The global 3D IC and 2.5D IC market size was valued at US$ million in 2023. With growing demand in downstream market, the 3D IC and 2.5D IC is forecast to a readjusted size of US$ million by 2030 with a CAGR of % during review period.
The research report highlights the growth potential of the global 3D IC and 2.5D IC market. 3D IC and 2.5D IC are expected to show stable growth in the future market. However, product differentiation, reducing costs, and supply chain optimization remain crucial for the widespread adoption of 3D IC and 2.5D IC. 麻豆原创 players need to invest in research and development, forge strategic partnerships, and align their offerings with evolving consumer preferences to capitalize on the immense opportunities presented by the 3D IC and 2.5D IC market.
In microelectronics, a three-dimensional integrated circuit (3D IC) is an integrated circuit manufactured by stacking silicon wafers or dies and interconnecting them vertically using, for instance, through-silicon vias (TSVs) or Cu-Cu connections, so that they behave as a single device to achieve performance improvements at reduced power and smaller footprint than conventional two dimensional processes.While a 2.5-dimensional integrated circuit (2.5D IC) is a package with an active electronic components (for example, a die or a chip) stacked on an interposer through conductive bumps or TSVs.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Key Features:
The report on 3D IC and 2.5D IC market reflects various aspects and provide valuable insights into the industry.
麻豆原创 Size and Growth: The research report provide an overview of the current size and growth of the 3D IC and 2.5D IC market. It may include historical data, market segmentation by Type (e.g., 3D Wafer-level Chip-scale Packaging, 3D TSV), and regional breakdowns.
麻豆原创 Drivers and Challenges: The report can identify and analyse the factors driving the growth of the 3D IC and 2.5D IC market, such as government regulations, environmental concerns, technological advancements, and changing consumer preferences. It can also highlight the challenges faced by the industry, including infrastructure limitations, range anxiety, and high upfront costs.
Competitive Landscape: The research report provides analysis of the competitive landscape within the 3D IC and 2.5D IC market. It includes profiles of key players, their market share, strategies, and product offerings. The report can also highlight emerging players and their potential impact on the market.
Technological Developments: The research report can delve into the latest technological developments in the 3D IC and 2.5D IC industry. This include advancements in 3D IC and 2.5D IC technology, 3D IC and 2.5D IC new entrants, 3D IC and 2.5D IC new investment, and other innovations that are shaping the future of 3D IC and 2.5D IC.
Downstream Procumbent Preference: The report can shed light on customer procumbent behaviour and adoption trends in the 3D IC and 2.5D IC market. It includes factors influencing customer ' purchasing decisions, preferences for 3D IC and 2.5D IC product.
Government Policies and Incentives: The research report analyse the impact of government policies and incentives on the 3D IC and 2.5D IC market. This may include an assessment of regulatory frameworks, subsidies, tax incentives, and other measures aimed at promoting 3D IC and 2.5D IC market. The report also evaluates the effectiveness of these policies in driving market growth.
Environmental Impact and Sustainability: The research report assess the environmental impact and sustainability aspects of the 3D IC and 2.5D IC market.
麻豆原创 Forecasts and Future Outlook: Based on the analysis conducted, the research report provide market forecasts and outlook for the 3D IC and 2.5D IC industry. This includes projections of market size, growth rates, regional trends, and predictions on technological advancements and policy developments.
Recommendations and Opportunities: The report conclude with recommendations for industry stakeholders, policymakers, and investors. It highlights potential opportunities for market players to capitalize on emerging trends, overcome challenges, and contribute to the growth and development of the 3D IC and 2.5D IC market.
麻豆原创 Segmentation:
3D IC and 2.5D IC market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of value.
Segmentation by type
3D Wafer-level Chip-scale Packaging
3D TSV
2.5D
Segmentation by application
Consumer Electronics
Telecommunication
Industry Sector
Automotive
Military and Aerospace
Smart Technologies
Medical Devices
This report also splits the market by region:
Americas
United States
Canada
Mexico
Brazil
APAC
China
Japan
Korea
Southeast Asia
India
Australia
Europe
Germany
France
UK
Italy
Russia
Middle East & Africa
Egypt
South Africa
Israel
Turkey
GCC Countries
The below companies that are profiled have been selected based on inputs gathered from primary experts and analyzing the company's coverage, product portfolio, its market penetration.
TSMC(Taiwan)
Samsung(South Korea)
Toshiba(Japan)
ASE Group(Taiwan)
Amkor(U.S.)
UMC(Taiwan)
Stmicroelectronics(Switzerland)
Broadcom(U.S.)
Intel(U.S.)
Jiangsu Changjiang Electronics(China)
Please Note - This is an on demand report and will be delivered in 2 business days (48 hours) post payment.
1 Scope of the Report
1.1 麻豆原创 Introduction
1.2 Years Considered
1.3 Research Objectives
1.4 麻豆原创 Research Methodology
1.5 Research Process and Data Source
1.6 Economic Indicators
1.7 Currency Considered
1.8 麻豆原创 Estimation Caveats
2 Executive Summary
2.1 World 麻豆原创 Overview
2.1.1 Global 3D IC and 2.5D IC 麻豆原创 Size 2019-2030
2.1.2 3D IC and 2.5D IC 麻豆原创 Size CAGR by Region 2019 VS 2023 VS 2030
2.2 3D IC and 2.5D IC Segment by Type
2.2.1 3D Wafer-level Chip-scale Packaging
2.2.2 3D TSV
2.2.3 2.5D
2.3 3D IC and 2.5D IC 麻豆原创 Size by Type
2.3.1 3D IC and 2.5D IC 麻豆原创 Size CAGR by Type (2019 VS 2023 VS 2030)
2.3.2 Global 3D IC and 2.5D IC 麻豆原创 Size 麻豆原创 Share by Type (2019-2024)
2.4 3D IC and 2.5D IC Segment by Application
2.4.1 Consumer Electronics
2.4.2 Telecommunication
2.4.3 Industry Sector
2.4.4 Automotive
2.4.5 Military and Aerospace
2.4.6 Smart Technologies
2.4.7 Medical Devices
2.5 3D IC and 2.5D IC 麻豆原创 Size by Application
2.5.1 3D IC and 2.5D IC 麻豆原创 Size CAGR by Application (2019 VS 2023 VS 2030)
2.5.2 Global 3D IC and 2.5D IC 麻豆原创 Size 麻豆原创 Share by Application (2019-2024)
3 3D IC and 2.5D IC 麻豆原创 Size by Player
3.1 3D IC and 2.5D IC 麻豆原创 Size 麻豆原创 Share by Players
3.1.1 Global 3D IC and 2.5D IC Revenue by Players (2019-2024)
3.1.2 Global 3D IC and 2.5D IC Revenue 麻豆原创 Share by Players (2019-2024)
3.2 Global 3D IC and 2.5D IC Key Players Head office and Products Offered
3.3 麻豆原创 Concentration Rate Analysis
3.3.1 Competition Landscape Analysis
3.3.2 Concentration Ratio (CR3, CR5 and CR10) & (2022-2024)
3.4 New Products and Potential Entrants
3.5 Mergers & Acquisitions, Expansion
4 3D IC and 2.5D IC by Regions
4.1 3D IC and 2.5D IC 麻豆原创 Size by Regions (2019-2024)
4.2 Americas 3D IC and 2.5D IC 麻豆原创 Size Growth (2019-2024)
4.3 APAC 3D IC and 2.5D IC 麻豆原创 Size Growth (2019-2024)
4.4 Europe 3D IC and 2.5D IC 麻豆原创 Size Growth (2019-2024)
4.5 Middle East & Africa 3D IC and 2.5D IC 麻豆原创 Size Growth (2019-2024)
5 Americas
5.1 Americas 3D IC and 2.5D IC 麻豆原创 Size by Country (2019-2024)
5.2 Americas 3D IC and 2.5D IC 麻豆原创 Size by Type (2019-2024)
5.3 Americas 3D IC and 2.5D IC 麻豆原创 Size by Application (2019-2024)
5.4 United States
5.5 Canada
5.6 Mexico
5.7 Brazil
6 APAC
6.1 APAC 3D IC and 2.5D IC 麻豆原创 Size by Region (2019-2024)
6.2 APAC 3D IC and 2.5D IC 麻豆原创 Size by Type (2019-2024)
6.3 APAC 3D IC and 2.5D IC 麻豆原创 Size by Application (2019-2024)
6.4 China
6.5 Japan
6.6 Korea
6.7 Southeast Asia
6.8 India
6.9 Australia
7 Europe
7.1 Europe 3D IC and 2.5D IC by Country (2019-2024)
7.2 Europe 3D IC and 2.5D IC 麻豆原创 Size by Type (2019-2024)
7.3 Europe 3D IC and 2.5D IC 麻豆原创 Size by Application (2019-2024)
7.4 Germany
7.5 France
7.6 UK
7.7 Italy
7.8 Russia
8 Middle East & Africa
8.1 Middle East & Africa 3D IC and 2.5D IC by Region (2019-2024)
8.2 Middle East & Africa 3D IC and 2.5D IC 麻豆原创 Size by Type (2019-2024)
8.3 Middle East & Africa 3D IC and 2.5D IC 麻豆原创 Size by Application (2019-2024)
8.4 Egypt
8.5 South Africa
8.6 Israel
8.7 Turkey
8.8 GCC Countries
9 麻豆原创 Drivers, Challenges and Trends
9.1 麻豆原创 Drivers & Growth Opportunities
9.2 麻豆原创 Challenges & Risks
9.3 Industry Trends
10 Global 3D IC and 2.5D IC 麻豆原创 Forecast
10.1 Global 3D IC and 2.5D IC Forecast by Regions (2025-2030)
10.1.1 Global 3D IC and 2.5D IC Forecast by Regions (2025-2030)
10.1.2 Americas 3D IC and 2.5D IC Forecast
10.1.3 APAC 3D IC and 2.5D IC Forecast
10.1.4 Europe 3D IC and 2.5D IC Forecast
10.1.5 Middle East & Africa 3D IC and 2.5D IC Forecast
10.2 Americas 3D IC and 2.5D IC Forecast by Country (2025-2030)
10.2.1 United States 3D IC and 2.5D IC 麻豆原创 Forecast
10.2.2 Canada 3D IC and 2.5D IC 麻豆原创 Forecast
10.2.3 Mexico 3D IC and 2.5D IC 麻豆原创 Forecast
10.2.4 Brazil 3D IC and 2.5D IC 麻豆原创 Forecast
10.3 APAC 3D IC and 2.5D IC Forecast by Region (2025-2030)
10.3.1 China 3D IC and 2.5D IC 麻豆原创 Forecast
10.3.2 Japan 3D IC and 2.5D IC 麻豆原创 Forecast
10.3.3 Korea 3D IC and 2.5D IC 麻豆原创 Forecast
10.3.4 Southeast Asia 3D IC and 2.5D IC 麻豆原创 Forecast
10.3.5 India 3D IC and 2.5D IC 麻豆原创 Forecast
10.3.6 Australia 3D IC and 2.5D IC 麻豆原创 Forecast
10.4 Europe 3D IC and 2.5D IC Forecast by Country (2025-2030)
10.4.1 Germany 3D IC and 2.5D IC 麻豆原创 Forecast
10.4.2 France 3D IC and 2.5D IC 麻豆原创 Forecast
10.4.3 UK 3D IC and 2.5D IC 麻豆原创 Forecast
10.4.4 Italy 3D IC and 2.5D IC 麻豆原创 Forecast
10.4.5 Russia 3D IC and 2.5D IC 麻豆原创 Forecast
10.5 Middle East & Africa 3D IC and 2.5D IC Forecast by Region (2025-2030)
10.5.1 Egypt 3D IC and 2.5D IC 麻豆原创 Forecast
10.5.2 South Africa 3D IC and 2.5D IC 麻豆原创 Forecast
10.5.3 Israel 3D IC and 2.5D IC 麻豆原创 Forecast
10.5.4 Turkey 3D IC and 2.5D IC 麻豆原创 Forecast
10.5.5 GCC Countries 3D IC and 2.5D IC 麻豆原创 Forecast
10.6 Global 3D IC and 2.5D IC Forecast by Type (2025-2030)
10.7 Global 3D IC and 2.5D IC Forecast by Application (2025-2030)
11 Key Players Analysis
11.1 TSMC(Taiwan)
11.1.1 TSMC(Taiwan) Company Information
11.1.2 TSMC(Taiwan) 3D IC and 2.5D IC Product Offered
11.1.3 TSMC(Taiwan) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.1.4 TSMC(Taiwan) Main Business Overview
11.1.5 TSMC(Taiwan) Latest Developments
11.2 Samsung(South Korea)
11.2.1 Samsung(South Korea) Company Information
11.2.2 Samsung(South Korea) 3D IC and 2.5D IC Product Offered
11.2.3 Samsung(South Korea) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.2.4 Samsung(South Korea) Main Business Overview
11.2.5 Samsung(South Korea) Latest Developments
11.3 Toshiba(Japan)
11.3.1 Toshiba(Japan) Company Information
11.3.2 Toshiba(Japan) 3D IC and 2.5D IC Product Offered
11.3.3 Toshiba(Japan) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.3.4 Toshiba(Japan) Main Business Overview
11.3.5 Toshiba(Japan) Latest Developments
11.4 ASE Group(Taiwan)
11.4.1 ASE Group(Taiwan) Company Information
11.4.2 ASE Group(Taiwan) 3D IC and 2.5D IC Product Offered
11.4.3 ASE Group(Taiwan) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.4.4 ASE Group(Taiwan) Main Business Overview
11.4.5 ASE Group(Taiwan) Latest Developments
11.5 Amkor(U.S.)
11.5.1 Amkor(U.S.) Company Information
11.5.2 Amkor(U.S.) 3D IC and 2.5D IC Product Offered
11.5.3 Amkor(U.S.) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.5.4 Amkor(U.S.) Main Business Overview
11.5.5 Amkor(U.S.) Latest Developments
11.6 UMC(Taiwan)
11.6.1 UMC(Taiwan) Company Information
11.6.2 UMC(Taiwan) 3D IC and 2.5D IC Product Offered
11.6.3 UMC(Taiwan) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.6.4 UMC(Taiwan) Main Business Overview
11.6.5 UMC(Taiwan) Latest Developments
11.7 Stmicroelectronics(Switzerland)
11.7.1 Stmicroelectronics(Switzerland) Company Information
11.7.2 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Product Offered
11.7.3 Stmicroelectronics(Switzerland) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.7.4 Stmicroelectronics(Switzerland) Main Business Overview
11.7.5 Stmicroelectronics(Switzerland) Latest Developments
11.8 Broadcom(U.S.)
11.8.1 Broadcom(U.S.) Company Information
11.8.2 Broadcom(U.S.) 3D IC and 2.5D IC Product Offered
11.8.3 Broadcom(U.S.) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.8.4 Broadcom(U.S.) Main Business Overview
11.8.5 Broadcom(U.S.) Latest Developments
11.9 Intel(U.S.)
11.9.1 Intel(U.S.) Company Information
11.9.2 Intel(U.S.) 3D IC and 2.5D IC Product Offered
11.9.3 Intel(U.S.) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.9.4 Intel(U.S.) Main Business Overview
11.9.5 Intel(U.S.) Latest Developments
11.10 Jiangsu Changjiang Electronics(China)
11.10.1 Jiangsu Changjiang Electronics(China) Company Information
11.10.2 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Product Offered
11.10.3 Jiangsu Changjiang Electronics(China) 3D IC and 2.5D IC Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
11.10.4 Jiangsu Changjiang Electronics(China) Main Business Overview
11.10.5 Jiangsu Changjiang Electronics(China) Latest Developments
12 Research Findings and Conclusion
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*If Applicable.
