The global Chip Packaging market size is predicted to grow from US$ 34530 million in 2025 to US$ 51080 million in 2031; it is expected to grow at a CAGR of 6.7% from 2025 to 2031.
Installation of semiconductor integrated circuit chips with shell, plays a put, fixed, sealing, protection chip and enhance the effect of electrical performance, and is the communication bridge of the internal and external circuit chip, chip the contacts with wire is connected to the encapsulation of the shell on the pin of the pins and wires on the PCB and other devices connected. Therefore, encapsulation plays an important role for both CPUs and other LSI integrated circuits. Chip packaging technology has experienced several generations of changes, from DIP, QFP, PGA, BGA, to CSP and then to MCM, technical indicators generation by generation advanced, including chip area and packaging area ratio is more and more close to 1, the application frequency is more and more high, temperature performance is better and better. The number of pins is increased, the pin spacing is reduced, the weight is reduced, the reliability is improved, the use is more convenient and so on
The global chip package market reached $25,007.3 million in 2019 and is expected to reach $35,419.2 million in 2026, with a compound annual growth rate (CAGR) of 6.72%.
By type breakdown, all markets for chip packages can be divided into the following categories:
The first category is mainly traditional packaging, which occupies a relatively large share of the global market, accounting for about 56%.
The other major category is advanced packaging, and for many companies, advanced packaging technology is very attractive, advanced packaging workers. Technology is at the heart of all semiconductor manufacturing processes today. For all semiconductor companies, advanced packaging technology is responding to the direct impact of big trends such as 5G, artificial intelligence and the Internet of Things. Advanced packaging occupies 45% of the market share.
From the regional point of view, Taiwan market output market share is larger, the market accounted for 44%, the next few years will maintain a stable growth. China and the US, with 34 per cent and 11 per cent of the output market respectively, will continue to play a significant role. Any change in China, Taiwan may affect the development trend of chip packaging.
The chip packaging market consists of a group of well-known brand manufacturers and new entrants. The leading global players in the chip packaging market are ASE Group, Amkor Technology, JCET, SPIL,Powertech Technology, Tong Fu Micro Power, Tianshui Huatian Technology, UTAC, Chipbond Technology, Hana Micron and so on. These top 10 companies now account for more than 78% of the total market share.
The 鈥淐hip Packaging Industry Forecast鈥 looks at past sales and reviews total world Chip Packaging sales in 2024, providing a comprehensive analysis by region and market sector of projected Chip Packaging sales for 2025 through 2031. With Chip Packaging sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip Packaging industry.
This Insight Report provides a comprehensive analysis of the global Chip Packaging landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Chip Packaging portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥 unique position in an accelerating global Chip Packaging market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip Packaging and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip Packaging.
This report presents a comprehensive overview, market shares, and growth opportunities of Chip Packaging market by product type, application, key players and key regions and countries.
Segmentation by Type:
Traditional Packaging
Advanced Packaging
Segmentation by Application:
Automotive and Traffic
Consumer Electronics
Communication
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
ASE Group
Amkor Technology
JCET
Siliconware Precision Industries
Powertech Technology
TongFu Microelectronics
Tianshui Huatian Technology
UTAC
Chipbond Technology
Hana Micron
OSE
Walton Advanced Engineering
NEPES
Unisem
ChipMOS
Signetics
Carsem
King Yuan ELECTRONICS
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Chip Packaging 麻豆原创 Size (2020-2031)
2.1.2 Chip Packaging 麻豆原创 Size CAGR by Region (2020 VS 2024 VS 2031)
2.1.3 World Current & Future Analysis for Chip Packaging by Country/Region (2020, 2024 & 2031)
2.2 Chip Packaging Segment by Type
2.2.1 Traditional Packaging
2.2.2 Advanced Packaging
2.3 Chip Packaging 麻豆原创 Size by Type
2.3.1 Chip Packaging 麻豆原创 Size CAGR by Type (2020 VS 2024 VS 2031)
2.3.2 Global Chip Packaging 麻豆原创 Size 麻豆原创 Share by Type (2020-2025)
2.4 Chip Packaging Segment by Application
2.4.1 Automotive and Traffic
2.4.2 Consumer Electronics
2.4.3 Communication
2.4.4 Other
2.5 Chip Packaging 麻豆原创 Size by Application
2.5.1 Chip Packaging 麻豆原创 Size CAGR by Application (2020 VS 2024 VS 2031)
2.5.2 Global Chip Packaging 麻豆原创 Size 麻豆原创 Share by Application (2020-2025)
3 Chip Packaging 麻豆原创 Size by Player
3.1 Chip Packaging 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Chip Packaging Revenue by Player (2020-2025)
3.1.2 Global Chip Packaging Revenue 麻豆原创 Share by Player (2020-2025)
3.2 Global Chip Packaging Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Chip Packaging by Region
4.1 Chip Packaging 麻豆原创 Size by Region (2020-2025)
4.2 Global Chip Packaging Annual Revenue by Country/Region (2020-2025)
4.3 Americas Chip Packaging 麻豆原创 Size Growth (2020-2025)
4.4 APAC Chip Packaging 麻豆原创 Size Growth (2020-2025)
4.5 Europe Chip Packaging 麻豆原创 Size Growth (2020-2025)
4.6 Middle East & Africa Chip Packaging 麻豆原创 Size Growth (2020-2025)
5 Americas
5.1 Americas Chip Packaging 麻豆原创 Size by Country (2020-2025)
5.2 Americas Chip Packaging 麻豆原创 Size by Type (2020-2025)
5.3 Americas Chip Packaging 麻豆原创 Size by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Chip Packaging 麻豆原创 Size by Region (2020-2025)
6.2 APAC Chip Packaging 麻豆原创 Size by Type (2020-2025)
6.3 APAC Chip Packaging 麻豆原创 Size by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Chip Packaging 麻豆原创 Size by Country (2020-2025)
7.2 Europe Chip Packaging 麻豆原创 Size by Type (2020-2025)
7.3 Europe Chip Packaging 麻豆原创 Size by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Chip Packaging by Region (2020-2025)
8.2 Middle East & Africa Chip Packaging 麻豆原创 Size by Type (2020-2025)
8.3 Middle East & Africa Chip Packaging 麻豆原创 Size by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Chip Packaging 麻豆原创 Forecast
10.1 Global Chip Packaging Forecast by Region (2026-2031)
10.1.1 Global Chip Packaging Forecast by Region (2026-2031)
10.1.2 Americas Chip Packaging Forecast
10.1.3 APAC Chip Packaging Forecast
10.1.4 Europe Chip Packaging Forecast
10.1.5 Middle East & Africa Chip Packaging Forecast
10.2 Americas Chip Packaging Forecast by Country (2026-2031)
10.2.1 United States 麻豆原创 Chip Packaging Forecast
10.2.2 Canada 麻豆原创 Chip Packaging Forecast
10.2.3 Mexico 麻豆原创 Chip Packaging Forecast
10.2.4 Brazil 麻豆原创 Chip Packaging Forecast
10.3 APAC Chip Packaging Forecast by Region (2026-2031)
10.3.1 China Chip Packaging 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Chip Packaging Forecast
10.3.3 Korea 麻豆原创 Chip Packaging Forecast
10.3.4 Southeast Asia 麻豆原创 Chip Packaging Forecast
10.3.5 India 麻豆原创 Chip Packaging Forecast
10.3.6 Australia 麻豆原创 Chip Packaging Forecast
10.4 Europe Chip Packaging Forecast by Country (2026-2031)
10.4.1 Germany 麻豆原创 Chip Packaging Forecast
10.4.2 France 麻豆原创 Chip Packaging Forecast
10.4.3 UK 麻豆原创 Chip Packaging Forecast
10.4.4 Italy 麻豆原创 Chip Packaging Forecast
10.4.5 Russia 麻豆原创 Chip Packaging Forecast
10.5 Middle East & Africa Chip Packaging Forecast by Region (2026-2031)
10.5.1 Egypt 麻豆原创 Chip Packaging Forecast
10.5.2 South Africa 麻豆原创 Chip Packaging Forecast
10.5.3 Israel 麻豆原创 Chip Packaging Forecast
10.5.4 Turkey 麻豆原创 Chip Packaging Forecast
10.6 Global Chip Packaging Forecast by Type (2026-2031)
10.7 Global Chip Packaging Forecast by Application (2026-2031)
10.7.1 GCC Countries 麻豆原创 Chip Packaging Forecast
11 Key Players Analysis
11.1 ASE Group
11.1.1 ASE Group Company Information
11.1.2 ASE Group Chip Packaging Product Offered
11.1.3 ASE Group Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.1.4 ASE Group Main Business Overview
11.1.5 ASE Group Latest Developments
11.2 Amkor Technology
11.2.1 Amkor Technology Company Information
11.2.2 Amkor Technology Chip Packaging Product Offered
11.2.3 Amkor Technology Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.2.4 Amkor Technology Main Business Overview
11.2.5 Amkor Technology Latest Developments
11.3 JCET
11.3.1 JCET Company Information
11.3.2 JCET Chip Packaging Product Offered
11.3.3 JCET Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.3.4 JCET Main Business Overview
11.3.5 JCET Latest Developments
11.4 Siliconware Precision Industries
11.4.1 Siliconware Precision Industries Company Information
11.4.2 Siliconware Precision Industries Chip Packaging Product Offered
11.4.3 Siliconware Precision Industries Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.4.4 Siliconware Precision Industries Main Business Overview
11.4.5 Siliconware Precision Industries Latest Developments
11.5 Powertech Technology
11.5.1 Powertech Technology Company Information
11.5.2 Powertech Technology Chip Packaging Product Offered
11.5.3 Powertech Technology Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.5.4 Powertech Technology Main Business Overview
11.5.5 Powertech Technology Latest Developments
11.6 TongFu Microelectronics
11.6.1 TongFu Microelectronics Company Information
11.6.2 TongFu Microelectronics Chip Packaging Product Offered
11.6.3 TongFu Microelectronics Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.6.4 TongFu Microelectronics Main Business Overview
11.6.5 TongFu Microelectronics Latest Developments
11.7 Tianshui Huatian Technology
11.7.1 Tianshui Huatian Technology Company Information
11.7.2 Tianshui Huatian Technology Chip Packaging Product Offered
11.7.3 Tianshui Huatian Technology Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.7.4 Tianshui Huatian Technology Main Business Overview
11.7.5 Tianshui Huatian Technology Latest Developments
11.8 UTAC
11.8.1 UTAC Company Information
11.8.2 UTAC Chip Packaging Product Offered
11.8.3 UTAC Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.8.4 UTAC Main Business Overview
11.8.5 UTAC Latest Developments
11.9 Chipbond Technology
11.9.1 Chipbond Technology Company Information
11.9.2 Chipbond Technology Chip Packaging Product Offered
11.9.3 Chipbond Technology Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.9.4 Chipbond Technology Main Business Overview
11.9.5 Chipbond Technology Latest Developments
11.10 Hana Micron
11.10.1 Hana Micron Company Information
11.10.2 Hana Micron Chip Packaging Product Offered
11.10.3 Hana Micron Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.10.4 Hana Micron Main Business Overview
11.10.5 Hana Micron Latest Developments
11.11 OSE
11.11.1 OSE Company Information
11.11.2 OSE Chip Packaging Product Offered
11.11.3 OSE Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.11.4 OSE Main Business Overview
11.11.5 OSE Latest Developments
11.12 Walton Advanced Engineering
11.12.1 Walton Advanced Engineering Company Information
11.12.2 Walton Advanced Engineering Chip Packaging Product Offered
11.12.3 Walton Advanced Engineering Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.12.4 Walton Advanced Engineering Main Business Overview
11.12.5 Walton Advanced Engineering Latest Developments
11.13 NEPES
11.13.1 NEPES Company Information
11.13.2 NEPES Chip Packaging Product Offered
11.13.3 NEPES Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.13.4 NEPES Main Business Overview
11.13.5 NEPES Latest Developments
11.14 Unisem
11.14.1 Unisem Company Information
11.14.2 Unisem Chip Packaging Product Offered
11.14.3 Unisem Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.14.4 Unisem Main Business Overview
11.14.5 Unisem Latest Developments
11.15 ChipMOS
11.15.1 ChipMOS Company Information
11.15.2 ChipMOS Chip Packaging Product Offered
11.15.3 ChipMOS Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.15.4 ChipMOS Main Business Overview
11.15.5 ChipMOS Latest Developments
11.16 Signetics
11.16.1 Signetics Company Information
11.16.2 Signetics Chip Packaging Product Offered
11.16.3 Signetics Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.16.4 Signetics Main Business Overview
11.16.5 Signetics Latest Developments
11.17 Carsem
11.17.1 Carsem Company Information
11.17.2 Carsem Chip Packaging Product Offered
11.17.3 Carsem Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.17.4 Carsem Main Business Overview
11.17.5 Carsem Latest Developments
11.18 King Yuan ELECTRONICS
11.18.1 King Yuan ELECTRONICS Company Information
11.18.2 King Yuan ELECTRONICS Chip Packaging Product Offered
11.18.3 King Yuan ELECTRONICS Chip Packaging Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.18.4 King Yuan ELECTRONICS Main Business Overview
11.18.5 King Yuan ELECTRONICS Latest Developments
12 Research Findings and Conclusion
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*If Applicable.