The global Wafer Slicing Equipment market size was valued at US$ 943 million in 2024 and is forecast to a readjusted size of USD 1278 million by 2031 with a CAGR of 4.5% during review period.
Wafer Slicing Equipment(that is, the Wafer scribing machine) is mainly used for packaging, is the Wafer that contain a lot of chip (Wafer) into one device, a chip particles current industry are mainly composed of mechanical blade, including the main shaft, control system, etc., due to cutting matrix for semiconductor devices, so the product yield and higher control requirements.
Global key wafer slicing equipment manufacturers include DISCO, Tokyo Seimitsu etc.The top 1 company hold a share about 60%.Chinese Mainland is the largest market, with a share about 40%, followed by Taiwan, China and South Korea with the share about 27% and 10%.
This report is a detailed and comprehensive analysis for global Wafer Slicing Equipment market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Wafer Slicing Equipment market size and forecasts, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Wafer Slicing Equipment market size and forecasts by region and country, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Wafer Slicing Equipment market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (Units), and average selling prices (US$/Unit), 2020-2031
Global Wafer Slicing Equipment market shares of main players, shipments in revenue ($ Million), sales quantity (Units), and ASP (US$/Unit), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Slicing Equipment
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Wafer Slicing Equipment market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, Tokyo Seimitsu, GL Tech Co Ltd, ASM, Synova, CETC Electronics Equipment Group Co., Ltd., Shenyang Heyan Technology Co., Ltd., Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd., Hi-TESI, Tensun, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
麻豆原创 Segmentation
Wafer Slicing Equipment market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segment by Type
Blade Cutting Machine
Laser Cutting Machine
麻豆原创 segment by Application
Pure Foundry
IDM
OSAT
LED
Photovoltaic
Major players covered
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun
麻豆原创 segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Slicing Equipment product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Slicing Equipment, with price, sales quantity, revenue, and global market share of Wafer Slicing Equipment from 2020 to 2025.
Chapter 3, the Wafer Slicing Equipment competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Slicing Equipment breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Wafer Slicing Equipment market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Slicing Equipment.
Chapter 14 and 15, to describe Wafer Slicing Equipment sales channel, distributors, customers, research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 麻豆原创 Analysis by Type
1.3.1 Overview: Global Wafer Slicing Equipment Consumption Value by Type: 2020 Versus 2024 Versus 2031
1.3.2 Blade Cutting Machine
1.3.3 Laser Cutting Machine
1.4 麻豆原创 Analysis by Application
1.4.1 Overview: Global Wafer Slicing Equipment Consumption Value by Application: 2020 Versus 2024 Versus 2031
1.4.2 Pure Foundry
1.4.3 IDM
1.4.4 OSAT
1.4.5 LED
1.4.6 Photovoltaic
1.5 Global Wafer Slicing Equipment 麻豆原创 Size & Forecast
1.5.1 Global Wafer Slicing Equipment Consumption Value (2020 & 2024 & 2031)
1.5.2 Global Wafer Slicing Equipment Sales Quantity (2020-2031)
1.5.3 Global Wafer Slicing Equipment Average Price (2020-2031)
2 Manufacturers Profiles
2.1 DISCO
2.1.1 DISCO Details
2.1.2 DISCO Major Business
2.1.3 DISCO Wafer Slicing Equipment Product and Services
2.1.4 DISCO Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.1.5 DISCO Recent Developments/Updates
2.2 Tokyo Seimitsu
2.2.1 Tokyo Seimitsu Details
2.2.2 Tokyo Seimitsu Major Business
2.2.3 Tokyo Seimitsu Wafer Slicing Equipment Product and Services
2.2.4 Tokyo Seimitsu Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.2.5 Tokyo Seimitsu Recent Developments/Updates
2.3 GL Tech Co Ltd
2.3.1 GL Tech Co Ltd Details
2.3.2 GL Tech Co Ltd Major Business
2.3.3 GL Tech Co Ltd Wafer Slicing Equipment Product and Services
2.3.4 GL Tech Co Ltd Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.3.5 GL Tech Co Ltd Recent Developments/Updates
2.4 ASM
2.4.1 ASM Details
2.4.2 ASM Major Business
2.4.3 ASM Wafer Slicing Equipment Product and Services
2.4.4 ASM Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.4.5 ASM Recent Developments/Updates
2.5 Synova
2.5.1 Synova Details
2.5.2 Synova Major Business
2.5.3 Synova Wafer Slicing Equipment Product and Services
2.5.4 Synova Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.5.5 Synova Recent Developments/Updates
2.6 CETC Electronics Equipment Group Co., Ltd.
2.6.1 CETC Electronics Equipment Group Co., Ltd. Details
2.6.2 CETC Electronics Equipment Group Co., Ltd. Major Business
2.6.3 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Product and Services
2.6.4 CETC Electronics Equipment Group Co., Ltd. Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.6.5 CETC Electronics Equipment Group Co., Ltd. Recent Developments/Updates
2.7 Shenyang Heyan Technology Co., Ltd.
2.7.1 Shenyang Heyan Technology Co., Ltd. Details
2.7.2 Shenyang Heyan Technology Co., Ltd. Major Business
2.7.3 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Product and Services
2.7.4 Shenyang Heyan Technology Co., Ltd. Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.7.5 Shenyang Heyan Technology Co., Ltd. Recent Developments/Updates
2.8 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
2.8.1 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Details
2.8.2 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Major Business
2.8.3 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Product and Services
2.8.4 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.8.5 Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd. Recent Developments/Updates
2.9 Hi-TESI
2.9.1 Hi-TESI Details
2.9.2 Hi-TESI Major Business
2.9.3 Hi-TESI Wafer Slicing Equipment Product and Services
2.9.4 Hi-TESI Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.9.5 Hi-TESI Recent Developments/Updates
2.10 Tensun
2.10.1 Tensun Details
2.10.2 Tensun Major Business
2.10.3 Tensun Wafer Slicing Equipment Product and Services
2.10.4 Tensun Wafer Slicing Equipment Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.10.5 Tensun Recent Developments/Updates
3 Competitive Environment: Wafer Slicing Equipment by Manufacturer
3.1 Global Wafer Slicing Equipment Sales Quantity by Manufacturer (2020-2025)
3.2 Global Wafer Slicing Equipment Revenue by Manufacturer (2020-2025)
3.3 Global Wafer Slicing Equipment Average Price by Manufacturer (2020-2025)
3.4 麻豆原创 Share Analysis (2024)
3.4.1 Producer Shipments of Wafer Slicing Equipment by Manufacturer Revenue ($MM) and 麻豆原创 Share (%): 2024
3.4.2 Top 3 Wafer Slicing Equipment Manufacturer 麻豆原创 Share in 2024
3.4.3 Top 6 Wafer Slicing Equipment Manufacturer 麻豆原创 Share in 2024
3.5 Wafer Slicing Equipment 麻豆原创: Overall Company Footprint Analysis
3.5.1 Wafer Slicing Equipment 麻豆原创: Region Footprint
3.5.2 Wafer Slicing Equipment 麻豆原创: Company Product Type Footprint
3.5.3 Wafer Slicing Equipment 麻豆原创: Company Product Application Footprint
3.6 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Wafer Slicing Equipment 麻豆原创 Size by Region
4.1.1 Global Wafer Slicing Equipment Sales Quantity by Region (2020-2031)
4.1.2 Global Wafer Slicing Equipment Consumption Value by Region (2020-2031)
4.1.3 Global Wafer Slicing Equipment Average Price by Region (2020-2031)
4.2 North America Wafer Slicing Equipment Consumption Value (2020-2031)
4.3 Europe Wafer Slicing Equipment Consumption Value (2020-2031)
4.4 Asia-Pacific Wafer Slicing Equipment Consumption Value (2020-2031)
4.5 South America Wafer Slicing Equipment Consumption Value (2020-2031)
4.6 Middle East & Africa Wafer Slicing Equipment Consumption Value (2020-2031)
5 麻豆原创 Segment by Type
5.1 Global Wafer Slicing Equipment Sales Quantity by Type (2020-2031)
5.2 Global Wafer Slicing Equipment Consumption Value by Type (2020-2031)
5.3 Global Wafer Slicing Equipment Average Price by Type (2020-2031)
6 麻豆原创 Segment by Application
6.1 Global Wafer Slicing Equipment Sales Quantity by Application (2020-2031)
6.2 Global Wafer Slicing Equipment Consumption Value by Application (2020-2031)
6.3 Global Wafer Slicing Equipment Average Price by Application (2020-2031)
7 North America
7.1 North America Wafer Slicing Equipment Sales Quantity by Type (2020-2031)
7.2 North America Wafer Slicing Equipment Sales Quantity by Application (2020-2031)
7.3 North America Wafer Slicing Equipment 麻豆原创 Size by Country
7.3.1 North America Wafer Slicing Equipment Sales Quantity by Country (2020-2031)
7.3.2 North America Wafer Slicing Equipment Consumption Value by Country (2020-2031)
7.3.3 United States 麻豆原创 Size and Forecast (2020-2031)
7.3.4 Canada 麻豆原创 Size and Forecast (2020-2031)
7.3.5 Mexico 麻豆原创 Size and Forecast (2020-2031)
8 Europe
8.1 Europe Wafer Slicing Equipment Sales Quantity by Type (2020-2031)
8.2 Europe Wafer Slicing Equipment Sales Quantity by Application (2020-2031)
8.3 Europe Wafer Slicing Equipment 麻豆原创 Size by Country
8.3.1 Europe Wafer Slicing Equipment Sales Quantity by Country (2020-2031)
8.3.2 Europe Wafer Slicing Equipment Consumption Value by Country (2020-2031)
8.3.3 Germany 麻豆原创 Size and Forecast (2020-2031)
8.3.4 France 麻豆原创 Size and Forecast (2020-2031)
8.3.5 United Kingdom 麻豆原创 Size and Forecast (2020-2031)
8.3.6 Russia 麻豆原创 Size and Forecast (2020-2031)
8.3.7 Italy 麻豆原创 Size and Forecast (2020-2031)
9 Asia-Pacific
9.1 Asia-Pacific Wafer Slicing Equipment Sales Quantity by Type (2020-2031)
9.2 Asia-Pacific Wafer Slicing Equipment Sales Quantity by Application (2020-2031)
9.3 Asia-Pacific Wafer Slicing Equipment 麻豆原创 Size by Region
9.3.1 Asia-Pacific Wafer Slicing Equipment Sales Quantity by Region (2020-2031)
9.3.2 Asia-Pacific Wafer Slicing Equipment Consumption Value by Region (2020-2031)
9.3.3 China 麻豆原创 Size and Forecast (2020-2031)
9.3.4 Japan 麻豆原创 Size and Forecast (2020-2031)
9.3.5 South Korea 麻豆原创 Size and Forecast (2020-2031)
9.3.6 India 麻豆原创 Size and Forecast (2020-2031)
9.3.7 Southeast Asia 麻豆原创 Size and Forecast (2020-2031)
9.3.8 Australia 麻豆原创 Size and Forecast (2020-2031)
10 South America
10.1 South America Wafer Slicing Equipment Sales Quantity by Type (2020-2031)
10.2 South America Wafer Slicing Equipment Sales Quantity by Application (2020-2031)
10.3 South America Wafer Slicing Equipment 麻豆原创 Size by Country
10.3.1 South America Wafer Slicing Equipment Sales Quantity by Country (2020-2031)
10.3.2 South America Wafer Slicing Equipment Consumption Value by Country (2020-2031)
10.3.3 Brazil 麻豆原创 Size and Forecast (2020-2031)
10.3.4 Argentina 麻豆原创 Size and Forecast (2020-2031)
11 Middle East & Africa
11.1 Middle East & Africa Wafer Slicing Equipment Sales Quantity by Type (2020-2031)
11.2 Middle East & Africa Wafer Slicing Equipment Sales Quantity by Application (2020-2031)
11.3 Middle East & Africa Wafer Slicing Equipment 麻豆原创 Size by Country
11.3.1 Middle East & Africa Wafer Slicing Equipment Sales Quantity by Country (2020-2031)
11.3.2 Middle East & Africa Wafer Slicing Equipment Consumption Value by Country (2020-2031)
11.3.3 Turkey 麻豆原创 Size and Forecast (2020-2031)
11.3.4 Egypt 麻豆原创 Size and Forecast (2020-2031)
11.3.5 Saudi Arabia 麻豆原创 Size and Forecast (2020-2031)
11.3.6 South Africa 麻豆原创 Size and Forecast (2020-2031)
12 麻豆原创 Dynamics
12.1 Wafer Slicing Equipment 麻豆原创 Drivers
12.2 Wafer Slicing Equipment 麻豆原创 Restraints
12.3 Wafer Slicing Equipment Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
13.1 Raw Material of Wafer Slicing Equipment and Key Manufacturers
13.2 Manufacturing Costs Percentage of Wafer Slicing Equipment
13.3 Wafer Slicing Equipment Production Process
13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Wafer Slicing Equipment Typical Distributors
14.3 Wafer Slicing Equipment Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
DISCO
Tokyo Seimitsu
GL Tech Co Ltd
ASM
Synova
CETC Electronics Equipment Group Co., Ltd.
Shenyang Heyan Technology Co., Ltd.
Jiangsu Jingchuang Advanced Electronic Technology Co., Ltd.
Hi-TESI
Tensun
听
听
*If Applicable.
