Asia Pacific Substrate-Like PCB (SLP) 麻豆原创 2021-2031 by Inspection Technology , Line/Space , Application , and Country: Trend Forecast and Growth Opportunity

Publication ID:

GRM0922017

Publication Date:

September 30, 2022

Pages:

Publisher:

Grace 麻豆原创 Data

Countries:

Asia Pacific [1]

USD 2,600.00

Semiconductors [2]

Electrical Components [3]

Computing & Electronics [4]

Description:

Asia Pacific substrate-like PCB (SLP) market will grow by 15.6% annually with a total addressable market cap of $ 25,000.1 million over 2022-2031, driven by SLP鈥檚 ability to enable faster transmission while simultaneously giving the manufacturers more freedom to design their product, increasing R&D activities for technological advancements, the rising prevalence of smart consumer electronics such as smartphones and wearable devices, and the growing demand for effective connectivity solutions and the growing trend of miniaturization.
Highlighted with 26 tables and 36 figures, this 88-page report 鈥淎sia Pacific Substrate-Like PCB (SLP) 麻豆原创 2021-2031 by Inspection Technology (AOI, DI, AOS), Line/Space (25/25 and 30/30 渭m, Less than 25/25 渭m), Application (Consumer Electronics, Automotive, Medical, Industrial, Computing and Communications, Others), and Country: Trend Forecast and Growth Opportunity鈥� is based on a comprehensive research of the entire Asia Pacific substrate-like PCB (SLP) market and all its sub-segments through extensively detailed classifications. Profound analysis and assessment are generated from premium primary and secondary information sources with inputs derived from industry professionals across the value chain. The report is based on studies on 2019-2021 and provides forecast from 2022 till 2031 with 2021 as the base year. (Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

In-depth qualitative analyses include identification and investigation of the following aspects:
鈥� 麻豆原创 Structure
鈥� Growth Drivers
鈥� Restraints and Challenges
鈥� Emerging Product Trends & 麻豆原创 Opportunities
鈥� Porter鈥檚 Fiver Forces
The trend and outlook of Asia Pacific market is forecast in optimistic, balanced, and conservative view by taking into account of COVID-19 and Russia-Ukraine conflict. The balanced (most likely) projection is used to quantify Asia Pacific substrate-like PCB (SLP) market in every aspect of the classification from perspectives of Inspection Technology, Line/Space, Application, and Country.

Based on Inspection Technology, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� Automated Optical Inspection (AOI)
鈥� Direct Imaging (DI)
鈥� Automated Optical Shaping (AOS)

Based on Line/Space, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� 25/25 and 30/30 渭m
鈥� Less than 25/25 渭m

By Application, the Asia Pacific market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
鈥� Consumer Electronics
鈥� Automotive Industry
鈥� Medical Industry
鈥� Industrial Use
鈥� Computing and Communications
鈥� Other Applications

Geographically, the following national/local markets are fully investigated:
鈥� Japan
鈥� China
鈥� South Korea
鈥� Australia
鈥� India
鈥� Rest of APAC (further segmented into Malaysia, Singapore, Indonesia, Thailand, New Zealand, Vietnam, Taiwan, and Philippines)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of national markets by Inspection Technology, Line/Space and Application over the forecast years are also included.

The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

Table Of Contents:

1 Introduction 6
1.1 Industry Definition and Research Scope 6
1.1.1 Industry Definition 6
1.1.2 Research Scope 7
1.2 Research Methodology 10
1.2.1 Overview of 麻豆原创 Research Methodology 10
1.2.2 麻豆原创 Assumption 11
1.2.3 Secondary Data 11
1.2.4 Primary Data 11
1.2.5 Data Filtration and Model Design 12
1.2.6 麻豆原创 Size/Share Estimation 13
1.2.7 Research Limitations 14
1.3 Executive Summary 15
2 麻豆原创 Overview and Dynamics 17
2.1 麻豆原创 Size and Forecast 17
2.1.1 Impact of COVID-19 on World Economy 18
2.1.2 Impact of COVID-19 on the 麻豆原创 20
2.2 Major Growth Drivers 22
2.3 麻豆原创 Restraints and Challenges 26
2.4 Emerging Opportunities and 麻豆原创 Trends 29
2.5 Porter鈥檚 Fiver Forces Analysis 33
3 Segmentation of Asia Pacific 麻豆原创 by Inspection Technology 37
3.1 麻豆原创 Overview by Inspection Technology 37
3.2 Automated Optical Inspection (AOI) 39
3.3 Direct Imaging (DI) 40
4 Segmentation of Asia Pacific 麻豆原创 by Line/Space 41
4.1 麻豆原创 Overview by Line/Space 41
4.2 25/25 and 30/30 渭m 43
4.3 Less than 25/25 渭m 44
5 Segmentation of Asia Pacific 麻豆原创 by Application 45
5.1 麻豆原创 Overview by Application 45
5.2 Consumer Electronics 47
5.3 Automotive Industry 48
5.4 Medical Industry 49
5.5 Industrial Use 50
5.6 Computing and Communications 51
5.7 Other Applications 52
6 Asia-Pacific 麻豆原创 2021-2031 by Country 53
6.1 Overview of Asia-Pacific 麻豆原创 53
6.2 Japan 56
6.3 China 59
6.4 Australia 61
6.5 India 63
6.6 South Korea 65
6.7 Rest of APAC Region 67
7 Competitive Landscape 69
7.1 Overview of Key Vendors 69
7.2 New Product Launch, Partnership, Investment, and M&A 72
7.3 Company Profiles 73
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S) 73
China Circuit Technology Corporation 75
Compaq Manufacturing Co., Ltd. 76
Daeduck Electronics Co., Ltd. 77
HannStar Board Corporation 78
Ibiden Co., Ltd. 79
Kinsus Interconnect Technology Corp 80
Korea Circuit Co., Ltd. 81
Samsung Electro-Mechanics Co., Ltd. 82
Shenzhen Fastprint Circuit Tech Co., Ltd. 83
Symtek Automation Asia Co., Ltd. 84
TTM Technologies, Inc. 85
Unimicron Technology Corp. 86
Zhen Ding Tech. Group Technology Holding Limited 87
RELATED REPORTS 88

Companies Mentioned:

Selected Key Players:
Austria Technologie & Systemtechnik Aktiengesellschaft (AT&S)
China Circuit Technology Corporation
Compaq Manufacturing Co., Ltd.
Daeduck Electronics Co., Ltd.
HannStar Board Corporation
Ibiden Co., Ltd.
Kinsus Interconnect Technology Corp
Korea Circuit Co., Ltd.
Samsung Electro-Mechanics Co., Ltd.
Shenzhen Fastprint Circuit Tech Co., Ltd.
Symtek Automation Asia Co., Ltd.
TTM Technologies, Inc.
Unimicron Technology Corp.
Zhen Ding Tech. Group Technology Holding Limited
(Please note: The report will be updated before delivery so that the latest historical year is the base year and the forecast covers at least 5 years over the base year.)

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Unless a Enterprise License is purchased, a Site User License must be purchased for every corporate location by an organization that wishes to use the publication within the same organization.
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