Global Circuit Board Heat Sink 麻豆原创 Growth 2024-2030

Publication ID:

LPI05243385

Publication Date:

June 10, 2024

Pages:

115

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

A circuit board heat sink is a cooling device attached to the circuit boards of electronic equipment and computers. They are used to stabilize circuit operation by dissipating heat generated by electronic and electrical components mounted on printed circuit boards. Semiconductor components in various circuits tend to generate large amounts of heat when large drive power is required.
With the evolution of semiconductor processes, large-scale integrated circuits have been realized in extremely small sizes. In devices that realize such complex and advanced functions and performance, the amount of heat generated is also often large. To reduce the amount of heat generated, various efforts are being made on the semiconductor device side to reduce power consumption. However, in most cases, heat sinks are required to maintain stable operation when used in various environments.
The global Circuit Board Heat Sink market size is projected to grow from US$ million in 2024 to US$ million in 2030; it is expected to grow at a CAGR of %from 2024 to 2030.
The 鈥淐ircuit Board Heat Sink Industry Forecast鈥� looks at past sales and reviews total world Circuit Board Heat Sink sales in 2023, providing a comprehensive analysis by region and market sector of projected Circuit Board Heat Sink sales for 2024 through 2030. With Circuit Board Heat Sink sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Circuit Board Heat Sink industry.
This Insight Report provides a comprehensive analysis of the global Circuit Board Heat Sink landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on Circuit Board Heat Sink portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Circuit Board Heat Sink market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Circuit Board Heat Sink and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Circuit Board Heat Sink.
United States market for Circuit Board Heat Sink is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
China market for Circuit Board Heat Sink is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Europe market for Circuit Board Heat Sink is estimated to increase from US$ million in 2023 to US$ million by 2030, at a CAGR of % from 2024 through 2030.
Global key Circuit Board Heat Sink players cover Nishimura Advanced Ceramics, Millennium Circuits Limited, Epec, A.L.M.T. Corp., Nippon Electric Glass, etc. In terms of revenue, the global two largest companies occupied for a share nearly
% in 2023.
This report presents a comprehensive overview, market shares, and growth opportunities of Circuit Board Heat Sink market by product type, application, key manufacturers and key regions and countries.
Segmentation by Type:
Natural Air Cooling
Forced Air Cooling
Segmentation by Application:
Industrial Equipment
Consumer Electronics
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analysing the company's coverage, product portfolio, its market penetration.
Nishimura Advanced Ceramics
Millennium Circuits Limited
Epec
A.L.M.T. Corp.
Nippon Electric Glass
Resonac Holdings Corporation
RayMing Technology
Himalay Engineering
PW Circuits Ltd
Zaward Corporation
db Electronic
TAKAGI MFG.CO.,LTD.
Key Questions Addressed in this Report
What is the 10-year outlook for the global Circuit Board Heat Sink market?
What factors are driving Circuit Board Heat Sink market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do Circuit Board Heat Sink market opportunities vary by end market size?
How does Circuit Board Heat Sink break out by Type, by Application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Circuit Board Heat Sink Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for Circuit Board Heat Sink by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for Circuit Board Heat Sink by Country/Region, 2019, 2023 & 2030
2.2 Circuit Board Heat Sink Segment by Type
2.2.1 Natural Air Cooling
2.2.2 Forced Air Cooling
2.3 Circuit Board Heat Sink Sales by Type
2.3.1 Global Circuit Board Heat Sink Sales 麻豆原创 Share by Type (2019-2024)
2.3.2 Global Circuit Board Heat Sink Revenue and 麻豆原创 Share by Type (2019-2024)
2.3.3 Global Circuit Board Heat Sink Sale Price by Type (2019-2024)
2.4 Circuit Board Heat Sink Segment by Application
2.4.1 Industrial Equipment
2.4.2 Consumer Electronics
2.4.3 Others
2.5 Circuit Board Heat Sink Sales by Application
2.5.1 Global Circuit Board Heat Sink Sale 麻豆原创 Share by Application (2019-2024)
2.5.2 Global Circuit Board Heat Sink Revenue and 麻豆原创 Share by Application (2019-2024)
2.5.3 Global Circuit Board Heat Sink Sale Price by Application (2019-2024)
3 Global by Company
3.1 Global Circuit Board Heat Sink Breakdown Data by Company
3.1.1 Global Circuit Board Heat Sink Annual Sales by Company (2019-2024)
3.1.2 Global Circuit Board Heat Sink Sales 麻豆原创 Share by Company (2019-2024)
3.2 Global Circuit Board Heat Sink Annual Revenue by Company (2019-2024)
3.2.1 Global Circuit Board Heat Sink Revenue by Company (2019-2024)
3.2.2 Global Circuit Board Heat Sink Revenue 麻豆原创 Share by Company (2019-2024)
3.3 Global Circuit Board Heat Sink Sale Price by Company
3.4 Key Manufacturers Circuit Board Heat Sink Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers Circuit Board Heat Sink Product Location Distribution
3.4.2 Players Circuit Board Heat Sink Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 麻豆原创 M&A Activity & Strategy
4 World Historic Review for Circuit Board Heat Sink by Geographic Region
4.1 World Historic Circuit Board Heat Sink 麻豆原创 Size by Geographic Region (2019-2024)
4.1.1 Global Circuit Board Heat Sink Annual Sales by Geographic Region (2019-2024)
4.1.2 Global Circuit Board Heat Sink Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic Circuit Board Heat Sink 麻豆原创 Size by Country/Region (2019-2024)
4.2.1 Global Circuit Board Heat Sink Annual Sales by Country/Region (2019-2024)
4.2.2 Global Circuit Board Heat Sink Annual Revenue by Country/Region (2019-2024)
4.3 Americas Circuit Board Heat Sink Sales Growth
4.4 APAC Circuit Board Heat Sink Sales Growth
4.5 Europe Circuit Board Heat Sink Sales Growth
4.6 Middle East & Africa Circuit Board Heat Sink Sales Growth
5 Americas
5.1 Americas Circuit Board Heat Sink Sales by Country
5.1.1 Americas Circuit Board Heat Sink Sales by Country (2019-2024)
5.1.2 Americas Circuit Board Heat Sink Revenue by Country (2019-2024)
5.2 Americas Circuit Board Heat Sink Sales by Type (2019-2024)
5.3 Americas Circuit Board Heat Sink Sales by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Circuit Board Heat Sink Sales by Region
6.1.1 APAC Circuit Board Heat Sink Sales by Region (2019-2024)
6.1.2 APAC Circuit Board Heat Sink Revenue by Region (2019-2024)
6.2 APAC Circuit Board Heat Sink Sales by Type (2019-2024)
6.3 APAC Circuit Board Heat Sink Sales by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe Circuit Board Heat Sink by Country
7.1.1 Europe Circuit Board Heat Sink Sales by Country (2019-2024)
7.1.2 Europe Circuit Board Heat Sink Revenue by Country (2019-2024)
7.2 Europe Circuit Board Heat Sink Sales by Type (2019-2024)
7.3 Europe Circuit Board Heat Sink Sales by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Circuit Board Heat Sink by Country
8.1.1 Middle East & Africa Circuit Board Heat Sink Sales by Country (2019-2024)
8.1.2 Middle East & Africa Circuit Board Heat Sink Revenue by Country (2019-2024)
8.2 Middle East & Africa Circuit Board Heat Sink Sales by Type (2019-2024)
8.3 Middle East & Africa Circuit Board Heat Sink Sales by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of Circuit Board Heat Sink
10.3 Manufacturing Process Analysis of Circuit Board Heat Sink
10.4 Industry Chain Structure of Circuit Board Heat Sink
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 Circuit Board Heat Sink Distributors
11.3 Circuit Board Heat Sink Customer
12 World Forecast Review for Circuit Board Heat Sink by Geographic Region
12.1 Global Circuit Board Heat Sink 麻豆原创 Size Forecast by Region
12.1.1 Global Circuit Board Heat Sink Forecast by Region (2025-2030)
12.1.2 Global Circuit Board Heat Sink Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country (2025-2030)
12.3 APAC Forecast by Region (2025-2030)
12.4 Europe Forecast by Country (2025-2030)
12.5 Middle East & Africa Forecast by Country (2025-2030)
12.6 Global Circuit Board Heat Sink Forecast by Type (2025-2030)
12.7 Global Circuit Board Heat Sink Forecast by Application (2025-2030)
13 Key Players Analysis
13.1 Nishimura Advanced Ceramics
13.1.1 Nishimura Advanced Ceramics Company Information
13.1.2 Nishimura Advanced Ceramics Circuit Board Heat Sink Product Portfolios and Specifications
13.1.3 Nishimura Advanced Ceramics Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Nishimura Advanced Ceramics Main Business Overview
13.1.5 Nishimura Advanced Ceramics Latest Developments
13.2 Millennium Circuits Limited
13.2.1 Millennium Circuits Limited Company Information
13.2.2 Millennium Circuits Limited Circuit Board Heat Sink Product Portfolios and Specifications
13.2.3 Millennium Circuits Limited Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Millennium Circuits Limited Main Business Overview
13.2.5 Millennium Circuits Limited Latest Developments
13.3 Epec
13.3.1 Epec Company Information
13.3.2 Epec Circuit Board Heat Sink Product Portfolios and Specifications
13.3.3 Epec Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Epec Main Business Overview
13.3.5 Epec Latest Developments
13.4 A.L.M.T. Corp.
13.4.1 A.L.M.T. Corp. Company Information
13.4.2 A.L.M.T. Corp. Circuit Board Heat Sink Product Portfolios and Specifications
13.4.3 A.L.M.T. Corp. Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 A.L.M.T. Corp. Main Business Overview
13.4.5 A.L.M.T. Corp. Latest Developments
13.5 Nippon Electric Glass
13.5.1 Nippon Electric Glass Company Information
13.5.2 Nippon Electric Glass Circuit Board Heat Sink Product Portfolios and Specifications
13.5.3 Nippon Electric Glass Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Nippon Electric Glass Main Business Overview
13.5.5 Nippon Electric Glass Latest Developments
13.6 Resonac Holdings Corporation
13.6.1 Resonac Holdings Corporation Company Information
13.6.2 Resonac Holdings Corporation Circuit Board Heat Sink Product Portfolios and Specifications
13.6.3 Resonac Holdings Corporation Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Resonac Holdings Corporation Main Business Overview
13.6.5 Resonac Holdings Corporation Latest Developments
13.7 RayMing Technology
13.7.1 RayMing Technology Company Information
13.7.2 RayMing Technology Circuit Board Heat Sink Product Portfolios and Specifications
13.7.3 RayMing Technology Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 RayMing Technology Main Business Overview
13.7.5 RayMing Technology Latest Developments
13.8 Himalay Engineering
13.8.1 Himalay Engineering Company Information
13.8.2 Himalay Engineering Circuit Board Heat Sink Product Portfolios and Specifications
13.8.3 Himalay Engineering Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Himalay Engineering Main Business Overview
13.8.5 Himalay Engineering Latest Developments
13.9 PW Circuits Ltd
13.9.1 PW Circuits Ltd Company Information
13.9.2 PW Circuits Ltd Circuit Board Heat Sink Product Portfolios and Specifications
13.9.3 PW Circuits Ltd Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 PW Circuits Ltd Main Business Overview
13.9.5 PW Circuits Ltd Latest Developments
13.10 Zaward Corporation
13.10.1 Zaward Corporation Company Information
13.10.2 Zaward Corporation Circuit Board Heat Sink Product Portfolios and Specifications
13.10.3 Zaward Corporation Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Zaward Corporation Main Business Overview
13.10.5 Zaward Corporation Latest Developments
13.11 db Electronic
13.11.1 db Electronic Company Information
13.11.2 db Electronic Circuit Board Heat Sink Product Portfolios and Specifications
13.11.3 db Electronic Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.11.4 db Electronic Main Business Overview
13.11.5 db Electronic Latest Developments
13.12 TAKAGI MFG.CO.,LTD.
13.12.1 TAKAGI MFG.CO.,LTD. Company Information
13.12.2 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Product Portfolios and Specifications
13.12.3 TAKAGI MFG.CO.,LTD. Circuit Board Heat Sink Sales, Revenue, Price and Gross Margin (2019-2024)
13.12.4 TAKAGI MFG.CO.,LTD. Main Business Overview
13.12.5 TAKAGI MFG.CO.,LTD. Latest Developments
14 Research Findings and Conclusion

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