The global Flip Chip CSP (FCCSP) Package market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
FCCSP (Flip Chip Chip Scale Package) offers chip scale capacity for I/Os around 200 or less. FCCSP provides better protection for chip and better solder joint reliability compared with direct chip attach (DCA) or chip on board (COB). FCCSP is more superior to known good die (KGD) in low-cost test and burn-in, and performs comparable electrical function with KGD. FCCSP features thin and small profile, and lightweight packages.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
The 鈥淔lip Chip CSP (FCCSP) Package Industry Forecast鈥� looks at past sales and reviews total world Flip Chip CSP (FCCSP) Package sales in 2024, providing a comprehensive analysis by region and market sector of projected Flip Chip CSP (FCCSP) Package sales for 2025 through 2031. With Flip Chip CSP (FCCSP) Package sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Flip Chip CSP (FCCSP) Package industry.
This Insight Report provides a comprehensive analysis of the global Flip Chip CSP (FCCSP) Package landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Flip Chip CSP (FCCSP) Package portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Flip Chip CSP (FCCSP) Package market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Flip Chip CSP (FCCSP) Package and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Flip Chip CSP (FCCSP) Package.
This report presents a comprehensive overview, market shares, and growth opportunities of Flip Chip CSP (FCCSP) Package market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Bare Die Type
Molded (CUF, MUF) Type
SiP Type
Hybrid (fcSCSP) Type
Others
Segmentation by Application:
Auto and Transportation
Consumer Electronics
Communication
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Amkor
Taiwan Semiconductor Manufacturing
ASE Group
Intel Corporation
JCET Group Co.,Ltd
Samsung Group
SPIL
Powertech Technology
Tongfu Microelectronics Co., Ltd
Tianshui Huatian Technology Co., Ltd
United Microelectronics
SFA Semicon
Key Questions Addressed in this Report
What is the 10-year outlook for the global Flip Chip CSP (FCCSP) Package market?
What factors are driving Flip Chip CSP (FCCSP) Package market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Flip Chip CSP (FCCSP) Package market opportunities vary by end market size?
How does Flip Chip CSP (FCCSP) Package break out by Type, by Application?
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Flip Chip CSP (FCCSP) Package Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Flip Chip CSP (FCCSP) Package by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Flip Chip CSP (FCCSP) Package by Country/Region, 2020, 2024 & 2031
2.2 Flip Chip CSP (FCCSP) Package Segment by Type
2.2.1 Bare Die Type
2.2.2 Molded (CUF, MUF) Type
2.2.3 SiP Type
2.2.4 Hybrid (fcSCSP) Type
2.2.5 Others
2.3 Flip Chip CSP (FCCSP) Package Sales by Type
2.3.1 Global Flip Chip CSP (FCCSP) Package Sales 麻豆原创 Share by Type (2020-2025)
2.3.2 Global Flip Chip CSP (FCCSP) Package Revenue and 麻豆原创 Share by Type (2020-2025)
2.3.3 Global Flip Chip CSP (FCCSP) Package Sale Price by Type (2020-2025)
2.4 Flip Chip CSP (FCCSP) Package Segment by Application
2.4.1 Auto and Transportation
2.4.2 Consumer Electronics
2.4.3 Communication
2.4.4 Others
2.5 Flip Chip CSP (FCCSP) Package Sales by Application
2.5.1 Global Flip Chip CSP (FCCSP) Package Sale 麻豆原创 Share by Application (2020-2025)
2.5.2 Global Flip Chip CSP (FCCSP) Package Revenue and 麻豆原创 Share by Application (2020-2025)
2.5.3 Global Flip Chip CSP (FCCSP) Package Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Flip Chip CSP (FCCSP) Package Breakdown Data by Company
3.1.1 Global Flip Chip CSP (FCCSP) Package Annual Sales by Company (2020-2025)
3.1.2 Global Flip Chip CSP (FCCSP) Package Sales 麻豆原创 Share by Company (2020-2025)
3.2 Global Flip Chip CSP (FCCSP) Package Annual Revenue by Company (2020-2025)
3.2.1 Global Flip Chip CSP (FCCSP) Package Revenue by Company (2020-2025)
3.2.2 Global Flip Chip CSP (FCCSP) Package Revenue 麻豆原创 Share by Company (2020-2025)
3.3 Global Flip Chip CSP (FCCSP) Package Sale Price by Company
3.4 Key Manufacturers Flip Chip CSP (FCCSP) Package Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Flip Chip CSP (FCCSP) Package Product Location Distribution
3.4.2 Players Flip Chip CSP (FCCSP) Package Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for Flip Chip CSP (FCCSP) Package by Geographic Region
4.1 World Historic Flip Chip CSP (FCCSP) Package 麻豆原创 Size by Geographic Region (2020-2025)
4.1.1 Global Flip Chip CSP (FCCSP) Package Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Flip Chip CSP (FCCSP) Package Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Flip Chip CSP (FCCSP) Package 麻豆原创 Size by Country/Region (2020-2025)
4.2.1 Global Flip Chip CSP (FCCSP) Package Annual Sales by Country/Region (2020-2025)
4.2.2 Global Flip Chip CSP (FCCSP) Package Annual Revenue by Country/Region (2020-2025)
4.3 Americas Flip Chip CSP (FCCSP) Package Sales Growth
4.4 APAC Flip Chip CSP (FCCSP) Package Sales Growth
4.5 Europe Flip Chip CSP (FCCSP) Package Sales Growth
4.6 Middle East & Africa Flip Chip CSP (FCCSP) Package Sales Growth
5 Americas
5.1 Americas Flip Chip CSP (FCCSP) Package Sales by Country
5.1.1 Americas Flip Chip CSP (FCCSP) Package Sales by Country (2020-2025)
5.1.2 Americas Flip Chip CSP (FCCSP) Package Revenue by Country (2020-2025)
5.2 Americas Flip Chip CSP (FCCSP) Package Sales by Type (2020-2025)
5.3 Americas Flip Chip CSP (FCCSP) Package Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Flip Chip CSP (FCCSP) Package Sales by Region
6.1.1 APAC Flip Chip CSP (FCCSP) Package Sales by Region (2020-2025)
6.1.2 APAC Flip Chip CSP (FCCSP) Package Revenue by Region (2020-2025)
6.2 APAC Flip Chip CSP (FCCSP) Package Sales by Type (2020-2025)
6.3 APAC Flip Chip CSP (FCCSP) Package Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Flip Chip CSP (FCCSP) Package by Country
7.1.1 Europe Flip Chip CSP (FCCSP) Package Sales by Country (2020-2025)
7.1.2 Europe Flip Chip CSP (FCCSP) Package Revenue by Country (2020-2025)
7.2 Europe Flip Chip CSP (FCCSP) Package Sales by Type (2020-2025)
7.3 Europe Flip Chip CSP (FCCSP) Package Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Flip Chip CSP (FCCSP) Package by Country
8.1.1 Middle East & Africa Flip Chip CSP (FCCSP) Package Sales by Country (2020-2025)
8.1.2 Middle East & Africa Flip Chip CSP (FCCSP) Package Revenue by Country (2020-2025)
8.2 Middle East & Africa Flip Chip CSP (FCCSP) Package Sales by Type (2020-2025)
8.3 Middle East & Africa Flip Chip CSP (FCCSP) Package Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Flip Chip CSP (FCCSP) Package
10.3 Manufacturing Process Analysis of Flip Chip CSP (FCCSP) Package
10.4 Industry Chain Structure of Flip Chip CSP (FCCSP) Package
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Flip Chip CSP (FCCSP) Package Distributors
11.3 Flip Chip CSP (FCCSP) Package Customer
12 World Forecast Review for Flip Chip CSP (FCCSP) Package by Geographic Region
12.1 Global Flip Chip CSP (FCCSP) Package 麻豆原创 Size Forecast by Region
12.1.1 Global Flip Chip CSP (FCCSP) Package Forecast by Region (2026-2031)
12.1.2 Global Flip Chip CSP (FCCSP) Package Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Flip Chip CSP (FCCSP) Package Forecast by Type (2026-2031)
12.7 Global Flip Chip CSP (FCCSP) Package Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Amkor
13.1.1 Amkor Company Information
13.1.2 Amkor Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.1.3 Amkor Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Amkor Main Business Overview
13.1.5 Amkor Latest Developments
13.2 Taiwan Semiconductor Manufacturing
13.2.1 Taiwan Semiconductor Manufacturing Company Information
13.2.2 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.2.3 Taiwan Semiconductor Manufacturing Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Taiwan Semiconductor Manufacturing Main Business Overview
13.2.5 Taiwan Semiconductor Manufacturing Latest Developments
13.3 ASE Group
13.3.1 ASE Group Company Information
13.3.2 ASE Group Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.3.3 ASE Group Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 ASE Group Main Business Overview
13.3.5 ASE Group Latest Developments
13.4 Intel Corporation
13.4.1 Intel Corporation Company Information
13.4.2 Intel Corporation Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.4.3 Intel Corporation Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Intel Corporation Main Business Overview
13.4.5 Intel Corporation Latest Developments
13.5 JCET Group Co.,Ltd
13.5.1 JCET Group Co.,Ltd Company Information
13.5.2 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.5.3 JCET Group Co.,Ltd Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 JCET Group Co.,Ltd Main Business Overview
13.5.5 JCET Group Co.,Ltd Latest Developments
13.6 Samsung Group
13.6.1 Samsung Group Company Information
13.6.2 Samsung Group Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.6.3 Samsung Group Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Samsung Group Main Business Overview
13.6.5 Samsung Group Latest Developments
13.7 SPIL
13.7.1 SPIL Company Information
13.7.2 SPIL Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.7.3 SPIL Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 SPIL Main Business Overview
13.7.5 SPIL Latest Developments
13.8 Powertech Technology
13.8.1 Powertech Technology Company Information
13.8.2 Powertech Technology Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.8.3 Powertech Technology Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Powertech Technology Main Business Overview
13.8.5 Powertech Technology Latest Developments
13.9 Tongfu Microelectronics Co., Ltd
13.9.1 Tongfu Microelectronics Co., Ltd Company Information
13.9.2 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.9.3 Tongfu Microelectronics Co., Ltd Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Tongfu Microelectronics Co., Ltd Main Business Overview
13.9.5 Tongfu Microelectronics Co., Ltd Latest Developments
13.10 Tianshui Huatian Technology Co., Ltd
13.10.1 Tianshui Huatian Technology Co., Ltd Company Information
13.10.2 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.10.3 Tianshui Huatian Technology Co., Ltd Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Tianshui Huatian Technology Co., Ltd Main Business Overview
13.10.5 Tianshui Huatian Technology Co., Ltd Latest Developments
13.11 United Microelectronics
13.11.1 United Microelectronics Company Information
13.11.2 United Microelectronics Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.11.3 United Microelectronics Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 United Microelectronics Main Business Overview
13.11.5 United Microelectronics Latest Developments
13.12 SFA Semicon
13.12.1 SFA Semicon Company Information
13.12.2 SFA Semicon Flip Chip CSP (FCCSP) Package Product Portfolios and Specifications
13.12.3 SFA Semicon Flip Chip CSP (FCCSP) Package Sales, Revenue, Price and Gross Margin (2020-2025)
13.12.4 SFA Semicon Main Business Overview
13.12.5 SFA Semicon Latest Developments
14 Research Findings and Conclusion
听
听
*If Applicable.
