The global Tape for Wafer market size was valued at USD 499 million in 2023 and is forecast to a readjusted size of USD 670.4 million by 2030 with a CAGR of 4.3% during review period.
Tape for wafer processing.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
This report includes an overview of the development of the Tape for Wafer industry chain, the market status of Wafer Gicing (Polyolefin (PO), Polyvinyl Chloride (PVC)), Back grinding (Polyolefin (PO), Polyvinyl Chloride (PVC)), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Tape for Wafer.
Regionally, the report analyzes the Tape for Wafer markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Tape for Wafer market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Tape for Wafer market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Tape for Wafer industry.
The report involves analyzing the market at a macro level:
麻豆原创 Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (K Units), revenue generated, and market share of different by Type (e.g., Polyolefin (PO), Polyvinyl Chloride (PVC)).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Tape for Wafer market.
Regional Analysis: The report involves examining the Tape for Wafer market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
麻豆原创 Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Tape for Wafer market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Tape for Wafer:
Company Analysis: Report covers individual Tape for Wafer manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Tape for Wafer This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Wafer Gicing, Back grinding).
Technology Analysis: Report covers specific technologies relevant to Tape for Wafer. It assesses the current state, advancements, and potential future developments in Tape for Wafer areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Tape for Wafer market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
麻豆原创 Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
麻豆原创 Segmentation
Tape for Wafer market is split by Type and by Application. For the period 2019-2030, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
麻豆原创 segment by Type
Polyolefin (PO)
Polyvinyl Chloride (PVC)
Polyethylene Terephthalate (PET)
Other
麻豆原创 segment by Application
Wafer Gicing
Back grinding
Others
Major players covered
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Semiconductor Equipment Corporation
麻豆原创 segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Tape for Wafer product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Tape for Wafer, with price, sales, revenue and global market share of Tape for Wafer from 2019 to 2024.
Chapter 3, the Tape for Wafer competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Tape for Wafer breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2019 to 2030.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2019 to 2030.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2023.and Tape for Wafer market forecast, by regions, type and application, with sales and revenue, from 2025 to 2030.
Chapter 12, market dynamics, drivers, restraints, trends and Porters Five Forces analysis.
Chapter 13, the key raw materials and key suppliers, and industry chain of Tape for Wafer.
Chapter 14 and 15, to describe Tape for Wafer sales channel, distributors, customers, research findings and conclusion.
Please Note - This is an on demand report and will be delivered in 2 business days (48 Hours) post payment.
1 麻豆原创 Overview
1.1 Product Overview and Scope of Tape for Wafer
1.2 麻豆原创 Estimation Caveats and Base Year
1.3 麻豆原创 Analysis by Type
1.3.1 Overview: Global Tape for Wafer Consumption Value by Type: 2019 Versus 2023 Versus 2030
1.3.2 Polyolefin (PO)
1.3.3 Polyvinyl Chloride (PVC)
1.3.4 Polyethylene Terephthalate (PET)
1.3.5 Other
1.4 麻豆原创 Analysis by Application
1.4.1 Overview: Global Tape for Wafer Consumption Value by Application: 2019 Versus 2023 Versus 2030
1.4.2 Wafer Gicing
1.4.3 Back grinding
1.4.4 Others
1.5 Global Tape for Wafer 麻豆原创 Size & Forecast
1.5.1 Global Tape for Wafer Consumption Value (2019 & 2023 & 2030)
1.5.2 Global Tape for Wafer Sales Quantity (2019-2030)
1.5.3 Global Tape for Wafer Average Price (2019-2030)
2 Manufacturers Profiles
2.1 Furukawa
2.1.1 Furukawa Details
2.1.2 Furukawa Major Business
2.1.3 Furukawa Tape for Wafer Product and Services
2.1.4 Furukawa Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.1.5 Furukawa Recent Developments/Updates
2.2 Nitto Denko
2.2.1 Nitto Denko Details
2.2.2 Nitto Denko Major Business
2.2.3 Nitto Denko Tape for Wafer Product and Services
2.2.4 Nitto Denko Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.2.5 Nitto Denko Recent Developments/Updates
2.3 Mitsui Corporation
2.3.1 Mitsui Corporation Details
2.3.2 Mitsui Corporation Major Business
2.3.3 Mitsui Corporation Tape for Wafer Product and Services
2.3.4 Mitsui Corporation Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.3.5 Mitsui Corporation Recent Developments/Updates
2.4 Lintec Corporation
2.4.1 Lintec Corporation Details
2.4.2 Lintec Corporation Major Business
2.4.3 Lintec Corporation Tape for Wafer Product and Services
2.4.4 Lintec Corporation Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.4.5 Lintec Corporation Recent Developments/Updates
2.5 Sumitomo Bakelite
2.5.1 Sumitomo Bakelite Details
2.5.2 Sumitomo Bakelite Major Business
2.5.3 Sumitomo Bakelite Tape for Wafer Product and Services
2.5.4 Sumitomo Bakelite Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.5.5 Sumitomo Bakelite Recent Developments/Updates
2.6 Denka Company
2.6.1 Denka Company Details
2.6.2 Denka Company Major Business
2.6.3 Denka Company Tape for Wafer Product and Services
2.6.4 Denka Company Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.6.5 Denka Company Recent Developments/Updates
2.7 Pantech Tape
2.7.1 Pantech Tape Details
2.7.2 Pantech Tape Major Business
2.7.3 Pantech Tape Tape for Wafer Product and Services
2.7.4 Pantech Tape Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.7.5 Pantech Tape Recent Developments/Updates
2.8 Ultron Systems
2.8.1 Ultron Systems Details
2.8.2 Ultron Systems Major Business
2.8.3 Ultron Systems Tape for Wafer Product and Services
2.8.4 Ultron Systems Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.8.5 Ultron Systems Recent Developments/Updates
2.9 NEPTCO
2.9.1 NEPTCO Details
2.9.2 NEPTCO Major Business
2.9.3 NEPTCO Tape for Wafer Product and Services
2.9.4 NEPTCO Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.9.5 NEPTCO Recent Developments/Updates
2.10 Nippon Pulse Motor
2.10.1 Nippon Pulse Motor Details
2.10.2 Nippon Pulse Motor Major Business
2.10.3 Nippon Pulse Motor Tape for Wafer Product and Services
2.10.4 Nippon Pulse Motor Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.10.5 Nippon Pulse Motor Recent Developments/Updates
2.11 Loadpoint Limited
2.11.1 Loadpoint Limited Details
2.11.2 Loadpoint Limited Major Business
2.11.3 Loadpoint Limited Tape for Wafer Product and Services
2.11.4 Loadpoint Limited Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.11.5 Loadpoint Limited Recent Developments/Updates
2.12 AI Technology
2.12.1 AI Technology Details
2.12.2 AI Technology Major Business
2.12.3 AI Technology Tape for Wafer Product and Services
2.12.4 AI Technology Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.12.5 AI Technology Recent Developments/Updates
2.13 Minitron Electronic
2.13.1 Minitron Electronic Details
2.13.2 Minitron Electronic Major Business
2.13.3 Minitron Electronic Tape for Wafer Product and Services
2.13.4 Minitron Electronic Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.13.5 Minitron Electronic Recent Developments/Updates
2.14 Semiconductor Equipment Corporation
2.14.1 Semiconductor Equipment Corporation Details
2.14.2 Semiconductor Equipment Corporation Major Business
2.14.3 Semiconductor Equipment Corporation Tape for Wafer Product and Services
2.14.4 Semiconductor Equipment Corporation Tape for Wafer Sales Quantity, Average Price, Revenue, Gross Margin and 麻豆原创 Share (2019-2024)
2.14.5 Semiconductor Equipment Corporation Recent Developments/Updates
3 Competitive Environment: Tape for Wafer by Manufacturer
3.1 Global Tape for Wafer Sales Quantity by Manufacturer (2019-2024)
3.2 Global Tape for Wafer Revenue by Manufacturer (2019-2024)
3.3 Global Tape for Wafer Average Price by Manufacturer (2019-2024)
3.4 麻豆原创 Share Analysis (2023)
3.4.1 Producer Shipments of Tape for Wafer by Manufacturer Revenue ($MM) and 麻豆原创 Share (%): 2023
3.4.2 Top 3 Tape for Wafer Manufacturer 麻豆原创 Share in 2023
3.4.2 Top 6 Tape for Wafer Manufacturer 麻豆原创 Share in 2023
3.5 Tape for Wafer 麻豆原创: Overall Company Footprint Analysis
3.5.1 Tape for Wafer 麻豆原创: Region Footprint
3.5.2 Tape for Wafer 麻豆原创: Company Product Type Footprint
3.5.3 Tape for Wafer 麻豆原创: Company Product Application Footprint
3.6 New 麻豆原创 Entrants and Barriers to 麻豆原创 Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Tape for Wafer 麻豆原创 Size by Region
4.1.1 Global Tape for Wafer Sales Quantity by Region (2019-2030)
4.1.2 Global Tape for Wafer Consumption Value by Region (2019-2030)
4.1.3 Global Tape for Wafer Average Price by Region (2019-2030)
4.2 North America Tape for Wafer Consumption Value (2019-2030)
4.3 Europe Tape for Wafer Consumption Value (2019-2030)
4.4 Asia-Pacific Tape for Wafer Consumption Value (2019-2030)
4.5 South America Tape for Wafer Consumption Value (2019-2030)
4.6 Middle East and Africa Tape for Wafer Consumption Value (2019-2030)
5 麻豆原创 Segment by Type
5.1 Global Tape for Wafer Sales Quantity by Type (2019-2030)
5.2 Global Tape for Wafer Consumption Value by Type (2019-2030)
5.3 Global Tape for Wafer Average Price by Type (2019-2030)
6 麻豆原创 Segment by Application
6.1 Global Tape for Wafer Sales Quantity by Application (2019-2030)
6.2 Global Tape for Wafer Consumption Value by Application (2019-2030)
6.3 Global Tape for Wafer Average Price by Application (2019-2030)
7 North America
7.1 North America Tape for Wafer Sales Quantity by Type (2019-2030)
7.2 North America Tape for Wafer Sales Quantity by Application (2019-2030)
7.3 North America Tape for Wafer 麻豆原创 Size by Country
7.3.1 North America Tape for Wafer Sales Quantity by Country (2019-2030)
7.3.2 North America Tape for Wafer Consumption Value by Country (2019-2030)
7.3.3 United States 麻豆原创 Size and Forecast (2019-2030)
7.3.4 Canada 麻豆原创 Size and Forecast (2019-2030)
7.3.5 Mexico 麻豆原创 Size and Forecast (2019-2030)
8 Europe
8.1 Europe Tape for Wafer Sales Quantity by Type (2019-2030)
8.2 Europe Tape for Wafer Sales Quantity by Application (2019-2030)
8.3 Europe Tape for Wafer 麻豆原创 Size by Country
8.3.1 Europe Tape for Wafer Sales Quantity by Country (2019-2030)
8.3.2 Europe Tape for Wafer Consumption Value by Country (2019-2030)
8.3.3 Germany 麻豆原创 Size and Forecast (2019-2030)
8.3.4 France 麻豆原创 Size and Forecast (2019-2030)
8.3.5 United Kingdom 麻豆原创 Size and Forecast (2019-2030)
8.3.6 Russia 麻豆原创 Size and Forecast (2019-2030)
8.3.7 Italy 麻豆原创 Size and Forecast (2019-2030)
9 Asia-Pacific
9.1 Asia-Pacific Tape for Wafer Sales Quantity by Type (2019-2030)
9.2 Asia-Pacific Tape for Wafer Sales Quantity by Application (2019-2030)
9.3 Asia-Pacific Tape for Wafer 麻豆原创 Size by Region
9.3.1 Asia-Pacific Tape for Wafer Sales Quantity by Region (2019-2030)
9.3.2 Asia-Pacific Tape for Wafer Consumption Value by Region (2019-2030)
9.3.3 China 麻豆原创 Size and Forecast (2019-2030)
9.3.4 Japan 麻豆原创 Size and Forecast (2019-2030)
9.3.5 Korea 麻豆原创 Size and Forecast (2019-2030)
9.3.6 India 麻豆原创 Size and Forecast (2019-2030)
9.3.7 Southeast Asia 麻豆原创 Size and Forecast (2019-2030)
9.3.8 Australia 麻豆原创 Size and Forecast (2019-2030)
10 South America
10.1 South America Tape for Wafer Sales Quantity by Type (2019-2030)
10.2 South America Tape for Wafer Sales Quantity by Application (2019-2030)
10.3 South America Tape for Wafer 麻豆原创 Size by Country
10.3.1 South America Tape for Wafer Sales Quantity by Country (2019-2030)
10.3.2 South America Tape for Wafer Consumption Value by Country (2019-2030)
10.3.3 Brazil 麻豆原创 Size and Forecast (2019-2030)
10.3.4 Argentina 麻豆原创 Size and Forecast (2019-2030)
11 Middle East & Africa
11.1 Middle East & Africa Tape for Wafer Sales Quantity by Type (2019-2030)
11.2 Middle East & Africa Tape for Wafer Sales Quantity by Application (2019-2030)
11.3 Middle East & Africa Tape for Wafer 麻豆原创 Size by Country
11.3.1 Middle East & Africa Tape for Wafer Sales Quantity by Country (2019-2030)
11.3.2 Middle East & Africa Tape for Wafer Consumption Value by Country (2019-2030)
11.3.3 Turkey 麻豆原创 Size and Forecast (2019-2030)
11.3.4 Egypt 麻豆原创 Size and Forecast (2019-2030)
11.3.5 Saudi Arabia 麻豆原创 Size and Forecast (2019-2030)
11.3.6 South Africa 麻豆原创 Size and Forecast (2019-2030)
12 麻豆原创 Dynamics
12.1 Tape for Wafer 麻豆原创 Drivers
12.2 Tape for Wafer 麻豆原创 Restraints
12.3 Tape for Wafer Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
13 Raw Material and Industry Chain
13.1 Raw Material of Tape for Wafer and Key Manufacturers
13.2 Manufacturing Costs Percentage of Tape for Wafer
13.3 Tape for Wafer Production Process
13.4 Tape for Wafer Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Tape for Wafer Typical Distributors
14.3 Tape for Wafer Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
Furukawa
Nitto Denko
Mitsui Corporation
Lintec Corporation
Sumitomo Bakelite
Denka Company
Pantech Tape
Ultron Systems
NEPTCO
Nippon Pulse Motor
Loadpoint Limited
AI Technology
Minitron Electronic
Semiconductor Equipment Corporation
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*If Applicable.
