Global Epoxy Molding Compound (EMC) for Advanced Packaging 麻豆原创 Growth 2025-2031

Publication ID:

LPI07256488

Publication Date:

July 16, 2025

Pages:

125

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Manufacturing (Chemicals) [2]

Chemicals [3]

Description:

The global Epoxy Molding Compound (EMC) for Advanced Packaging market size is predicted to grow from US$ 677 million in 2025 to US$ 992 million in 2031; it is expected to grow at a CAGR of 6.6% from 2025 to 2031.
United States market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Epoxy Molding Compound (EMC) for Advanced Packaging is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Epoxy Molding Compound (EMC) for Advanced Packaging players cover Resonac, Eternal Materials, Panasonic, Sumitomo Bakelite, Kyocera, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
The 鈥淓poxy Molding Compound (EMC) for Advanced Packaging Industry Forecast鈥� looks at past sales and reviews total world Epoxy Molding Compound (EMC) for Advanced Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Epoxy Molding Compound (EMC) for Advanced Packaging sales for 2025 through 2031. With Epoxy Molding Compound (EMC) for Advanced Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Epoxy Molding Compound (EMC) for Advanced Packaging industry.
This Insight Report provides a comprehensive analysis of the global Epoxy Molding Compound (EMC) for Advanced Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Epoxy Molding Compound (EMC) for Advanced Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Epoxy Molding Compound (EMC) for Advanced Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Epoxy Molding Compound (EMC) for Advanced Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Epoxy Molding Compound (EMC) for Advanced Packaging.
This report presents a comprehensive overview, market shares, and growth opportunities of Epoxy Molding Compound (EMC) for Advanced Packaging market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Soild EMC
Liquid EMC
Segmentation by Application:
BGA
QFN
FOWLP/FOPLP
SiP
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Resonac
Eternal Materials
Panasonic
Sumitomo Bakelite
Kyocera
Samsung SDI
Hysol Huawei Electronics
Jiangsu HHCK Advanced Materials
Shanghai Doitech
Beijing Sinotech Electronic Material
KCC
Key Questions Addressed in this Report
What is the 10-year outlook for the global Epoxy Molding Compound (EMC) for Advanced Packaging market?
What factors are driving Epoxy Molding Compound (EMC) for Advanced Packaging market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Epoxy Molding Compound (EMC) for Advanced Packaging market opportunities vary by end market size?
How does Epoxy Molding Compound (EMC) for Advanced Packaging break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Sales 2020-2031
2.1.2 World Current & Future Analysis for Epoxy Molding Compound (EMC) for Advanced Packaging by Geographic Region, 2020, 2024 & 2031
2.1.3 World Current & Future Analysis for Epoxy Molding Compound (EMC) for Advanced Packaging by Country/Region, 2020, 2024 & 2031
2.2 Epoxy Molding Compound (EMC) for Advanced Packaging Segment by Type
2.2.1 Soild EMC
2.2.2 Liquid EMC
2.3 Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Type
2.3.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales 麻豆原创 Share by Type (2020-2025)
2.3.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Revenue and 麻豆原创 Share by Type (2020-2025)
2.3.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sale Price by Type (2020-2025)
2.4 Epoxy Molding Compound (EMC) for Advanced Packaging Segment by Application
2.4.1 BGA
2.4.2 QFN
2.4.3 FOWLP/FOPLP
2.4.4 SiP
2.5 Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Application
2.5.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sale 麻豆原创 Share by Application (2020-2025)
2.5.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Revenue and 麻豆原创 Share by Application (2020-2025)
2.5.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sale Price by Application (2020-2025)
3 Global by Company
3.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Breakdown Data by Company
3.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Sales by Company (2020-2025)
3.1.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sales 麻豆原创 Share by Company (2020-2025)
3.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Revenue by Company (2020-2025)
3.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Revenue by Company (2020-2025)
3.2.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Revenue 麻豆原创 Share by Company (2020-2025)
3.3 Global Epoxy Molding Compound (EMC) for Advanced Packaging Sale Price by Company
3.4 Key Manufacturers Epoxy Molding Compound (EMC) for Advanced Packaging Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Epoxy Molding Compound (EMC) for Advanced Packaging Product Location Distribution
3.4.2 Players Epoxy Molding Compound (EMC) for Advanced Packaging Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for Epoxy Molding Compound (EMC) for Advanced Packaging by Geographic Region
4.1 World Historic Epoxy Molding Compound (EMC) for Advanced Packaging 麻豆原创 Size by Geographic Region (2020-2025)
4.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Sales by Geographic Region (2020-2025)
4.1.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Revenue by Geographic Region (2020-2025)
4.2 World Historic Epoxy Molding Compound (EMC) for Advanced Packaging 麻豆原创 Size by Country/Region (2020-2025)
4.2.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Sales by Country/Region (2020-2025)
4.2.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Revenue by Country/Region (2020-2025)
4.3 Americas Epoxy Molding Compound (EMC) for Advanced Packaging Sales Growth
4.4 APAC Epoxy Molding Compound (EMC) for Advanced Packaging Sales Growth
4.5 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales Growth
4.6 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales Growth
5 Americas
5.1 Americas Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Country
5.1.1 Americas Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Country (2020-2025)
5.1.2 Americas Epoxy Molding Compound (EMC) for Advanced Packaging Revenue by Country (2020-2025)
5.2 Americas Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Type (2020-2025)
5.3 Americas Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Region
6.1.1 APAC Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Region (2020-2025)
6.1.2 APAC Epoxy Molding Compound (EMC) for Advanced Packaging Revenue by Region (2020-2025)
6.2 APAC Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Type (2020-2025)
6.3 APAC Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Epoxy Molding Compound (EMC) for Advanced Packaging by Country
7.1.1 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Country (2020-2025)
7.1.2 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Revenue by Country (2020-2025)
7.2 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Type (2020-2025)
7.3 Europe Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging by Country
8.1.1 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Country (2020-2025)
8.1.2 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Revenue by Country (2020-2025)
8.2 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Type (2020-2025)
8.3 Middle East & Africa Epoxy Molding Compound (EMC) for Advanced Packaging Sales by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Epoxy Molding Compound (EMC) for Advanced Packaging
10.3 Manufacturing Process Analysis of Epoxy Molding Compound (EMC) for Advanced Packaging
10.4 Industry Chain Structure of Epoxy Molding Compound (EMC) for Advanced Packaging
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Epoxy Molding Compound (EMC) for Advanced Packaging Distributors
11.3 Epoxy Molding Compound (EMC) for Advanced Packaging Customer
12 World Forecast Review for Epoxy Molding Compound (EMC) for Advanced Packaging by Geographic Region
12.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging 麻豆原创 Size Forecast by Region
12.1.1 Global Epoxy Molding Compound (EMC) for Advanced Packaging Forecast by Region (2026-2031)
12.1.2 Global Epoxy Molding Compound (EMC) for Advanced Packaging Annual Revenue Forecast by Region (2026-2031)
12.2 Americas Forecast by Country (2026-2031)
12.3 APAC Forecast by Region (2026-2031)
12.4 Europe Forecast by Country (2026-2031)
12.5 Middle East & Africa Forecast by Country (2026-2031)
12.6 Global Epoxy Molding Compound (EMC) for Advanced Packaging Forecast by Type (2026-2031)
12.7 Global Epoxy Molding Compound (EMC) for Advanced Packaging Forecast by Application (2026-2031)
13 Key Players Analysis
13.1 Resonac
13.1.1 Resonac Company Information
13.1.2 Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.1.3 Resonac Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.1.4 Resonac Main Business Overview
13.1.5 Resonac Latest Developments
13.2 Eternal Materials
13.2.1 Eternal Materials Company Information
13.2.2 Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.2.3 Eternal Materials Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.2.4 Eternal Materials Main Business Overview
13.2.5 Eternal Materials Latest Developments
13.3 Panasonic
13.3.1 Panasonic Company Information
13.3.2 Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.3.3 Panasonic Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.3.4 Panasonic Main Business Overview
13.3.5 Panasonic Latest Developments
13.4 Sumitomo Bakelite
13.4.1 Sumitomo Bakelite Company Information
13.4.2 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.4.3 Sumitomo Bakelite Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.4.4 Sumitomo Bakelite Main Business Overview
13.4.5 Sumitomo Bakelite Latest Developments
13.5 Kyocera
13.5.1 Kyocera Company Information
13.5.2 Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.5.3 Kyocera Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.5.4 Kyocera Main Business Overview
13.5.5 Kyocera Latest Developments
13.6 Samsung SDI
13.6.1 Samsung SDI Company Information
13.6.2 Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.6.3 Samsung SDI Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.6.4 Samsung SDI Main Business Overview
13.6.5 Samsung SDI Latest Developments
13.7 Hysol Huawei Electronics
13.7.1 Hysol Huawei Electronics Company Information
13.7.2 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.7.3 Hysol Huawei Electronics Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.7.4 Hysol Huawei Electronics Main Business Overview
13.7.5 Hysol Huawei Electronics Latest Developments
13.8 Jiangsu HHCK Advanced Materials
13.8.1 Jiangsu HHCK Advanced Materials Company Information
13.8.2 Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.8.3 Jiangsu HHCK Advanced Materials Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.8.4 Jiangsu HHCK Advanced Materials Main Business Overview
13.8.5 Jiangsu HHCK Advanced Materials Latest Developments
13.9 Shanghai Doitech
13.9.1 Shanghai Doitech Company Information
13.9.2 Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.9.3 Shanghai Doitech Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.9.4 Shanghai Doitech Main Business Overview
13.9.5 Shanghai Doitech Latest Developments
13.10 Beijing Sinotech Electronic Material
13.10.1 Beijing Sinotech Electronic Material Company Information
13.10.2 Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.10.3 Beijing Sinotech Electronic Material Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.10.4 Beijing Sinotech Electronic Material Main Business Overview
13.10.5 Beijing Sinotech Electronic Material Latest Developments
13.11 KCC
13.11.1 KCC Company Information
13.11.2 KCC Epoxy Molding Compound (EMC) for Advanced Packaging Product Portfolios and Specifications
13.11.3 KCC Epoxy Molding Compound (EMC) for Advanced Packaging Sales, Revenue, Price and Gross Margin (2020-2025)
13.11.4 KCC Main Business Overview
13.11.5 KCC Latest Developments
14 Research Findings and Conclusion

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