Global Electroless Plating Solutions for Package Substrate 麻豆原创 Growth (Status and Outlook) 2024-2030

Publication ID:

LPI05242765

Publication Date:

June 7, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global Electroless Plating Solutions for Package Substrate market size is projected to grow from US$ 194 million in 2024 to US$ 309 million in 2030; it is expected to grow at a CAGR of 8.1% from 2024 to 2030.
The 鈥淓lectroless Plating Solutions for Package Substrate Industry Forecast鈥� looks at past sales and reviews total world Electroless Plating Solutions for Package Substrate sales in 2022, providing a comprehensive analysis by region and market sector of projected Electroless Plating Solutions for Package Substrate sales for 2023 through 2029. With Electroless Plating Solutions for Package Substrate sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Electroless Plating Solutions for Package Substrate industry.
This Insight Report provides a comprehensive analysis of the global Electroless Plating Solutions for Package Substrate landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Electroless Plating Solutions for Package Substrate portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Electroless Plating Solutions for Package Substrate market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Electroless Plating Solutions for Package Substrate and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Electroless Plating Solutions for Package Substrate.
Chemical plating solutions for packaging substrates mainly include electroless nickel plating solutions, chemical palladium plating solutions, chemical gold plating solutions, chemical copper plating solutions, chemical tin plating solutions, degreasing, activation, etc. Among them, the ENEPIG solution can form a nickel-palladium-gold three-layer structure on the lead frame and the pad of the packaging substrate to improve the welding reliability under lead-free solder and prevent failure caused by sulfides.
In the field of IC packaging substrates, the chemical plating solution market is mainly monopolized by the top 1/2 companies. The main reason is that in the field of chemical surface treatment solutions, they are basically designated suppliers. Globally, the TOP5 companies are Uemura, Atotech, Dow Electronic Materials (DuPont), Tanaka, and YMT, with a market share of over 82%.
This report presents a comprehensive overview, market shares, and growth opportunities of Electroless Plating Solutions for Package Substrate market by product type, application, key players and key regions and countries.
Segmentation by Type:
ENEPIG
ENIG
Others
Segmentation by Application:
FC Package Substrate
WB Package Substrate
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Segmentation by Type:
ENEPIG
ENIG
Others
Segmentation by Application:
FC Package Substrate
WB Package Substrate
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
C. Uyemura & Co
Atotech (MKS)
DOW Electronic Materials (Dupont)
TANAKA
YMT
MK Chem & Tech Co., Ltd
Shenzhen Yicheng Electronic
KPM Tech Vina
OKUNO Chemical Industries

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Electroless Plating Solutions for Package Substrate 麻豆原创 Size 2019-2030
2.1.2 Electroless Plating Solutions for Package Substrate 麻豆原创 Size CAGR by Region (2019 VS 2023 VS 2030)
2.1.3 World Current & Future Analysis for Electroless Plating Solutions for Package Substrate by Country/Region, 2019, 2023 & 2030
2.2 Electroless Plating Solutions for Package Substrate Segment by Type
2.2.1 ENEPIG
2.2.2 ENIG
2.2.3 Others
2.3 Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Type
2.3.1 Electroless Plating Solutions for Package Substrate 麻豆原创 Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Electroless Plating Solutions for Package Substrate 麻豆原创 Size 麻豆原创 Share by Type (2019-2024)
2.4 Electroless Plating Solutions for Package Substrate Segment by Application
2.4.1 FC Package Substrate
2.4.2 WB Package Substrate
2.5 Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Application
2.5.1 Electroless Plating Solutions for Package Substrate 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Electroless Plating Solutions for Package Substrate 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Player
3.1 Electroless Plating Solutions for Package Substrate 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Electroless Plating Solutions for Package Substrate Revenue by Player (2019-2024)
3.1.2 Global Electroless Plating Solutions for Package Substrate Revenue 麻豆原创 Share by Player (2019-2024)
3.2 Global Electroless Plating Solutions for Package Substrate Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Electroless Plating Solutions for Package Substrate by Region
4.1 Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Region (2019-2024)
4.2 Global Electroless Plating Solutions for Package Substrate Annual Revenue by Country/Region (2019-2024)
4.3 Americas Electroless Plating Solutions for Package Substrate 麻豆原创 Size Growth (2019-2024)
4.4 APAC Electroless Plating Solutions for Package Substrate 麻豆原创 Size Growth (2019-2024)
4.5 Europe Electroless Plating Solutions for Package Substrate 麻豆原创 Size Growth (2019-2024)
4.6 Middle East & Africa Electroless Plating Solutions for Package Substrate 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Country (2019-2024)
5.2 Americas Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Type (2019-2024)
5.3 Americas Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Region (2019-2024)
6.2 APAC Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Type (2019-2024)
6.3 APAC Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Country (2019-2024)
7.2 Europe Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Type (2019-2024)
7.3 Europe Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Electroless Plating Solutions for Package Substrate by Region (2019-2024)
8.2 Middle East & Africa Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Type (2019-2024)
8.3 Middle East & Africa Electroless Plating Solutions for Package Substrate 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Electroless Plating Solutions for Package Substrate 麻豆原创 Forecast
10.1 Global Electroless Plating Solutions for Package Substrate Forecast by Region (2025-2030)
10.1.1 Global Electroless Plating Solutions for Package Substrate Forecast by Region (2025-2030)
10.1.2 Americas Electroless Plating Solutions for Package Substrate Forecast
10.1.3 APAC Electroless Plating Solutions for Package Substrate Forecast
10.1.4 Europe Electroless Plating Solutions for Package Substrate Forecast
10.1.5 Middle East & Africa Electroless Plating Solutions for Package Substrate Forecast
10.2 Americas Electroless Plating Solutions for Package Substrate Forecast by Country (2025-2030)
10.2.1 United States 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.2.2 Canada 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.2.3 Mexico 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.2.4 Brazil 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.3 APAC Electroless Plating Solutions for Package Substrate Forecast by Region (2025-2030)
10.3.1 China Electroless Plating Solutions for Package Substrate 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.3.3 Korea 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.3.4 Southeast Asia 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.3.5 India 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.3.6 Australia 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.4 Europe Electroless Plating Solutions for Package Substrate Forecast by Country (2025-2030)
10.4.1 Germany 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.4.2 France 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.4.3 UK 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.4.4 Italy 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.4.5 Russia 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.5 Middle East & Africa Electroless Plating Solutions for Package Substrate Forecast by Region (2025-2030)
10.5.1 Egypt 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.5.2 South Africa 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.5.3 Israel 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.5.4 Turkey 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
10.6 Global Electroless Plating Solutions for Package Substrate Forecast by Type (2025-2030)
10.7 Global Electroless Plating Solutions for Package Substrate Forecast by Application (2025-2030)
10.7.1 GCC Countries 麻豆原创 Electroless Plating Solutions for Package Substrate Forecast
11 Key Players Analysis
11.1 C. Uyemura & Co
11.1.1 C. Uyemura & Co Company Information
11.1.2 C. Uyemura & Co Electroless Plating Solutions for Package Substrate Product Offered
11.1.3 C. Uyemura & Co Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 C. Uyemura & Co Main Business Overview
11.1.5 C. Uyemura & Co Latest Developments
11.2 Atotech (MKS)
11.2.1 Atotech (MKS) Company Information
11.2.2 Atotech (MKS) Electroless Plating Solutions for Package Substrate Product Offered
11.2.3 Atotech (MKS) Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 Atotech (MKS) Main Business Overview
11.2.5 Atotech (MKS) Latest Developments
11.3 DOW Electronic Materials (Dupont)
11.3.1 DOW Electronic Materials (Dupont) Company Information
11.3.2 DOW Electronic Materials (Dupont) Electroless Plating Solutions for Package Substrate Product Offered
11.3.3 DOW Electronic Materials (Dupont) Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 DOW Electronic Materials (Dupont) Main Business Overview
11.3.5 DOW Electronic Materials (Dupont) Latest Developments
11.4 TANAKA
11.4.1 TANAKA Company Information
11.4.2 TANAKA Electroless Plating Solutions for Package Substrate Product Offered
11.4.3 TANAKA Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 TANAKA Main Business Overview
11.4.5 TANAKA Latest Developments
11.5 YMT
11.5.1 YMT Company Information
11.5.2 YMT Electroless Plating Solutions for Package Substrate Product Offered
11.5.3 YMT Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 YMT Main Business Overview
11.5.5 YMT Latest Developments
11.6 MK Chem & Tech Co., Ltd
11.6.1 MK Chem & Tech Co., Ltd Company Information
11.6.2 MK Chem & Tech Co., Ltd Electroless Plating Solutions for Package Substrate Product Offered
11.6.3 MK Chem & Tech Co., Ltd Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 MK Chem & Tech Co., Ltd Main Business Overview
11.6.5 MK Chem & Tech Co., Ltd Latest Developments
11.7 Shenzhen Yicheng Electronic
11.7.1 Shenzhen Yicheng Electronic Company Information
11.7.2 Shenzhen Yicheng Electronic Electroless Plating Solutions for Package Substrate Product Offered
11.7.3 Shenzhen Yicheng Electronic Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.7.4 Shenzhen Yicheng Electronic Main Business Overview
11.7.5 Shenzhen Yicheng Electronic Latest Developments
11.8 KPM Tech Vina
11.8.1 KPM Tech Vina Company Information
11.8.2 KPM Tech Vina Electroless Plating Solutions for Package Substrate Product Offered
11.8.3 KPM Tech Vina Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.8.4 KPM Tech Vina Main Business Overview
11.8.5 KPM Tech Vina Latest Developments
11.9 OKUNO Chemical Industries
11.9.1 OKUNO Chemical Industries Company Information
11.9.2 OKUNO Chemical Industries Electroless Plating Solutions for Package Substrate Product Offered
11.9.3 OKUNO Chemical Industries Electroless Plating Solutions for Package Substrate Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.9.4 OKUNO Chemical Industries Main Business Overview
11.9.5 OKUNO Chemical Industries Latest Developments
12 Research Findings and Conclusion

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