The global Through Glass Via (TGV) Wafer market size was valued at US$ 212 million in 2024 and is forecast to a readjusted size of USD 854 million by 2031 with a CAGR of 21.0% during review period.
Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV wafer.
United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.
This report is a detailed and comprehensive analysis for global Through Glass Via (TGV) Wafer market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2025, are provided.
Key Features:
Global Through Glass Via (TGV) Wafer market size and forecasts, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Through Glass Via (TGV) Wafer market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Through Glass Via (TGV) Wafer market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Pcs), and average selling prices (US$/Pcs), 2020-2031
Global Through Glass Via (TGV) Wafer market shares of main players, shipments in revenue ($ Million), sales quantity (K Pcs), and ASP (US$/Pcs), 2020-2025
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Through Glass Via (TGV) Wafer
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Through Glass Via (TGV) Wafer market based on the following parameters - company overview, sales quantity, revenue, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, Xiamen Sky Semiconductor Technology, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
麻豆原创 Segmentation
Through Glass Via (TGV) Wafer market is split by Type and by Application. For the period 2020-2031, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segment by Type
300 mm
200 mm
Below150 mm
麻豆原创 segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
Major players covered
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
Xiamen Sky Semiconductor Technology
麻豆原创 segment by region, regional analysis covers
North America (United States, Canada, and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Through Glass Via (TGV) Wafer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Through Glass Via (TGV) Wafer, with price, sales quantity, revenue, and global market share of Through Glass Via (TGV) Wafer from 2020 to 2025.
Chapter 3, the Through Glass Via (TGV) Wafer competitive situation, sales quantity, revenue, and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Through Glass Via (TGV) Wafer breakdown data are shown at the regional level, to show the sales quantity, consumption value, and growth by regions, from 2020 to 2031.
Chapter 5 and 6, to segment the sales by Type and by Application, with sales market share and growth rate by Type, by Application, from 2020 to 2031.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value, and market share for key countries in the world, from 2020 to 2025.and Through Glass Via (TGV) Wafer market forecast, by regions, by Type, and by Application, with sales and revenue, from 2026 to 2031.
Chapter 12, market dynamics, drivers, restraints, trends, and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Through Glass Via (TGV) Wafer.
Chapter 14 and 15, to describe Through Glass Via (TGV) Wafer sales channel, distributors, customers, research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 麻豆原创 Analysis by Type
1.3.1 Overview: Global Through Glass Via (TGV) Wafer Consumption Value by Type: 2020 Versus 2024 Versus 2031
1.3.2 300 mm
1.3.3 200 mm
1.3.4 Below150 mm
1.4 麻豆原创 Analysis by Application
1.4.1 Overview: Global Through Glass Via (TGV) Wafer Consumption Value by Application: 2020 Versus 2024 Versus 2031
1.4.2 Biotechnology/Medical
1.4.3 Consumer Electronics
1.4.4 Automotive
1.4.5 Others
1.5 Global Through Glass Via (TGV) Wafer 麻豆原创 Size & Forecast
1.5.1 Global Through Glass Via (TGV) Wafer Consumption Value (2020 & 2024 & 2031)
1.5.2 Global Through Glass Via (TGV) Wafer Sales Quantity (2020-2031)
1.5.3 Global Through Glass Via (TGV) Wafer Average Price (2020-2031)
2 Manufacturers Profiles
2.1 Corning
2.1.1 Corning Details
2.1.2 Corning Major Business
2.1.3 Corning Through Glass Via (TGV) Wafer Product and Services
2.1.4 Corning Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.1.5 Corning Recent Developments/Updates
2.2 LPKF
2.2.1 LPKF Details
2.2.2 LPKF Major Business
2.2.3 LPKF Through Glass Via (TGV) Wafer Product and Services
2.2.4 LPKF Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.2.5 LPKF Recent Developments/Updates
2.3 Samtec
2.3.1 Samtec Details
2.3.2 Samtec Major Business
2.3.3 Samtec Through Glass Via (TGV) Wafer Product and Services
2.3.4 Samtec Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.3.5 Samtec Recent Developments/Updates
2.4 Kiso Micro Co.LTD
2.4.1 Kiso Micro Co.LTD Details
2.4.2 Kiso Micro Co.LTD Major Business
2.4.3 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Product and Services
2.4.4 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.4.5 Kiso Micro Co.LTD Recent Developments/Updates
2.5 Tecnisco
2.5.1 Tecnisco Details
2.5.2 Tecnisco Major Business
2.5.3 Tecnisco Through Glass Via (TGV) Wafer Product and Services
2.5.4 Tecnisco Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.5.5 Tecnisco Recent Developments/Updates
2.6 Microplex
2.6.1 Microplex Details
2.6.2 Microplex Major Business
2.6.3 Microplex Through Glass Via (TGV) Wafer Product and Services
2.6.4 Microplex Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.6.5 Microplex Recent Developments/Updates
2.7 Plan Optik
2.7.1 Plan Optik Details
2.7.2 Plan Optik Major Business
2.7.3 Plan Optik Through Glass Via (TGV) Wafer Product and Services
2.7.4 Plan Optik Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.7.5 Plan Optik Recent Developments/Updates
2.8 NSG Group
2.8.1 NSG Group Details
2.8.2 NSG Group Major Business
2.8.3 NSG Group Through Glass Via (TGV) Wafer Product and Services
2.8.4 NSG Group Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.8.5 NSG Group Recent Developments/Updates
2.9 Allvia
2.9.1 Allvia Details
2.9.2 Allvia Major Business
2.9.3 Allvia Through Glass Via (TGV) Wafer Product and Services
2.9.4 Allvia Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.9.5 Allvia Recent Developments/Updates
2.10 Xiamen Sky Semiconductor Technology
2.10.1 Xiamen Sky Semiconductor Technology Details
2.10.2 Xiamen Sky Semiconductor Technology Major Business
2.10.3 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Product and Services
2.10.4 Xiamen Sky Semiconductor Technology Through Glass Via (TGV) Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2020-2025)
2.10.5 Xiamen Sky Semiconductor Technology Recent Developments/Updates
3 Competitive Environment: Through Glass Via (TGV) Wafer by Manufacturer
3.1 Global Through Glass Via (TGV) Wafer Sales Quantity by Manufacturer (2020-2025)
3.2 Global Through Glass Via (TGV) Wafer Revenue by Manufacturer (2020-2025)
3.3 Global Through Glass Via (TGV) Wafer Average Price by Manufacturer (2020-2025)
3.4 麻豆原创 Share Analysis (2024)
3.4.1 Producer Shipments of Through Glass Via (TGV) Wafer by Manufacturer Revenue ($MM) and 麻豆原创 Share (%): 2024
3.4.2 Top 3 Through Glass Via (TGV) Wafer Manufacturer 麻豆原创 Share in 2024
3.4.3 Top 6 Through Glass Via (TGV) Wafer Manufacturer 麻豆原创 Share in 2024
3.5 Through Glass Via (TGV) Wafer 麻豆原创: Overall Company Footprint Analysis
3.5.1 Through Glass Via (TGV) Wafer 麻豆原创: Region Footprint
3.5.2 Through Glass Via (TGV) Wafer 麻豆原创: Company Product Type Footprint
3.5.3 Through Glass Via (TGV) Wafer 麻豆原创: Company Product Application Footprint
3.6 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Size by Region
4.1.1 Global Through Glass Via (TGV) Wafer Sales Quantity by Region (2020-2031)
4.1.2 Global Through Glass Via (TGV) Wafer Consumption Value by Region (2020-2031)
4.1.3 Global Through Glass Via (TGV) Wafer Average Price by Region (2020-2031)
4.2 North America Through Glass Via (TGV) Wafer Consumption Value (2020-2031)
4.3 Europe Through Glass Via (TGV) Wafer Consumption Value (2020-2031)
4.4 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value (2020-2031)
4.5 South America Through Glass Via (TGV) Wafer Consumption Value (2020-2031)
4.6 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value (2020-2031)
5 麻豆原创 Segment by Type
5.1 Global Through Glass Via (TGV) Wafer Sales Quantity by Type (2020-2031)
5.2 Global Through Glass Via (TGV) Wafer Consumption Value by Type (2020-2031)
5.3 Global Through Glass Via (TGV) Wafer Average Price by Type (2020-2031)
6 麻豆原创 Segment by Application
6.1 Global Through Glass Via (TGV) Wafer Sales Quantity by Application (2020-2031)
6.2 Global Through Glass Via (TGV) Wafer Consumption Value by Application (2020-2031)
6.3 Global Through Glass Via (TGV) Wafer Average Price by Application (2020-2031)
7 North America
7.1 North America Through Glass Via (TGV) Wafer Sales Quantity by Type (2020-2031)
7.2 North America Through Glass Via (TGV) Wafer Sales Quantity by Application (2020-2031)
7.3 North America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
7.3.1 North America Through Glass Via (TGV) Wafer Sales Quantity by Country (2020-2031)
7.3.2 North America Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
7.3.3 United States 麻豆原创 Size and Forecast (2020-2031)
7.3.4 Canada 麻豆原创 Size and Forecast (2020-2031)
7.3.5 Mexico 麻豆原创 Size and Forecast (2020-2031)
8 Europe
8.1 Europe Through Glass Via (TGV) Wafer Sales Quantity by Type (2020-2031)
8.2 Europe Through Glass Via (TGV) Wafer Sales Quantity by Application (2020-2031)
8.3 Europe Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
8.3.1 Europe Through Glass Via (TGV) Wafer Sales Quantity by Country (2020-2031)
8.3.2 Europe Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
8.3.3 Germany 麻豆原创 Size and Forecast (2020-2031)
8.3.4 France 麻豆原创 Size and Forecast (2020-2031)
8.3.5 United Kingdom 麻豆原创 Size and Forecast (2020-2031)
8.3.6 Russia 麻豆原创 Size and Forecast (2020-2031)
8.3.7 Italy 麻豆原创 Size and Forecast (2020-2031)
9 Asia-Pacific
9.1 Asia-Pacific Through Glass Via (TGV) Wafer Sales Quantity by Type (2020-2031)
9.2 Asia-Pacific Through Glass Via (TGV) Wafer Sales Quantity by Application (2020-2031)
9.3 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Size by Region
9.3.1 Asia-Pacific Through Glass Via (TGV) Wafer Sales Quantity by Region (2020-2031)
9.3.2 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Region (2020-2031)
9.3.3 China 麻豆原创 Size and Forecast (2020-2031)
9.3.4 Japan 麻豆原创 Size and Forecast (2020-2031)
9.3.5 South Korea 麻豆原创 Size and Forecast (2020-2031)
9.3.6 India 麻豆原创 Size and Forecast (2020-2031)
9.3.7 Southeast Asia 麻豆原创 Size and Forecast (2020-2031)
9.3.8 Australia 麻豆原创 Size and Forecast (2020-2031)
10 South America
10.1 South America Through Glass Via (TGV) Wafer Sales Quantity by Type (2020-2031)
10.2 South America Through Glass Via (TGV) Wafer Sales Quantity by Application (2020-2031)
10.3 South America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
10.3.1 South America Through Glass Via (TGV) Wafer Sales Quantity by Country (2020-2031)
10.3.2 South America Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
10.3.3 Brazil 麻豆原创 Size and Forecast (2020-2031)
10.3.4 Argentina 麻豆原创 Size and Forecast (2020-2031)
11 Middle East & Africa
11.1 Middle East & Africa Through Glass Via (TGV) Wafer Sales Quantity by Type (2020-2031)
11.2 Middle East & Africa Through Glass Via (TGV) Wafer Sales Quantity by Application (2020-2031)
11.3 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
11.3.1 Middle East & Africa Through Glass Via (TGV) Wafer Sales Quantity by Country (2020-2031)
11.3.2 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Country (2020-2031)
11.3.3 Turkey 麻豆原创 Size and Forecast (2020-2031)
11.3.4 Egypt 麻豆原创 Size and Forecast (2020-2031)
11.3.5 Saudi Arabia 麻豆原创 Size and Forecast (2020-2031)
11.3.6 South Africa 麻豆原创 Size and Forecast (2020-2031)
12 麻豆原创 Dynamics
12.1 Through Glass Via (TGV) Wafer 麻豆原创 Drivers
12.2 Through Glass Via (TGV) Wafer 麻豆原创 Restraints
12.3 Through Glass Via (TGV) Wafer Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
13.1 Raw Material of Through Glass Via (TGV) Wafer and Key Manufacturers
13.2 Manufacturing Costs Percentage of Through Glass Via (TGV) Wafer
13.3 Through Glass Via (TGV) Wafer Production Process
13.4 Industry Value Chain Analysis
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Through Glass Via (TGV) Wafer Typical Distributors
14.3 Through Glass Via (TGV) Wafer Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
Xiamen Sky Semiconductor Technology
听
听
*If Applicable.
