Global BGA Packaging Solder Ball 麻豆原创 Growth 2024-2030

Publication ID:

LPI04245980

Publication Date:

April 15, 2024

Pages:

116

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

BGA, or Ball Grid Array, packaging is a type of integrated circuit (IC) packaging used in electronics. In a BGA package, solder balls play a crucial role in connecting the integrated circuit to the printed circuit board (PCB).
The global BGA Packaging Solder Ball market size is projected to grow from US$ 150.9 million in 2023 to US$ 232.7 million in 2030; it is expected to grow at a CAGR of 6.4% from 2024 to 2030.
The 鈥淏GA Packaging Solder Ball Industry Forecast鈥� looks at past sales and reviews total world BGA Packaging Solder Ball sales in 2023, providing a comprehensive analysis by region and market sector of projected BGA Packaging Solder Ball sales for 2024 through 2030. With BGA Packaging Solder Ball sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world BGA Packaging Solder Ball industry.
This Insight Report provides a comprehensive analysis of the global BGA Packaging Solder Ball landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyzes the strategies of leading global companies with a focus on BGA Packaging Solder Ball portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global BGA Packaging Solder Ball market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for BGA Packaging Solder Ball and breaks down the forecast by Diameter, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global BGA Packaging Solder Ball.
麻豆原创 Drivers: Miniaturization of Electronic Devices: The trend toward smaller and more compact electronic devices, such as smartphones, tablets, and wearables, drives the demand for BGA packaging with solder balls. BGA offers a high pin count in a smaller footprint, making it suitable for miniaturized electronics.
Increasing Demand for High-Performance Computing: Growing demand for high-performance computing, data centers, and graphics processing units (GPUs) fuels the adoption of advanced packaging solutions like BGA. Solder balls contribute to the reliability and thermal performance of these high-power components.
Advancements in Semiconductor Technology: Ongoing advancements in semiconductor manufacturing technologies, including finer pitch and higher pin counts, necessitate the development of solder balls with improved materials and manufacturing processes to meet the requirements of next-generation electronic devices.
Rise in Internet of Things (IoT) Devices: The proliferation of IoT devices, which require compact and efficient packaging solutions, boosts the demand for BGA packaging with solder balls. BGA technology supports the integration of sensors and processors in small form factors.
Consumer Electronics Industry Growth: The consumer electronics industry's continual growth, driven by innovations in smartphones, laptops, gaming consoles, and other electronic gadgets, contributes significantly to the demand for BGA packaging solder balls.
麻豆原创 Restrictions: Cost and Complexity of Manufacturing: The manufacturing processes involved in producing BGA packaging with solder balls can be complex and may require advanced equipment. The associated costs, including material and manufacturing expenses, could be a limitation for some manufacturers or applications.
Stringent Quality and Compliance Standards: Industries such as aerospace and automotive have stringent quality and compliance standards. Meeting these standards, including requirements for high-reliability solder joints, can be challenging and may act as a restriction for certain applications.
This report presents a comprehensive overview, market shares, and growth opportunities of BGA Packaging Solder Ball market by product type, application, key manufacturers and key regions and countries.
Segmentation by diameter
Up to 0.2 mm
0.2-0.5 mm
Above 0.5 mm
Segmentation by application
IDM
OSAT
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Senju Metal
Accurus
DS HiMetal
NMC
MKE
PMTC
Indium Corporation
YCTC
Shenmao Technology
Shanghai hiking solder material
Key Questions Addressed in this Report
What is the 10-year outlook for the global BGA Packaging Solder Ball market?
What factors are driving BGA Packaging Solder Ball market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do BGA Packaging Solder Ball market opportunities vary by end market size?
How does BGA Packaging Solder Ball break out diameter, application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global BGA Packaging Solder Ball Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for BGA Packaging Solder Ball by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for BGA Packaging Solder Ball by Country/Region, 2019, 2023 & 2030
2.2 BGA Packaging Solder Ball Segment by Diameter
2.2.1 Up to 0.2 mm
2.2.2 0.2-0.5 mm
2.2.3 Above 0.5 mm
2.3 BGA Packaging Solder Ball Sales by Diameter
2.3.1 Global BGA Packaging Solder Ball Sales 麻豆原创 Share by Diameter (2019-2024)
2.3.2 Global BGA Packaging Solder Ball Revenue and 麻豆原创 Share by Diameter (2019-2024)
2.3.3 Global BGA Packaging Solder Ball Sale Price by Diameter (2019-2024)
2.4 BGA Packaging Solder Ball Segment by Application
2.4.1 IDM
2.4.2 OSAT
2.5 BGA Packaging Solder Ball Sales by Application
2.5.1 Global BGA Packaging Solder Ball Sale 麻豆原创 Share by Application (2019-2024)
2.5.2 Global BGA Packaging Solder Ball Revenue and 麻豆原创 Share by Application (2019-2024)
2.5.3 Global BGA Packaging Solder Ball Sale Price by Application (2019-2024)
3 Global BGA Packaging Solder Ball by Company
3.1 Global BGA Packaging Solder Ball Breakdown Data by Company
3.1.1 Global BGA Packaging Solder Ball Annual Sales by Company (2019-2024)
3.1.2 Global BGA Packaging Solder Ball Sales 麻豆原创 Share by Company (2019-2024)
3.2 Global BGA Packaging Solder Ball Annual Revenue by Company (2019-2024)
3.2.1 Global BGA Packaging Solder Ball Revenue by Company (2019-2024)
3.2.2 Global BGA Packaging Solder Ball Revenue 麻豆原创 Share by Company (2019-2024)
3.3 Global BGA Packaging Solder Ball Sale Price by Company
3.4 Key Manufacturers BGA Packaging Solder Ball Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers BGA Packaging Solder Ball Product Location Distribution
3.4.2 Players BGA Packaging Solder Ball Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for BGA Packaging Solder Ball by Geographic Region
4.1 World Historic BGA Packaging Solder Ball 麻豆原创 Size by Geographic Region (2019-2024)
4.1.1 Global BGA Packaging Solder Ball Annual Sales by Geographic Region (2019-2024)
4.1.2 Global BGA Packaging Solder Ball Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic BGA Packaging Solder Ball 麻豆原创 Size by Country/Region (2019-2024)
4.2.1 Global BGA Packaging Solder Ball Annual Sales by Country/Region (2019-2024)
4.2.2 Global BGA Packaging Solder Ball Annual Revenue by Country/Region (2019-2024)
4.3 Americas BGA Packaging Solder Ball Sales Growth
4.4 APAC BGA Packaging Solder Ball Sales Growth
4.5 Europe BGA Packaging Solder Ball Sales Growth
4.6 Middle East & Africa BGA Packaging Solder Ball Sales Growth
5 Americas
5.1 Americas BGA Packaging Solder Ball Sales by Country
5.1.1 Americas BGA Packaging Solder Ball Sales by Country (2019-2024)
5.1.2 Americas BGA Packaging Solder Ball Revenue by Country (2019-2024)
5.2 Americas BGA Packaging Solder Ball Sales by Diameter
5.3 Americas BGA Packaging Solder Ball Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC BGA Packaging Solder Ball Sales by Region
6.1.1 APAC BGA Packaging Solder Ball Sales by Region (2019-2024)
6.1.2 APAC BGA Packaging Solder Ball Revenue by Region (2019-2024)
6.2 APAC BGA Packaging Solder Ball Sales by Diameter
6.3 APAC BGA Packaging Solder Ball Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe BGA Packaging Solder Ball by Country
7.1.1 Europe BGA Packaging Solder Ball Sales by Country (2019-2024)
7.1.2 Europe BGA Packaging Solder Ball Revenue by Country (2019-2024)
7.2 Europe BGA Packaging Solder Ball Sales by Diameter
7.3 Europe BGA Packaging Solder Ball Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa BGA Packaging Solder Ball by Country
8.1.1 Middle East & Africa BGA Packaging Solder Ball Sales by Country (2019-2024)
8.1.2 Middle East & Africa BGA Packaging Solder Ball Revenue by Country (2019-2024)
8.2 Middle East & Africa BGA Packaging Solder Ball Sales by Diameter
8.3 Middle East & Africa BGA Packaging Solder Ball Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of BGA Packaging Solder Ball
10.3 Manufacturing Process Analysis of BGA Packaging Solder Ball
10.4 Industry Chain Structure of BGA Packaging Solder Ball
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 BGA Packaging Solder Ball Distributors
11.3 BGA Packaging Solder Ball Customer
12 World Forecast Review for BGA Packaging Solder Ball by Geographic Region
12.1 Global BGA Packaging Solder Ball 麻豆原创 Size Forecast by Region
12.1.1 Global BGA Packaging Solder Ball Forecast by Region (2025-2030)
12.1.2 Global BGA Packaging Solder Ball Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global BGA Packaging Solder Ball Forecast by Diameter
12.7 Global BGA Packaging Solder Ball Forecast by Application
13 Key Players Analysis
13.1 Senju Metal
13.1.1 Senju Metal Company Information
13.1.2 Senju Metal BGA Packaging Solder Ball Product Portfolios and Specifications
13.1.3 Senju Metal BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Senju Metal Main Business Overview
13.1.5 Senju Metal Latest Developments
13.2 Accurus
13.2.1 Accurus Company Information
13.2.2 Accurus BGA Packaging Solder Ball Product Portfolios and Specifications
13.2.3 Accurus BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Accurus Main Business Overview
13.2.5 Accurus Latest Developments
13.3 DS HiMetal
13.3.1 DS HiMetal Company Information
13.3.2 DS HiMetal BGA Packaging Solder Ball Product Portfolios and Specifications
13.3.3 DS HiMetal BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 DS HiMetal Main Business Overview
13.3.5 DS HiMetal Latest Developments
13.4 NMC
13.4.1 NMC Company Information
13.4.2 NMC BGA Packaging Solder Ball Product Portfolios and Specifications
13.4.3 NMC BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 NMC Main Business Overview
13.4.5 NMC Latest Developments
13.5 MKE
13.5.1 MKE Company Information
13.5.2 MKE BGA Packaging Solder Ball Product Portfolios and Specifications
13.5.3 MKE BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 MKE Main Business Overview
13.5.5 MKE Latest Developments
13.6 PMTC
13.6.1 PMTC Company Information
13.6.2 PMTC BGA Packaging Solder Ball Product Portfolios and Specifications
13.6.3 PMTC BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 PMTC Main Business Overview
13.6.5 PMTC Latest Developments
13.7 Indium Corporation
13.7.1 Indium Corporation Company Information
13.7.2 Indium Corporation BGA Packaging Solder Ball Product Portfolios and Specifications
13.7.3 Indium Corporation BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Indium Corporation Main Business Overview
13.7.5 Indium Corporation Latest Developments
13.8 YCTC
13.8.1 YCTC Company Information
13.8.2 YCTC BGA Packaging Solder Ball Product Portfolios and Specifications
13.8.3 YCTC BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 YCTC Main Business Overview
13.8.5 YCTC Latest Developments
13.9 Shenmao Technology
13.9.1 Shenmao Technology Company Information
13.9.2 Shenmao Technology BGA Packaging Solder Ball Product Portfolios and Specifications
13.9.3 Shenmao Technology BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.9.4 Shenmao Technology Main Business Overview
13.9.5 Shenmao Technology Latest Developments
13.10 Shanghai hiking solder material
13.10.1 Shanghai hiking solder material Company Information
13.10.2 Shanghai hiking solder material BGA Packaging Solder Ball Product Portfolios and Specifications
13.10.3 Shanghai hiking solder material BGA Packaging Solder Ball Sales, Revenue, Price and Gross Margin (2019-2024)
13.10.4 Shanghai hiking solder material Main Business Overview
13.10.5 Shanghai hiking solder material Latest Developments
14 Research Findings and Conclusion

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