Global Chip On Board (COB) Packaging Technology 麻豆原创 Growth (Status and Outlook) 2025-2031

Publication ID:

LPI06253821

Publication Date:

June 20, 2025

Pages:

114

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

IT Services [2]

Software [3]

Computing & Electronics [4]

Description:

The global Chip On Board (COB) Packaging Technology market size is predicted to grow from US$ million in 2025 to US$ million in 2031; it is expected to grow at a CAGR of %from 2025 to 2031.
Chip On Board (COB) packaging technology is a packaging technique used in electronic devices, primarily for integrated circuits (ICs). In COB packaging, the bare semiconductor chip is directly mounted and electrically connected onto a printed circuit board (PCB) or a substrate.
COB technology eliminates the need for a traditional IC package, such as a plastic or ceramic package, by directly bonding the chip to the PCB. The chip is typically wire bonded to the PCB, and then covered with a protective resin or epoxy coating.
United States market for Chip On Board (COB) Packaging Technology is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
China market for Chip On Board (COB) Packaging Technology is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Europe market for Chip On Board (COB) Packaging Technology is estimated to increase from US$ million in 2024 to US$ million by 2031, at a CAGR of % from 2025 through 2031.
Global key Chip On Board (COB) Packaging Technology players cover Cree, Inc., Lumileds, Samsung Electronics Co., Ltd., LG Innotek, OSRAM Opto Semiconductors, etc. In terms of revenue, the global two largest companies occupied for a share nearly % in 2024.
The 鈥淐hip On Board (COB) Packaging Technology Industry Forecast鈥� looks at past sales and reviews total world Chip On Board (COB) Packaging Technology sales in 2024, providing a comprehensive analysis by region and market sector of projected Chip On Board (COB) Packaging Technology sales for 2025 through 2031. With Chip On Board (COB) Packaging Technology sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Chip On Board (COB) Packaging Technology industry.
This Insight Report provides a comprehensive analysis of the global Chip On Board (COB) Packaging Technology landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Chip On Board (COB) Packaging Technology portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Chip On Board (COB) Packaging Technology market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Chip On Board (COB) Packaging Technology and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Chip On Board (COB) Packaging Technology.
This report presents a comprehensive overview, market shares, and growth opportunities of Chip On Board (COB) Packaging Technology market by product type, application, key players and key regions and countries.
Segmentation by Type:
Traditional COB Packaging Technology
Modular COB Packaging Technology
Others
Segmentation by Application:
Lighting
Electronics
Industrial
Displays
Automotive
Medical and Healthcare
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Cree, Inc.
Lumileds
Samsung Electronics Co., Ltd.
LG Innotek
OSRAM Opto Semiconductors
Bridgelux, Inc.
Everlight Electronics Co., Ltd.
Nichia Corporation
Epistar Corporation
Seoul Semiconductor Co., Ltd.
Sharp Corporation
Kingbright Electronic Co., Ltd.

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Chip On Board (COB) Packaging Technology 麻豆原创 Size (2020-2031)
2.1.2 Chip On Board (COB) Packaging Technology 麻豆原创 Size CAGR by Region (2020 VS 2024 VS 2031)
2.1.3 World Current & Future Analysis for Chip On Board (COB) Packaging Technology by Country/Region (2020, 2024 & 2031)
2.2 Chip On Board (COB) Packaging Technology Segment by Type
2.2.1 Traditional COB Packaging Technology
2.2.2 Modular COB Packaging Technology
2.2.3 Others
2.3 Chip On Board (COB) Packaging Technology 麻豆原创 Size by Type
2.3.1 Chip On Board (COB) Packaging Technology 麻豆原创 Size CAGR by Type (2020 VS 2024 VS 2031)
2.3.2 Global Chip On Board (COB) Packaging Technology 麻豆原创 Size 麻豆原创 Share by Type (2020-2025)
2.4 Chip On Board (COB) Packaging Technology Segment by Application
2.4.1 Lighting
2.4.2 Electronics
2.4.3 Industrial
2.4.4 Displays
2.4.5 Automotive
2.4.6 Medical and Healthcare
2.4.7 Others
2.5 Chip On Board (COB) Packaging Technology 麻豆原创 Size by Application
2.5.1 Chip On Board (COB) Packaging Technology 麻豆原创 Size CAGR by Application (2020 VS 2024 VS 2031)
2.5.2 Global Chip On Board (COB) Packaging Technology 麻豆原创 Size 麻豆原创 Share by Application (2020-2025)
3 Chip On Board (COB) Packaging Technology 麻豆原创 Size by Player
3.1 Chip On Board (COB) Packaging Technology 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Chip On Board (COB) Packaging Technology Revenue by Player (2020-2025)
3.1.2 Global Chip On Board (COB) Packaging Technology Revenue 麻豆原创 Share by Player (2020-2025)
3.2 Global Chip On Board (COB) Packaging Technology Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2023-2025)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Chip On Board (COB) Packaging Technology by Region
4.1 Chip On Board (COB) Packaging Technology 麻豆原创 Size by Region (2020-2025)
4.2 Global Chip On Board (COB) Packaging Technology Annual Revenue by Country/Region (2020-2025)
4.3 Americas Chip On Board (COB) Packaging Technology 麻豆原创 Size Growth (2020-2025)
4.4 APAC Chip On Board (COB) Packaging Technology 麻豆原创 Size Growth (2020-2025)
4.5 Europe Chip On Board (COB) Packaging Technology 麻豆原创 Size Growth (2020-2025)
4.6 Middle East & Africa Chip On Board (COB) Packaging Technology 麻豆原创 Size Growth (2020-2025)
5 Americas
5.1 Americas Chip On Board (COB) Packaging Technology 麻豆原创 Size by Country (2020-2025)
5.2 Americas Chip On Board (COB) Packaging Technology 麻豆原创 Size by Type (2020-2025)
5.3 Americas Chip On Board (COB) Packaging Technology 麻豆原创 Size by Application (2020-2025)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Chip On Board (COB) Packaging Technology 麻豆原创 Size by Region (2020-2025)
6.2 APAC Chip On Board (COB) Packaging Technology 麻豆原创 Size by Type (2020-2025)
6.3 APAC Chip On Board (COB) Packaging Technology 麻豆原创 Size by Application (2020-2025)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Chip On Board (COB) Packaging Technology 麻豆原创 Size by Country (2020-2025)
7.2 Europe Chip On Board (COB) Packaging Technology 麻豆原创 Size by Type (2020-2025)
7.3 Europe Chip On Board (COB) Packaging Technology 麻豆原创 Size by Application (2020-2025)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Chip On Board (COB) Packaging Technology by Region (2020-2025)
8.2 Middle East & Africa Chip On Board (COB) Packaging Technology 麻豆原创 Size by Type (2020-2025)
8.3 Middle East & Africa Chip On Board (COB) Packaging Technology 麻豆原创 Size by Application (2020-2025)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Chip On Board (COB) Packaging Technology 麻豆原创 Forecast
10.1 Global Chip On Board (COB) Packaging Technology Forecast by Region (2026-2031)
10.1.1 Global Chip On Board (COB) Packaging Technology Forecast by Region (2026-2031)
10.1.2 Americas Chip On Board (COB) Packaging Technology Forecast
10.1.3 APAC Chip On Board (COB) Packaging Technology Forecast
10.1.4 Europe Chip On Board (COB) Packaging Technology Forecast
10.1.5 Middle East & Africa Chip On Board (COB) Packaging Technology Forecast
10.2 Americas Chip On Board (COB) Packaging Technology Forecast by Country (2026-2031)
10.2.1 United States 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.2.2 Canada 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.2.3 Mexico 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.2.4 Brazil 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.3 APAC Chip On Board (COB) Packaging Technology Forecast by Region (2026-2031)
10.3.1 China Chip On Board (COB) Packaging Technology 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.3.3 Korea 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.3.4 Southeast Asia 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.3.5 India 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.3.6 Australia 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.4 Europe Chip On Board (COB) Packaging Technology Forecast by Country (2026-2031)
10.4.1 Germany 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.4.2 France 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.4.3 UK 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.4.4 Italy 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.4.5 Russia 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.5 Middle East & Africa Chip On Board (COB) Packaging Technology Forecast by Region (2026-2031)
10.5.1 Egypt 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.5.2 South Africa 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.5.3 Israel 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.5.4 Turkey 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
10.6 Global Chip On Board (COB) Packaging Technology Forecast by Type (2026-2031)
10.7 Global Chip On Board (COB) Packaging Technology Forecast by Application (2026-2031)
10.7.1 GCC Countries 麻豆原创 Chip On Board (COB) Packaging Technology Forecast
11 Key Players Analysis
11.1 Cree, Inc.
11.1.1 Cree, Inc. Company Information
11.1.2 Cree, Inc. Chip On Board (COB) Packaging Technology Product Offered
11.1.3 Cree, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.1.4 Cree, Inc. Main Business Overview
11.1.5 Cree, Inc. Latest Developments
11.2 Lumileds
11.2.1 Lumileds Company Information
11.2.2 Lumileds Chip On Board (COB) Packaging Technology Product Offered
11.2.3 Lumileds Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.2.4 Lumileds Main Business Overview
11.2.5 Lumileds Latest Developments
11.3 Samsung Electronics Co., Ltd.
11.3.1 Samsung Electronics Co., Ltd. Company Information
11.3.2 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product Offered
11.3.3 Samsung Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.3.4 Samsung Electronics Co., Ltd. Main Business Overview
11.3.5 Samsung Electronics Co., Ltd. Latest Developments
11.4 LG Innotek
11.4.1 LG Innotek Company Information
11.4.2 LG Innotek Chip On Board (COB) Packaging Technology Product Offered
11.4.3 LG Innotek Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.4.4 LG Innotek Main Business Overview
11.4.5 LG Innotek Latest Developments
11.5 OSRAM Opto Semiconductors
11.5.1 OSRAM Opto Semiconductors Company Information
11.5.2 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Product Offered
11.5.3 OSRAM Opto Semiconductors Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.5.4 OSRAM Opto Semiconductors Main Business Overview
11.5.5 OSRAM Opto Semiconductors Latest Developments
11.6 Bridgelux, Inc.
11.6.1 Bridgelux, Inc. Company Information
11.6.2 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Product Offered
11.6.3 Bridgelux, Inc. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.6.4 Bridgelux, Inc. Main Business Overview
11.6.5 Bridgelux, Inc. Latest Developments
11.7 Everlight Electronics Co., Ltd.
11.7.1 Everlight Electronics Co., Ltd. Company Information
11.7.2 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Product Offered
11.7.3 Everlight Electronics Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.7.4 Everlight Electronics Co., Ltd. Main Business Overview
11.7.5 Everlight Electronics Co., Ltd. Latest Developments
11.8 Nichia Corporation
11.8.1 Nichia Corporation Company Information
11.8.2 Nichia Corporation Chip On Board (COB) Packaging Technology Product Offered
11.8.3 Nichia Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.8.4 Nichia Corporation Main Business Overview
11.8.5 Nichia Corporation Latest Developments
11.9 Epistar Corporation
11.9.1 Epistar Corporation Company Information
11.9.2 Epistar Corporation Chip On Board (COB) Packaging Technology Product Offered
11.9.3 Epistar Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.9.4 Epistar Corporation Main Business Overview
11.9.5 Epistar Corporation Latest Developments
11.10 Seoul Semiconductor Co., Ltd.
11.10.1 Seoul Semiconductor Co., Ltd. Company Information
11.10.2 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Product Offered
11.10.3 Seoul Semiconductor Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.10.4 Seoul Semiconductor Co., Ltd. Main Business Overview
11.10.5 Seoul Semiconductor Co., Ltd. Latest Developments
11.11 Sharp Corporation
11.11.1 Sharp Corporation Company Information
11.11.2 Sharp Corporation Chip On Board (COB) Packaging Technology Product Offered
11.11.3 Sharp Corporation Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.11.4 Sharp Corporation Main Business Overview
11.11.5 Sharp Corporation Latest Developments
11.12 Kingbright Electronic Co., Ltd.
11.12.1 Kingbright Electronic Co., Ltd. Company Information
11.12.2 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Product Offered
11.12.3 Kingbright Electronic Co., Ltd. Chip On Board (COB) Packaging Technology Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
11.12.4 Kingbright Electronic Co., Ltd. Main Business Overview
11.12.5 Kingbright Electronic Co., Ltd. Latest Developments
12 Research Findings and Conclusion

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