Through glass vias substrate is a new glass substrate, which make holes through thin glass without damaging glass shape. A through-glass via (TGV) provides a vertical electrical connection through a glass substrate. TGVs are used in advanced packaging solutions, such as glass interposers and wafer-level packaging of microelectromechanical systems (MEMS). This report studies the TGV substrate (TGV wafer).
The global Through Glass Via (TGV) Wafer market size was valued at US$ 79.1 million in 2023 and is forecast to a readjusted size of USD 661 million by 2030 with a CAGR of 35.8% during review period.
United States is the largest Through Glass Via (TGV) Wafer market with about 46% market share. Europe is follower, accounting for about 25% market share.The global market share concentration is relatively concentrated. Of the major players of the Through Glass Via (TGV) Wafer market, Corning maintained its first place in the ranking. Corning accounted for 26% of the Global Through Glass Via (TGV) Wafer Production Value market share. Other players accounted for 21%, 11% including LPKF and Samtec. The other major players in this report including Kiso Micro Co. LTD, Tecnisco, Microplex, Plan Optik, NSG Group and Allvia.
This report is a detailed and comprehensive analysis for global Through Glass Via (TGV) Wafer market. Both quantitative and qualitative analyses are presented by company, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2024, are provided.
Key Features:
Global Through Glass Via (TGV) Wafer market size and forecasts, in consumption value ($ Million), 2019-2030
Global Through Glass Via (TGV) Wafer market size and forecasts by region and country, in consumption value ($ Million), 2019-2030
Global Through Glass Via (TGV) Wafer market size and forecasts, by Type and by Application, in consumption value ($ Million), 2019-2030
Global Through Glass Via (TGV) Wafer market shares of main players, in revenue ($ Million), 2019-2024
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Through Glass Via (TGV) Wafer
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace
This report profiles key players in the global Through Glass Via (TGV) Wafer market based on the following parameters - company overview, revenue, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include Corning, LPKF, Samtec, Kiso Micro Co.LTD, Tecnisco, Microplex, Plan Optik, NSG Group, Allvia, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals.
麻豆原创 segmentation
Through Glass Via (TGV) Wafer market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segmentation
Through Glass Via (TGV) Wafer market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for Consumption Value by Type and by Application. This analysis can help you expand your business by targeting qualified niche markets.
麻豆原创 segment by Type
300 mm
200 mm
Below150 mm
麻豆原创 segment by Application
Biotechnology/Medical
Consumer Electronics
Automotive
Others
麻豆原创 segment by players, this report covers
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
麻豆原创 segment by regions, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, UK, Russia, Italy and Rest of Europe)
Asia-Pacific (China, Japan, South Korea, India, Southeast Asia and Rest of Asia-Pacific)
South America (Brazil, Rest of South America)
Middle East & Africa (Turkey, Saudi Arabia, UAE, Rest of Middle East & Africa)
The content of the study subjects, includes a total of 13 chapters:
Chapter 1, to describe Through Glass Via (TGV) Wafer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top players of Through Glass Via (TGV) Wafer, with revenue, gross margin, and global market share of Through Glass Via (TGV) Wafer from 2019 to 2024.
Chapter 3, the Through Glass Via (TGV) Wafer competitive situation, revenue, and global market share of top players are analyzed emphatically by landscape contrast.
Chapter 4 and 5, to segment the market size by Type and by Application, with consumption value and growth rate by Type, by Application, from 2019 to 2030.
Chapter 6, 7, 8, 9, and 10, to break the market size data at the country level, with revenue and market share for key countries in the world, from 2019 to 2024.and Through Glass Via (TGV) Wafer market forecast, by regions, by Type and by Application, with consumption value, from 2024 to 2030.
Chapter 11, market dynamics, drivers, restraints, trends, Porters Five Forces analysis.
Chapter 12, the key raw materials and key suppliers, and industry chain of Through Glass Via (TGV) Wafer.
Chapter 13, to describe Through Glass Via (TGV) Wafer research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 Classification of Through Glass Via (TGV) Wafer by Type
1.3.1 Overview: Global Through Glass Via (TGV) Wafer 麻豆原创 Size by Type: 2019 Versus 2023 Versus 2030
1.3.2 Global Through Glass Via (TGV) Wafer Consumption Value 麻豆原创 Share by Type in 2023
1.3.3 300 mm
1.3.4 200 mm
1.3.5 Below150 mm
1.4 Global Through Glass Via (TGV) Wafer 麻豆原创 by Application
1.4.1 Overview: Global Through Glass Via (TGV) Wafer 麻豆原创 Size by Application: 2019 Versus 2023 Versus 2030
1.4.2 Biotechnology/Medical
1.4.3 Consumer Electronics
1.4.4 Automotive
1.4.5 Others
1.5 Global Through Glass Via (TGV) Wafer 麻豆原创 Size & Forecast
1.6 Global Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast by Region
1.6.1 Global Through Glass Via (TGV) Wafer 麻豆原创 Size by Region: 2019 VS 2023 VS 2030
1.6.2 Global Through Glass Via (TGV) Wafer 麻豆原创 Size by Region, (2019-2030)
1.6.3 North America Through Glass Via (TGV) Wafer 麻豆原创 Size and Prospect (2019-2030)
1.6.4 Europe Through Glass Via (TGV) Wafer 麻豆原创 Size and Prospect (2019-2030)
1.6.5 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Size and Prospect (2019-2030)
1.6.6 South America Through Glass Via (TGV) Wafer 麻豆原创 Size and Prospect (2019-2030)
1.6.7 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Size and Prospect (2019-2030)
2 Company Profiles
2.1 Corning
2.1.1 Corning Details
2.1.2 Corning Major Business
2.1.3 Corning Through Glass Via (TGV) Wafer Product and Solutions
2.1.4 Corning Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.1.5 Corning Recent Developments and Future Plans
2.2 LPKF
2.2.1 LPKF Details
2.2.2 LPKF Major Business
2.2.3 LPKF Through Glass Via (TGV) Wafer Product and Solutions
2.2.4 LPKF Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.2.5 LPKF Recent Developments and Future Plans
2.3 Samtec
2.3.1 Samtec Details
2.3.2 Samtec Major Business
2.3.3 Samtec Through Glass Via (TGV) Wafer Product and Solutions
2.3.4 Samtec Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.3.5 Samtec Recent Developments and Future Plans
2.4 Kiso Micro Co.LTD
2.4.1 Kiso Micro Co.LTD Details
2.4.2 Kiso Micro Co.LTD Major Business
2.4.3 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Product and Solutions
2.4.4 Kiso Micro Co.LTD Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.4.5 Kiso Micro Co.LTD Recent Developments and Future Plans
2.5 Tecnisco
2.5.1 Tecnisco Details
2.5.2 Tecnisco Major Business
2.5.3 Tecnisco Through Glass Via (TGV) Wafer Product and Solutions
2.5.4 Tecnisco Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.5.5 Tecnisco Recent Developments and Future Plans
2.6 Microplex
2.6.1 Microplex Details
2.6.2 Microplex Major Business
2.6.3 Microplex Through Glass Via (TGV) Wafer Product and Solutions
2.6.4 Microplex Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.6.5 Microplex Recent Developments and Future Plans
2.7 Plan Optik
2.7.1 Plan Optik Details
2.7.2 Plan Optik Major Business
2.7.3 Plan Optik Through Glass Via (TGV) Wafer Product and Solutions
2.7.4 Plan Optik Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.7.5 Plan Optik Recent Developments and Future Plans
2.8 NSG Group
2.8.1 NSG Group Details
2.8.2 NSG Group Major Business
2.8.3 NSG Group Through Glass Via (TGV) Wafer Product and Solutions
2.8.4 NSG Group Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.8.5 NSG Group Recent Developments and Future Plans
2.9 Allvia
2.9.1 Allvia Details
2.9.2 Allvia Major Business
2.9.3 Allvia Through Glass Via (TGV) Wafer Product and Solutions
2.9.4 Allvia Through Glass Via (TGV) Wafer Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.9.5 Allvia Recent Developments and Future Plans
3 麻豆原创 Competition, by Players
3.1 Global Through Glass Via (TGV) Wafer Revenue and Share by Players (2019-2024)
3.2 麻豆原创 Share Analysis (2023)
3.2.1 麻豆原创 Share of Through Glass Via (TGV) Wafer by Company Revenue
3.2.2 Top 3 Through Glass Via (TGV) Wafer Players 麻豆原创 Share in 2023
3.2.3 Top 6 Through Glass Via (TGV) Wafer Players 麻豆原创 Share in 2023
3.3 Through Glass Via (TGV) Wafer 麻豆原创: Overall Company Footprint Analysis
3.3.1 Through Glass Via (TGV) Wafer 麻豆原创: Region Footprint
3.3.2 Through Glass Via (TGV) Wafer 麻豆原创: Company Product Type Footprint
3.3.3 Through Glass Via (TGV) Wafer 麻豆原创: Company Product Application Footprint
3.4 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.5 Mergers, Acquisition, Agreements, and Collaborations
4 麻豆原创 Size Segment by Type
4.1 Global Through Glass Via (TGV) Wafer Consumption Value and 麻豆原创 Share by Type (2019-2024)
4.2 Global Through Glass Via (TGV) Wafer 麻豆原创 Forecast by Type (2025-2030)
5 麻豆原创 Size Segment by Application
5.1 Global Through Glass Via (TGV) Wafer Consumption Value 麻豆原创 Share by Application (2019-2024)
5.2 Global Through Glass Via (TGV) Wafer 麻豆原创 Forecast by Application (2025-2030)
6 North America
6.1 North America Through Glass Via (TGV) Wafer Consumption Value by Type (2019-2030)
6.2 North America Through Glass Via (TGV) Wafer 麻豆原创 Size by Application (2019-2030)
6.3 North America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
6.3.1 North America Through Glass Via (TGV) Wafer Consumption Value by Country (2019-2030)
6.3.2 United States Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
6.3.3 Canada Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
6.3.4 Mexico Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
7 Europe
7.1 Europe Through Glass Via (TGV) Wafer Consumption Value by Type (2019-2030)
7.2 Europe Through Glass Via (TGV) Wafer Consumption Value by Application (2019-2030)
7.3 Europe Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
7.3.1 Europe Through Glass Via (TGV) Wafer Consumption Value by Country (2019-2030)
7.3.2 Germany Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
7.3.3 France Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
7.3.4 United Kingdom Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
7.3.5 Russia Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
7.3.6 Italy Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
8 Asia-Pacific
8.1 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Type (2019-2030)
8.2 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Application (2019-2030)
8.3 Asia-Pacific Through Glass Via (TGV) Wafer 麻豆原创 Size by Region
8.3.1 Asia-Pacific Through Glass Via (TGV) Wafer Consumption Value by Region (2019-2030)
8.3.2 China Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
8.3.3 Japan Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
8.3.4 South Korea Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
8.3.5 India Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
8.3.6 Southeast Asia Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
8.3.7 Australia Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
9 South America
9.1 South America Through Glass Via (TGV) Wafer Consumption Value by Type (2019-2030)
9.2 South America Through Glass Via (TGV) Wafer Consumption Value by Application (2019-2030)
9.3 South America Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
9.3.1 South America Through Glass Via (TGV) Wafer Consumption Value by Country (2019-2030)
9.3.2 Brazil Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
9.3.3 Argentina Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
10 Middle East & Africa
10.1 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Type (2019-2030)
10.2 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Application (2019-2030)
10.3 Middle East & Africa Through Glass Via (TGV) Wafer 麻豆原创 Size by Country
10.3.1 Middle East & Africa Through Glass Via (TGV) Wafer Consumption Value by Country (2019-2030)
10.3.2 Turkey Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
10.3.3 Saudi Arabia Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
10.3.4 UAE Through Glass Via (TGV) Wafer 麻豆原创 Size and Forecast (2019-2030)
11 麻豆原创 Dynamics
11.1 Through Glass Via (TGV) Wafer 麻豆原创 Drivers
11.2 Through Glass Via (TGV) Wafer 麻豆原创 Restraints
11.3 Through Glass Via (TGV) Wafer Trends Analysis
11.4 Porters Five Forces Analysis
11.4.1 Threat of New Entrants
11.4.2 Bargaining Power of Suppliers
11.4.3 Bargaining Power of Buyers
11.4.4 Threat of Substitutes
11.4.5 Competitive Rivalry
12 Industry Chain Analysis
12.1 Through Glass Via (TGV) Wafer Industry Chain
12.2 Through Glass Via (TGV) Wafer Upstream Analysis
12.3 Through Glass Via (TGV) Wafer Midstream Analysis
12.4 Through Glass Via (TGV) Wafer Downstream Analysis
13 Research Findings and Conclusion
14 Appendix
14.1 Methodology
14.2 Research Process and Data Source
14.3 Disclaimer
Corning
LPKF
Samtec
Kiso Micro Co.LTD
Tecnisco
Microplex
Plan Optik
NSG Group
Allvia
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*If Applicable.
