Global Advanced IC Packaging Solution 麻豆原创 Growth (Status and Outlook) 2024-2030

Publication ID:

LPI11244051

Publication Date:

November 11, 2024

Pages:

139

Publisher:

LPI

Countries:

Global [1]

USD 3,660.00

IT Services [2]

Software [3]

Computing & Electronics [4]

Description:

Advanced IC (Integrated Circuit) packaging is a critical technology in semiconductor manufacturing that focuses on improving the performance, efficiency, and form factor of electronic devices. As chip designs become more complex and power demands increase, advanced IC packaging techniques have become essential. The Advanced IC Packaging Solutions catalog includes advanced IC packaging design software tools and advanced IC packaging processing services.
The global Advanced IC Packaging Solution market size is projected to grow from US$ 12960 million in 2024 to US$ 18300 million in 2030; it is expected to grow at a CAGR of 5.9% from 2024 to 2030.
LPI (publisher)' newest research report, the 鈥淎dvanced IC Packaging Solution Industry Forecast鈥� looks at past sales and reviews total world Advanced IC Packaging Solution sales in 2022, providing a comprehensive analysis by region and market sector of projected Advanced IC Packaging Solution sales for 2023 through 2029. With Advanced IC Packaging Solution sales broken down by region, market sector and sub-sector, this report provides a detailed analysis in US$ millions of the world Advanced IC Packaging Solution industry.
This Insight Report provides a comprehensive analysis of the global Advanced IC Packaging Solution landscape and highlights key trends related to product segmentation, company formation, revenue, and market share, latest development, and M&A activity. This report also analyses the strategies of leading global companies with a focus on Advanced IC Packaging Solution portfolios and capabilities, market entry strategies, market positions, and geographic footprints, to better understand these firms鈥� unique position in an accelerating global Advanced IC Packaging Solution market.
This Insight Report evaluates the key market trends, drivers, and affecting factors shaping the global outlook for Advanced IC Packaging Solution and breaks down the forecast by Type, by Application, geography, and market size to highlight emerging pockets of opportunity. With a transparent methodology based on hundreds of bottom-up qualitative and quantitative market inputs, this study forecast offers a highly nuanced view of the current state and future trajectory in the global Advanced IC Packaging Solution.
Overseas mergers and acquisitions in recent years have allowed Chinese packaging and testing enterprises to quickly gain access to technology and markets, make up for some structural deficiencies, and greatly promote the upward development of China's packaging and testing industry. China's IC packaging industry started early and developed quickly, but is still dominated by traditional packaging. Although in recent years China's local advanced packaging and testing four strong (JCET Group, TongFu Microelectronics Co,Ltd, Tianshui Huatian Technology Co, China Wafer Level CSP Co., Ltd) through independent research and development and mergers and acquisitions, has basically formed the industrialization of advanced packaging capacity, but from the advanced packaging revenue accounted for the proportion of total revenue and high-density integration and other advanced packaging technology development, China's overall advanced packaging technology level and the international leading level there is still a certain gap.
This report presents a comprehensive overview, market shares, and growth opportunities of Advanced IC Packaging Solution market by product type, application, key players and key regions and countries.
Segmentation by Type:
Software
Service
Segmentation by Application:
Consumer Electronics
Industrial
Medical Equipment
Automotive
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
Segmentation by Type:
Software
Service
Segmentation by Application:
Consumer Electronics
Industrial
Medical Equipment
Automotive
Other
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
Siemens Digital Industries Software
PCB Technologies
Grand Process Technology
Confovis GmbH
ASMPT
ASE
Taiwan Semiconductor Manufacturing Company Limited
SPTS Technologies
Amkor Technology
JCET Group
Ams-OSRAM AG
Global Unichip Corp
Brooks Automation
TongFu Microelectronics Co.,Ltd
Tianshui Huatian Technology Co., Ltd
China Wafer Level CSP Co., Ltd
Powertech Technology
ChipMOS Technologies

Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.

Table Of Contents:

1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global Advanced IC Packaging Solution 麻豆原创 Size 2019-2030
2.1.2 Advanced IC Packaging Solution 麻豆原创 Size CAGR by Region (2019 VS 2023 VS 2030)
2.1.3 World Current & Future Analysis for Advanced IC Packaging Solution by Country/Region, 2019, 2023 & 2030
2.2 Advanced IC Packaging Solution Segment by Type
2.2.1 Software
2.2.2 Service
2.3 Advanced IC Packaging Solution 麻豆原创 Size by Type
2.3.1 Advanced IC Packaging Solution 麻豆原创 Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global Advanced IC Packaging Solution 麻豆原创 Size 麻豆原创 Share by Type (2019-2024)
2.4 Advanced IC Packaging Solution Segment by Application
2.4.1 Consumer Electronics
2.4.2 Industrial
2.4.3 Medical Equipment
2.4.4 Automotive
2.4.5 Other
2.5 Advanced IC Packaging Solution 麻豆原创 Size by Application
2.5.1 Advanced IC Packaging Solution 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global Advanced IC Packaging Solution 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 Advanced IC Packaging Solution 麻豆原创 Size by Player
3.1 Advanced IC Packaging Solution 麻豆原创 Size 麻豆原创 Share by Player
3.1.1 Global Advanced IC Packaging Solution Revenue by Player (2019-2024)
3.1.2 Global Advanced IC Packaging Solution Revenue 麻豆原创 Share by Player (2019-2024)
3.2 Global Advanced IC Packaging Solution Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 Advanced IC Packaging Solution by Region
4.1 Advanced IC Packaging Solution 麻豆原创 Size by Region (2019-2024)
4.2 Global Advanced IC Packaging Solution Annual Revenue by Country/Region (2019-2024)
4.3 Americas Advanced IC Packaging Solution 麻豆原创 Size Growth (2019-2024)
4.4 APAC Advanced IC Packaging Solution 麻豆原创 Size Growth (2019-2024)
4.5 Europe Advanced IC Packaging Solution 麻豆原创 Size Growth (2019-2024)
4.6 Middle East & Africa Advanced IC Packaging Solution 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas Advanced IC Packaging Solution 麻豆原创 Size by Country (2019-2024)
5.2 Americas Advanced IC Packaging Solution 麻豆原创 Size by Type (2019-2024)
5.3 Americas Advanced IC Packaging Solution 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC Advanced IC Packaging Solution 麻豆原创 Size by Region (2019-2024)
6.2 APAC Advanced IC Packaging Solution 麻豆原创 Size by Type (2019-2024)
6.3 APAC Advanced IC Packaging Solution 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 South Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe Advanced IC Packaging Solution 麻豆原创 Size by Country (2019-2024)
7.2 Europe Advanced IC Packaging Solution 麻豆原创 Size by Type (2019-2024)
7.3 Europe Advanced IC Packaging Solution 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa Advanced IC Packaging Solution by Region (2019-2024)
8.2 Middle East & Africa Advanced IC Packaging Solution 麻豆原创 Size by Type (2019-2024)
8.3 Middle East & Africa Advanced IC Packaging Solution 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global Advanced IC Packaging Solution 麻豆原创 Forecast
10.1 Global Advanced IC Packaging Solution Forecast by Region (2025-2030)
10.1.1 Global Advanced IC Packaging Solution Forecast by Region (2025-2030)
10.1.2 Americas Advanced IC Packaging Solution Forecast
10.1.3 APAC Advanced IC Packaging Solution Forecast
10.1.4 Europe Advanced IC Packaging Solution Forecast
10.1.5 Middle East & Africa Advanced IC Packaging Solution Forecast
10.2 Americas Advanced IC Packaging Solution Forecast by Country (2025-2030)
10.2.1 United States 麻豆原创 Advanced IC Packaging Solution Forecast
10.2.2 Canada 麻豆原创 Advanced IC Packaging Solution Forecast
10.2.3 Mexico 麻豆原创 Advanced IC Packaging Solution Forecast
10.2.4 Brazil 麻豆原创 Advanced IC Packaging Solution Forecast
10.3 APAC Advanced IC Packaging Solution Forecast by Region (2025-2030)
10.3.1 China Advanced IC Packaging Solution 麻豆原创 Forecast
10.3.2 Japan 麻豆原创 Advanced IC Packaging Solution Forecast
10.3.3 Korea 麻豆原创 Advanced IC Packaging Solution Forecast
10.3.4 Southeast Asia 麻豆原创 Advanced IC Packaging Solution Forecast
10.3.5 India 麻豆原创 Advanced IC Packaging Solution Forecast
10.3.6 Australia 麻豆原创 Advanced IC Packaging Solution Forecast
10.4 Europe Advanced IC Packaging Solution Forecast by Country (2025-2030)
10.4.1 Germany 麻豆原创 Advanced IC Packaging Solution Forecast
10.4.2 France 麻豆原创 Advanced IC Packaging Solution Forecast
10.4.3 UK 麻豆原创 Advanced IC Packaging Solution Forecast
10.4.4 Italy 麻豆原创 Advanced IC Packaging Solution Forecast
10.4.5 Russia 麻豆原创 Advanced IC Packaging Solution Forecast
10.5 Middle East & Africa Advanced IC Packaging Solution Forecast by Region (2025-2030)
10.5.1 Egypt 麻豆原创 Advanced IC Packaging Solution Forecast
10.5.2 South Africa 麻豆原创 Advanced IC Packaging Solution Forecast
10.5.3 Israel 麻豆原创 Advanced IC Packaging Solution Forecast
10.5.4 Turkey 麻豆原创 Advanced IC Packaging Solution Forecast
10.6 Global Advanced IC Packaging Solution Forecast by Type (2025-2030)
10.7 Global Advanced IC Packaging Solution Forecast by Application (2025-2030)
10.7.1 GCC Countries 麻豆原创 Advanced IC Packaging Solution Forecast
11 Key Players Analysis
11.1 Siemens Digital Industries Software
11.1.1 Siemens Digital Industries Software Company Information
11.1.2 Siemens Digital Industries Software Advanced IC Packaging Solution Product Offered
11.1.3 Siemens Digital Industries Software Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 Siemens Digital Industries Software Main Business Overview
11.1.5 Siemens Digital Industries Software Latest Developments
11.2 PCB Technologies
11.2.1 PCB Technologies Company Information
11.2.2 PCB Technologies Advanced IC Packaging Solution Product Offered
11.2.3 PCB Technologies Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 PCB Technologies Main Business Overview
11.2.5 PCB Technologies Latest Developments
11.3 Grand Process Technology
11.3.1 Grand Process Technology Company Information
11.3.2 Grand Process Technology Advanced IC Packaging Solution Product Offered
11.3.3 Grand Process Technology Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 Grand Process Technology Main Business Overview
11.3.5 Grand Process Technology Latest Developments
11.4 Confovis GmbH
11.4.1 Confovis GmbH Company Information
11.4.2 Confovis GmbH Advanced IC Packaging Solution Product Offered
11.4.3 Confovis GmbH Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 Confovis GmbH Main Business Overview
11.4.5 Confovis GmbH Latest Developments
11.5 ASMPT
11.5.1 ASMPT Company Information
11.5.2 ASMPT Advanced IC Packaging Solution Product Offered
11.5.3 ASMPT Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 ASMPT Main Business Overview
11.5.5 ASMPT Latest Developments
11.6 ASE
11.6.1 ASE Company Information
11.6.2 ASE Advanced IC Packaging Solution Product Offered
11.6.3 ASE Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 ASE Main Business Overview
11.6.5 ASE Latest Developments
11.7 Taiwan Semiconductor Manufacturing Company Limited
11.7.1 Taiwan Semiconductor Manufacturing Company Limited Company Information
11.7.2 Taiwan Semiconductor Manufacturing Company Limited Advanced IC Packaging Solution Product Offered
11.7.3 Taiwan Semiconductor Manufacturing Company Limited Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.7.4 Taiwan Semiconductor Manufacturing Company Limited Main Business Overview
11.7.5 Taiwan Semiconductor Manufacturing Company Limited Latest Developments
11.8 SPTS Technologies
11.8.1 SPTS Technologies Company Information
11.8.2 SPTS Technologies Advanced IC Packaging Solution Product Offered
11.8.3 SPTS Technologies Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.8.4 SPTS Technologies Main Business Overview
11.8.5 SPTS Technologies Latest Developments
11.9 Amkor Technology
11.9.1 Amkor Technology Company Information
11.9.2 Amkor Technology Advanced IC Packaging Solution Product Offered
11.9.3 Amkor Technology Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.9.4 Amkor Technology Main Business Overview
11.9.5 Amkor Technology Latest Developments
11.10 JCET Group
11.10.1 JCET Group Company Information
11.10.2 JCET Group Advanced IC Packaging Solution Product Offered
11.10.3 JCET Group Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.10.4 JCET Group Main Business Overview
11.10.5 JCET Group Latest Developments
11.11 Ams-OSRAM AG
11.11.1 Ams-OSRAM AG Company Information
11.11.2 Ams-OSRAM AG Advanced IC Packaging Solution Product Offered
11.11.3 Ams-OSRAM AG Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.11.4 Ams-OSRAM AG Main Business Overview
11.11.5 Ams-OSRAM AG Latest Developments
11.12 Global Unichip Corp
11.12.1 Global Unichip Corp Company Information
11.12.2 Global Unichip Corp Advanced IC Packaging Solution Product Offered
11.12.3 Global Unichip Corp Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.12.4 Global Unichip Corp Main Business Overview
11.12.5 Global Unichip Corp Latest Developments
11.13 Brooks Automation
11.13.1 Brooks Automation Company Information
11.13.2 Brooks Automation Advanced IC Packaging Solution Product Offered
11.13.3 Brooks Automation Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.13.4 Brooks Automation Main Business Overview
11.13.5 Brooks Automation Latest Developments
11.14 TongFu Microelectronics Co.,Ltd
11.14.1 TongFu Microelectronics Co.,Ltd Company Information
11.14.2 TongFu Microelectronics Co.,Ltd Advanced IC Packaging Solution Product Offered
11.14.3 TongFu Microelectronics Co.,Ltd Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.14.4 TongFu Microelectronics Co.,Ltd Main Business Overview
11.14.5 TongFu Microelectronics Co.,Ltd Latest Developments
11.15 Tianshui Huatian Technology Co., Ltd
11.15.1 Tianshui Huatian Technology Co., Ltd Company Information
11.15.2 Tianshui Huatian Technology Co., Ltd Advanced IC Packaging Solution Product Offered
11.15.3 Tianshui Huatian Technology Co., Ltd Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.15.4 Tianshui Huatian Technology Co., Ltd Main Business Overview
11.15.5 Tianshui Huatian Technology Co., Ltd Latest Developments
11.16 China Wafer Level CSP Co., Ltd
11.16.1 China Wafer Level CSP Co., Ltd Company Information
11.16.2 China Wafer Level CSP Co., Ltd Advanced IC Packaging Solution Product Offered
11.16.3 China Wafer Level CSP Co., Ltd Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.16.4 China Wafer Level CSP Co., Ltd Main Business Overview
11.16.5 China Wafer Level CSP Co., Ltd Latest Developments
11.17 Powertech Technology
11.17.1 Powertech Technology Company Information
11.17.2 Powertech Technology Advanced IC Packaging Solution Product Offered
11.17.3 Powertech Technology Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.17.4 Powertech Technology Main Business Overview
11.17.5 Powertech Technology Latest Developments
11.18 ChipMOS Technologies
11.18.1 ChipMOS Technologies Company Information
11.18.2 ChipMOS Technologies Advanced IC Packaging Solution Product Offered
11.18.3 ChipMOS Technologies Advanced IC Packaging Solution Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.18.4 ChipMOS Technologies Main Business Overview
11.18.5 ChipMOS Technologies Latest Developments
12 Research Findings and Conclusion

License Types:

Single User License (PDF)

This license allows for use of a publication by one person.
This person may print out a single copy of the publication.
This person can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
This person cannot share the publication (or any information contained therein) with any other person or persons.
Unless a Enterprise License is purchased, a Single User License must be purchased for every person that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Site License (PDF)*

This license allows for use of a publication by all users within one corporate location, e.g. a regional office.
These users may print out a single copy of the publication.
These users can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.
These users cannot share the publication (or any information contained therein) with any other person or persons outside the corporate location for which the publication is purchased.
Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
Customers who infringe these license terms are liable for a Global license fee.

听

Global License (PDF)*

This license allows for use of a publication by unlimited users within the purchasing organization e.g. all employees of a single company.
Each of these people may use the publication on any computer, and may print out the report, but may not share the publication (or any information contained therein) with any other person or persons outside of the organization.
These employees of purchasing organization can include information given in the publication in presentations and internal reports by providing full copyright credit to the publisher.

*If Applicable.