core Substrates for Semiconductor Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Glass Core Substrates for Semiconductor Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Glass Core Substrates for Semiconductor Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Glass Core Substrates for Semiconductor Packaging.
This report presents a comprehensive overview, market shares, and growth opportunities of Glass Core Substrates for Semiconductor Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Coefficient of Thermal Expansion (CTE), above 5 ppm/掳C
Coefficient of Thermal Expansion (CTE), below 5 ppm/掳C
Segmentation by Application:
Wafer Level Packaging
Panel Level Packaging
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
AGC
Schott
Corning
Hoya
Ohara
Dai Nippon Printing (DNP)
NEG
CrysTop Glass
WGTech
Key Questions Addressed in this Report
What is the 10-year outlook for the global Glass Core Substrates for Semiconductor Packaging market?
What factors are driving Glass Core Substrates for Semiconductor Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Glass Core Substrates for Semiconductor Packaging market opportunities vary by end market size?
How does Glass Core Substrates for Semiconductor Packaging break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Glass Core Substrates for Semiconductor Packaging Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Glass Core Substrates for Semiconductor Packaging by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Glass Core Substrates for Semiconductor Packaging by Country/Region, 2020, 2024 & 2031
2.2 Glass Core Substrates for Semiconductor Packaging Segment by Type
2.2.1 Coefficient of Thermal Expansion (CTE), above 5 ppm/掳C
2.2.2 Coefficient of Thermal Expansion (CTE), below 5 ppm/掳C
2.3 Glass Core Substrates for Semiconductor Packaging Sales by Type
2.3.1 Global Glass Core Substrates for Semiconductor Packaging Sales 麻豆原创 Share by Type (2020-2025)
2.3.2 Global Glass Core Substrates for Semiconductor Packaging Revenue and 麻豆原创 Share by Type (2020-2025)
2.3.3 Global Glass Core Substrates for Semiconductor Packaging Sale Price by Type (2020-2025)
2.4 Glass Core Substrates for Semiconductor Packaging Segment by Application
2.4.1 Wafer Level Packaging
2.4.2 Panel Level Packaging
2.5 Glass Core Substrates for Semiconductor Packaging Sales by Application
2.5.1 Global Glass Core Substrates for Semiconductor Packaging Sale 麻豆原创 Share by Application (2020-2025)
2.5.2 Global Glass Core Substrates for Semiconductor Packaging Revenue and 麻豆原创 Share by Application (2020-2025)
2.5.3 Global Glass Core Substrates for Semiconductor Packaging Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Glass Core Substrates for Semiconductor Packaging Breakdown Data by Company
3.1.1 Global Glass Core Substrates for Semiconductor Packaging Annual Sales by Company (2020-2025)
3.1.2 Global Glass Core Substrates for Semiconductor Packaging Sales 麻豆原创 Share by Company (2020-2025)
3.2 Global Glass Core Substrates for Semiconductor Packaging Annual Revenue by Company (2020-2025)
3.2.1 Global Glass Core Substrates for Semiconductor Packaging Revenue by Company (2020-2025)
3.2.2 Global Glass Core Substrates for Semiconductor Packaging Revenue 麻豆原创 Share by Company (2020-2025)
3.3 Global Glass Core Substrates for Semiconductor Packaging Sale Price by Company
3.4 Key Manufacturers Glass Core Substrates for Semiconductor Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Glass Core Substrates for Semiconductor Packaging Product Location Distribution
3.4.2 Players Glass Core Substrates for Semiconductor Packaging Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for Glass Core Substrates for Semiconductor Packaging by Geographic Region
4.1 World Historic Glass Core Substrates for Semiconductor Packaging 麻豆原创 Size by Geographic Region (2020-2025)
4.1.1 Global Glass Core Substrates for Semiconductor Packaging Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Glass Core Substrates for Semiconductor Packaging Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Glass Core Substrates for Semiconductor Packaging 麻豆原创 Size by Country/Region (2020-2025)
4.2.1 Global Glass Core Substrates for Semiconductor Packaging Annual Sales by Country/Region (2020-2025)
4.2.2 Global Glass Core Substrates for Semiconductor Packaging Annual Revenue by Country/Region (2020-2025)
4.3 Americas Glass Core Substrates for Semiconductor Packaging Sales Growth
4.4 APAC Glass Core Substrates for Semiconductor Packaging Sales Growth
4.5 Europe Glass Core Substrates for Semiconductor Packaging Sales Growth
4.6 Middle East & Africa Glass Core Substrates for Semiconductor Packaging Sales Growth
5 Americas
5.1 Americas Glass Core Substrates for Semiconductor Packaging Sales by Country
5.1.1 Americas Glass Core Substrates for Semiconductor Packaging Sales by Country (2020-2025)
5.1.2 Americas Glass Core Substrates for Semiconductor Packaging Revenue by Country (2020-2025)
5.2 Americas Glass Core Substrates for Semiconductor Packaging Sales by Type (2020-2025)
5.3 Americas Glass Core Substrates for Semiconductor Packaging Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Glass Core Substrates for Semiconductor Packaging Sales by Region
6.1.1 APAC Glass Core Substrates for Semiconductor Packaging Sales by Region (2020-2025)
6.1.2 APAC Glass Core Substrates for Semiconductor Packaging Revenue by Region (2020-2025)
6.2 APAC Glass Core Substrates for Semiconductor Packaging Sales by Type (2020-2025)
6.3 APAC Glass Core Substrates for Semiconductor Packaging Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Glass Core Substrates for Semiconductor Packaging by Country
7.1.1 Europe Glass Core Substrates for Semiconductor Packaging Sales by Country (2020-2025)
7.1.2 Europe Glass Core Substrates for Semiconductor Packaging Revenue by Country (2020-2025)
7.2 Europe Glass Core Substrates for Semiconductor Packaging Sales by Type (2020-2025)
7.3 Europe Glass Core Substrates for Semiconductor Packaging Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Glass Core Substrates for Semiconductor Packaging by Country
8.1.1 Middle East & Africa Glass Core Substrates for Semiconductor Packaging Sales by Country (2020-2025)
8.1.2 Middle East & Africa Glass Core Substrates for Semiconductor Packaging Revenue by Country (2020-2025)
8.2 Middle East & Africa Glass Core Substrates for Semiconductor Packaging Sales by Type (2020-2025)
8.3 Middle East & Africa Glass Core Substrates for Semiconductor Packaging Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Glass Core Substrates for Semiconductor Packaging
10.3 Manufacturing Process Analysis of Glass Core Substrates for Semiconductor Packaging
10.4 Industry Chain Structure of Glass Core Substrates for Semiconductor Packaging
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Glass Core Substrates for Semiconductor Packaging Distributors
11.3 Glass Core Substrates for Semiconductor Packaging Customer
12 World Forecast Review for Glass Core Substrates for Semiconductor Packaging by Geographic Region
12.1 Global Glass Core Substrates for Semiconductor Packaging 麻豆原创 Size Forecast by Region
12.1.1 Global Glass Core Substrates for Semiconductor Packaging Forecast by Region (2026-2031)
12.1.2 Global Glass Core Substrates for Semiconductor Packaging Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Glass Core Substrates for Semiconductor Packaging Forecast by Type (2026-2031)
12.7 Global Glass Core Substrates for Semiconductor Packaging Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 AGC
13.1.1 AGC Company Information
13.1.2 AGC Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.1.3 AGC Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 AGC Main Business Overview
13.1.5 AGC Latest Developments
13.2 Schott
13.2.1 Schott Company Information
13.2.2 Schott Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.2.3 Schott Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Schott Main Business Overview
13.2.5 Schott Latest Developments
13.3 Corning
13.3.1 Corning Company Information
13.3.2 Corning Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.3.3 Corning Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Corning Main Business Overview
13.3.5 Corning Latest Developments
13.4 Hoya
13.4.1 Hoya Company Information
13.4.2 Hoya Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.4.3 Hoya Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Hoya Main Business Overview
13.4.5 Hoya Latest Developments
13.5 Ohara
13.5.1 Ohara Company Information
13.5.2 Ohara Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.5.3 Ohara Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Ohara Main Business Overview
13.5.5 Ohara Latest Developments
13.6 Dai Nippon Printing (DNP)
13.6.1 Dai Nippon Printing (DNP) Company Information
13.6.2 Dai Nippon Printing (DNP) Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.6.3 Dai Nippon Printing (DNP) Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Dai Nippon Printing (DNP) Main Business Overview
13.6.5 Dai Nippon Printing (DNP) Latest Developments
13.7 NEG
13.7.1 NEG Company Information
13.7.2 NEG Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.7.3 NEG Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 NEG Main Business Overview
13.7.5 NEG Latest Developments
13.8 CrysTop Glass
13.8.1 CrysTop Glass Company Information
13.8.2 CrysTop Glass Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.8.3 CrysTop Glass Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 CrysTop Glass Main Business Overview
13.8.5 CrysTop Glass Latest Developments
13.9 WGTech
13.9.1 WGTech Company Information
13.9.2 WGTech Glass Core Substrates for Semiconductor Packaging Product Portfolios and Specifications
13.9.3 WGTech Glass Core Substrates for Semiconductor Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 WGTech Main Business Overview
13.9.5 WGTech Latest Developments
14 Research Findings and Conclusion
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*If Applicable.
