Global AiP (Antenna in Package) Module 麻豆原创 Growth 2024-2030

Publication ID:

LPI10253174

Publication Date:

October 17, 2024

Pages:

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

Semiconductors [2]

Manufacturing (Computing & Electronics) [3]

Computing & Electronics [4]

Description:

The global AiP (Antenna in Package) Module market size was valued at US$ million in 2023. With growing demand in downstream market, the AiP (Antenna in Package) Module is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during review period.
The research report highlights the growth potential of the global AiP (Antenna in Package) Module market. AiP (Antenna in Package) Module are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of AiP (Antenna in Package) Module. 麻豆原创 players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the AiP (Antenna in Package) Module market.
AiP is a technology that integrates an antenna and a chip into a package to achieve system-level wireless functions. The dielectric materials of the package antenna are mainly ceramic, organic, and molding compounds, and the conductor materials are gold, silver, and copper. It implements one or more antennas in the IC package and can carry bare radio frequency chips (transceivers). AiP can be further integrated with front-end components (for example, power amplifier (PA) or low noise amplifier (LNA)), switches, filters, and even power management integrated circuits (PMIC) to form an antenna module-package (SiP) using System-in technology.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
Key Features:
The report on AiP (Antenna in Package) Module market reflects various aspects and provide valuable insights into the industry.
麻豆原创 Size and Growth: The research report provide an overview of the current size and growth of the AiP (Antenna in Package) Module market. It may include historical data, market segmentation by Type (e.g., LTCC, HDI), and regional breakdowns.
麻豆原创 Drivers and Challenges: The report can identify and analyse the factors driving the growth of the AiP (Antenna in Package) Module market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the AiP (Antenna in Package) Module market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the AiP (Antenna in Package) Module industry. This include advancements in AiP (Antenna in Package) Module technology, AiP (Antenna in Package) Module new entrants, AiP (Antenna in Package) Module new investment, and other innovations that are shaping the future of AiP (Antenna in Package) Module.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the AiP (Antenna in Package) Module market. It includes factors influencing customer ' purchasing decisions, preferences for AiP (Antenna in Package) Module product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the AiP (Antenna in Package) Module market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting AiP (Antenna in Package) Module market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the AiP (Antenna in Package) Module market.
麻豆原创 Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the AiP (Antenna in Package) Module industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the AiP (Antenna in Package) Module market.
麻豆原创 Segmentation:
AiP (Antenna in Package) Module market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Segmentation by type
LTCC
HDI
FOWLP
Segmentation by application
Consumer Electronics
Vehicle Electronics
Industrial Internet of Things
Communication Base Station
Others
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Qualcomm
Intel
Murata
Skyworks
Qorvo
Samsung
Broadcom
Huizhou Speed Wireless Technology
Key Questions Addressed in this Report
What is the 10-year outlook for the global AiP (Antenna in Package) Module market?
What factors are driving AiP (Antenna in Package) Module market growth, globally and by region?
Which technologies are poised for the fastest growth by market and region?
How do AiP (Antenna in Package) Module market opportunities vary by end market size?
How does AiP (Antenna in Package) Module break out type, application?

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global AiP (Antenna in Package) Module Annual Sales 2019-2030
2.1.2 World Current & Future Analysis for AiP (Antenna in Package) Module by Geographic Region, 2019, 2023 & 2030
2.1.3 World Current & Future Analysis for AiP (Antenna in Package) Module by Country/Region, 2019, 2023 & 2030
2.2 AiP (Antenna in Package) Module Segment by Type
2.2.1 LTCC
2.2.2 HDI
2.2.3 FOWLP
2.3 AiP (Antenna in Package) Module Sales by Type
2.3.1 Global AiP (Antenna in Package) Module Sales 麻豆原创 Share by Type (2019-2024)
2.3.2 Global AiP (Antenna in Package) Module Revenue and 麻豆原创 Share by Type (2019-2024)
2.3.3 Global AiP (Antenna in Package) Module Sale Price by Type (2019-2024)
2.4 AiP (Antenna in Package) Module Segment by Application
2.4.1 Consumer Electronics
2.4.2 Vehicle Electronics
2.4.3 Industrial Internet of Things
2.4.4 Communication Base Station
2.4.5 Others
2.5 AiP (Antenna in Package) Module Sales by Application
2.5.1 Global AiP (Antenna in Package) Module Sale 麻豆原创 Share by Application (2019-2024)
2.5.2 Global AiP (Antenna in Package) Module Revenue and 麻豆原创 Share by Application (2019-2024)
2.5.3 Global AiP (Antenna in Package) Module Sale Price by Application (2019-2024)
3 Global AiP (Antenna in Package) Module by Company
3.1 Global AiP (Antenna in Package) Module Breakdown Data by Company
3.1.1 Global AiP (Antenna in Package) Module Annual Sales by Company (2019-2024)
3.1.2 Global AiP (Antenna in Package) Module Sales 麻豆原创 Share by Company (2019-2024)
3.2 Global AiP (Antenna in Package) Module Annual Revenue by Company (2019-2024)
3.2.1 Global AiP (Antenna in Package) Module Revenue by Company (2019-2024)
3.2.2 Global AiP (Antenna in Package) Module Revenue 麻豆原创 Share by Company (2019-2024)
3.3 Global AiP (Antenna in Package) Module Sale Price by Company
3.4 Key Manufacturers AiP (Antenna in Package) Module Producing Area Distribution, Sales Area, Product Type
3.4.1 Key Manufacturers AiP (Antenna in Package) Module Product Location Distribution
3.4.2 Players AiP (Antenna in Package) Module Products Offered
3.5 麻豆原创 Concentration Rate Analysis
3.5.1 Competition Landscape Analysis
3.5.2 Concentration Ratio (CR3, CR5 and CR10) & (2019-2024)
3.6 New Products and Potential Entrants
3.7 Mergers & Acquisitions, Expansion
4 World Historic Review for AiP (Antenna in Package) Module by Geographic Region
4.1 World Historic AiP (Antenna in Package) Module 麻豆原创 Size by Geographic Region (2019-2024)
4.1.1 Global AiP (Antenna in Package) Module Annual Sales by Geographic Region (2019-2024)
4.1.2 Global AiP (Antenna in Package) Module Annual Revenue by Geographic Region (2019-2024)
4.2 World Historic AiP (Antenna in Package) Module 麻豆原创 Size by Country/Region (2019-2024)
4.2.1 Global AiP (Antenna in Package) Module Annual Sales by Country/Region (2019-2024)
4.2.2 Global AiP (Antenna in Package) Module Annual Revenue by Country/Region (2019-2024)
4.3 Americas AiP (Antenna in Package) Module Sales Growth
4.4 APAC AiP (Antenna in Package) Module Sales Growth
4.5 Europe AiP (Antenna in Package) Module Sales Growth
4.6 Middle East & Africa AiP (Antenna in Package) Module Sales Growth
5 Americas
5.1 Americas AiP (Antenna in Package) Module Sales by Country
5.1.1 Americas AiP (Antenna in Package) Module Sales by Country (2019-2024)
5.1.2 Americas AiP (Antenna in Package) Module Revenue by Country (2019-2024)
5.2 Americas AiP (Antenna in Package) Module Sales by Type
5.3 Americas AiP (Antenna in Package) Module Sales by Application
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC AiP (Antenna in Package) Module Sales by Region
6.1.1 APAC AiP (Antenna in Package) Module Sales by Region (2019-2024)
6.1.2 APAC AiP (Antenna in Package) Module Revenue by Region (2019-2024)
6.2 APAC AiP (Antenna in Package) Module Sales by Type
6.3 APAC AiP (Antenna in Package) Module Sales by Application
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
6.10 China Taiwan
7 Europe
7.1 Europe AiP (Antenna in Package) Module by Country
7.1.1 Europe AiP (Antenna in Package) Module Sales by Country (2019-2024)
7.1.2 Europe AiP (Antenna in Package) Module Revenue by Country (2019-2024)
7.2 Europe AiP (Antenna in Package) Module Sales by Type
7.3 Europe AiP (Antenna in Package) Module Sales by Application
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa AiP (Antenna in Package) Module by Country
8.1.1 Middle East & Africa AiP (Antenna in Package) Module Sales by Country (2019-2024)
8.1.2 Middle East & Africa AiP (Antenna in Package) Module Revenue by Country (2019-2024)
8.2 Middle East & Africa AiP (Antenna in Package) Module Sales by Type
8.3 Middle East & Africa AiP (Antenna in Package) Module Sales by Application
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Manufacturing Cost Structure Analysis
10.1 Raw Material and Suppliers
10.2 Manufacturing Cost Structure Analysis of AiP (Antenna in Package) Module
10.3 Manufacturing Process Analysis of AiP (Antenna in Package) Module
10.4 Industry Chain Structure of AiP (Antenna in Package) Module
11 麻豆原创ing, Distributors and Customer
11.1 Sales Channel
11.1.1 Direct Channels
11.1.2 Indirect Channels
11.2 AiP (Antenna in Package) Module Distributors
11.3 AiP (Antenna in Package) Module Customer
12 World Forecast Review for AiP (Antenna in Package) Module by Geographic Region
12.1 Global AiP (Antenna in Package) Module 麻豆原创 Size Forecast by Region
12.1.1 Global AiP (Antenna in Package) Module Forecast by Region (2025-2030)
12.1.2 Global AiP (Antenna in Package) Module Annual Revenue Forecast by Region (2025-2030)
12.2 Americas Forecast by Country
12.3 APAC Forecast by Region
12.4 Europe Forecast by Country
12.5 Middle East & Africa Forecast by Country
12.6 Global AiP (Antenna in Package) Module Forecast by Type
12.7 Global AiP (Antenna in Package) Module Forecast by Application
13 Key Players Analysis
13.1 Qualcomm
13.1.1 Qualcomm Company Information
13.1.2 Qualcomm AiP (Antenna in Package) Module Product Portfolios and Specifications
13.1.3 Qualcomm AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.1.4 Qualcomm Main Business Overview
13.1.5 Qualcomm Latest Developments
13.2 Intel
13.2.1 Intel Company Information
13.2.2 Intel AiP (Antenna in Package) Module Product Portfolios and Specifications
13.2.3 Intel AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.2.4 Intel Main Business Overview
13.2.5 Intel Latest Developments
13.3 Murata
13.3.1 Murata Company Information
13.3.2 Murata AiP (Antenna in Package) Module Product Portfolios and Specifications
13.3.3 Murata AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.3.4 Murata Main Business Overview
13.3.5 Murata Latest Developments
13.4 Skyworks
13.4.1 Skyworks Company Information
13.4.2 Skyworks AiP (Antenna in Package) Module Product Portfolios and Specifications
13.4.3 Skyworks AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.4.4 Skyworks Main Business Overview
13.4.5 Skyworks Latest Developments
13.5 Qorvo
13.5.1 Qorvo Company Information
13.5.2 Qorvo AiP (Antenna in Package) Module Product Portfolios and Specifications
13.5.3 Qorvo AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.5.4 Qorvo Main Business Overview
13.5.5 Qorvo Latest Developments
13.6 Samsung
13.6.1 Samsung Company Information
13.6.2 Samsung AiP (Antenna in Package) Module Product Portfolios and Specifications
13.6.3 Samsung AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.6.4 Samsung Main Business Overview
13.6.5 Samsung Latest Developments
13.7 Broadcom
13.7.1 Broadcom Company Information
13.7.2 Broadcom AiP (Antenna in Package) Module Product Portfolios and Specifications
13.7.3 Broadcom AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.7.4 Broadcom Main Business Overview
13.7.5 Broadcom Latest Developments
13.8 Huizhou Speed Wireless Technology
13.8.1 Huizhou Speed Wireless Technology Company Information
13.8.2 Huizhou Speed Wireless Technology AiP (Antenna in Package) Module Product Portfolios and Specifications
13.8.3 Huizhou Speed Wireless Technology AiP (Antenna in Package) Module Sales, Revenue, Price and Gross Margin (2019-2024)
13.8.4 Huizhou Speed Wireless Technology Main Business Overview
13.8.5 Huizhou Speed Wireless Technology Latest Developments
14 Research Findings and Conclusion

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